Datasheet

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PACKAGE OUTLINE
C
TYP
5.05
4.75
1.1 MAX
8X 0.5
10X
0.27
0.17
2X
2
TYP
0.23
0.13
0 - 8
0.15
0.05
1.83
1.63
2.1
1.9
0.25
GAGE PLANE
0.7
0.4
A
NOTE 3
3.1
2.9
B
3.1
2.9
4221816/A 08/2015
PowerPAD - 1.1 mm max heightDGQ0010E
PLASTIC SMALL OUTLINE
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-187, variation BA-T.
PowerPAD is a trademark of Texas Instruments.
TM
1
10
0.08 C A B
6
5
PIN 1 ID
AREA
NOTE 4
SEATING PLANE
0.1 C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 3.700
EXPOSED
THERMAL PAD
4
1
5
8