Datasheet
Table Of Contents
- 1 Features
- 2 Applications
- 3 Description
- Table of Contents
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10 Layout
- 11 Device and Documentation Support
- 12 Mechanical, Packaging, and Orderable Information
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EXAMPLE STENCIL DESIGN
10X (1.45)
10X (0.3)
8X (0.5)
(4.4)
(1.83)
(2.1)
BASED ON
0.125 THICK
STENCIL
(R ) TYP0.05
4221816/A 08/2015
PowerPAD - 1.1 mm max heightDGQ0010E
PLASTIC SMALL OUTLINE
1.55 X 1.770.175
1.67 X 1.920.150
1.83 X 2.1 (SHOWN)0.125
2.05 X 2.350.1
SOLDER STENCIL
OPENING
STENCIL
THICKNESS
NOTES: (continued)
10. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
11. Board assembly site may have different recommendations for stencil design.
TM
SOLDER PASTE EXAMPLE
EXPOSED PAD
100% PRINTED SOLDER COVERAGE BY AREA
SCALE:15X
SYMM
SYMM
1
5
6
10
BASED ON
0.125 THICK
STENCIL
BY SOLDER MASK
METAL COVERED
SEE TABLE FOR
DIFFERENT OPENINGS
FOR OTHER STENCIL
THICKNESSES