Datasheet

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EXAMPLE BOARD LAYOUT
(4.4)
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
10X (1.45)
10X (0.3)
8X (0.5)
(2.2)
NOTE 9
(3.1)
NOTE 9
(1.83)
(2.1)
SOLDER MASK
OPENING
( ) TYP
VIA
0.2
(1.3) TYP
(1.3)
TYP
(R ) TYP0.05
4221816/A 08/2015
PowerPAD - 1.1 mm max heightDGQ0010E
PLASTIC SMALL OUTLINE
SYMM
SYMM
SEE DETAILS
LAND PATTERN EXAMPLE
SCALE:15X
1
5
6
10
SOLDER MASK
OPENING
METAL COVERED
BY SOLDER MASK
SOLDER MASK
DEFINED PAD
TM
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
numbers SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Size of metal pad may vary due to creepage requirement.
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED