Datasheet

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PACKAGE OUTLINE
C
10X
0.30
0.18
2.4 0.1
2X
2
1.65 0.1
8X 0.5
1.0
0.8
10X
0.5
0.3
0.05
0.00
A
3.1
2.9
B
3.1
2.9
(0.2) TYP
4X (0.25)
2X (0.5)
VSON - 1 mm max heightDRC0010J
PLASTIC SMALL OUTLINE - NO LEAD
4218878/B 07/2018
PIN 1 INDEX AREA
SEATING PLANE
0.08 C
1
5
6
10
(OPTIONAL)
PIN 1 ID
0.1 C A B
0.05
C
THERMAL PAD
EXPOSED
SYMM
SYMM
11
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.
SCALE 4.000