Datasheet

DRV8830
SLVSAB2G –MAY 2010–REVISED DECEMBER 2015 www.ti.com
6.2 ESD Ratings
VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
Electrostatic
V
(ESD)
V
discharge
Charged-device model (CDM), per JEDEC specification JESD22-C101
(2)
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Motor power supply voltage 2.75 6.8 V
I
OUT
Continuous or peak H-bridge output current
(1)
0 1 A
(1) Power dissipation and thermal limits must be observed.
6.4 Thermal Information
DRV8830
THERMAL METRIC
(1)
DGQ (HVSSOP) DRC (VSON) UNIT
10 PINS 10 PINS
R
θJA
Junction-to-ambient thermal resistance 69.3 50.2 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 63.5 78.4 °C/W
R
θJB
Junction-to-board thermal resistance 51.6 18.8 °C/W
ψ
JT
Junction-to-top characterization parameter 1.5 1.1 °C/W
ψ
JB
Junction-to-board characterization parameter 23.2 17.9 °C/W
R
θJB
Junction-to-case (bottom) thermal resistance 9.5 5.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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