Datasheet

1
2
3
4
10
9
8
7
GND
(Thermal
Pad)
SCL
SDA
A1
A0
OUT1
VCC
ISENSE
OUT2
5
6
FAULTn
GND
DRV8830
www.ti.com SLVSAB2G –MAY 2010–REVISED DECEMBER 2015
5 Pin Configuration and Functions
DGQ or DRC Package
10-Pin HVSSOP or VSON
Top View
The HVSSOP package has a PowerPAD.
Pin Functions
PIN
EXTERNAL COMPONENTS
TYPE
(1)
DESCRIPTION
OR CONNECTIONS
NAME NO.
A0 7 I Address set 0
Connect to GND, VCC, or open to set I
2
C
base address. See serial interface description.
A1 8 I Address set 1
Open-drain output driven low if fault condition
FAULTn 6 OD Fault output
present
GND 5 — Device ground
Connect current sense resistor to GND.
ISENSE 2 IO Current sense resistor
Resistor value sets current limit level.
OUT1 3 O Bridge output 1
Connect to motor winding
OUT2 1 O Bridge output 2
SCL 10 I Serial clock Clock line of I
2
C serial bus
SDA 9 IO Serial data Data line of I
2
C serial bus
Bypass to GND with a 0.1-μF (minimum)
VCC 4 — Device and motor supply
ceramic capacitor.
(1) Directions: I = input, O = output, OZ = tri-state output, OD = open-drain output, IO = input/output
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)(2)
MIN MAX UNIT
VCC Power supply voltage –0.3 7 V
Input pin voltage –0.5 7 V
Peak motor drive output current
(3)
Internally limited A
Continuous motor drive output current
(3)
–1 1 A
Continuous total power dissipation See Thermal Information
T
J
Operating virtual junction temperature –40 150 °C
T
stg
Storage temperature –60 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) Power dissipation and thermal limits must be observed.
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