Datasheet ADS1015
Table Of Contents
- 1 Features
- 2 Applications
- 3 Description
- Table of Contents
- 4 Revision History
- 5 Device Comparison Table
- 6 Pin Configuration and Functions
- 7 Specifications
- 8 Detailed Description
- 9 Application and Implementation
- 9.1 Application Information
- 9.2 Typical Application
- 9.2.1 Design Requirements
- 9.2.2 Detailed Design Procedure
- 9.2.2.1 Shunt Resistor Considerations
- 9.2.2.2 Operational Amplifier Considerations
- 9.2.2.3 ADC Input Common-Mode Considerations
- 9.2.2.4 Resistor (R1, R2, R3, R4) Considerations
- 9.2.2.5 Noise and Input Impedance Considerations
- 9.2.2.6 First-order RC Filter Considerations
- 9.2.2.7 Circuit Implementation
- 9.2.2.8 Results Summary
- 9.2.3 Application Curves
- 10 Power Supply Recommendations
- 11 Layout
- 12 Device and Documentation Support
- 13 Mechanical, Packaging, and Orderable Information
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PACKAGE OUTLINE
C
TYP
5.05
4.75
1.1 MAX
8X 0.5
10X
0.27
0.17
2X
2
0.15
0.05
TYP
0.23
0.13
0 - 8
0.25
GAGE PLANE
0.7
0.4
A
NOTE 3
3.1
2.9
B
NOTE 4
3.1
2.9
4221984/A 05/2015
VSSOP - 1.1 mm max heightDGS0010A
SMALL OUTLINE PACKAGE
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-187, variation BA.
1
10
0.1 C A B
6
5
PIN 1 ID
AREA
SEATING PLANE
0.1 C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 3.200