Datasheet ADS1015
Table Of Contents
- 1 Features
- 2 Applications
- 3 Description
- Table of Contents
- 4 Revision History
- 5 Device Comparison Table
- 6 Pin Configuration and Functions
- 7 Specifications
- 8 Detailed Description
- 9 Application and Implementation
- 9.1 Application Information
- 9.2 Typical Application
- 9.2.1 Design Requirements
- 9.2.2 Detailed Design Procedure
- 9.2.2.1 Shunt Resistor Considerations
- 9.2.2.2 Operational Amplifier Considerations
- 9.2.2.3 ADC Input Common-Mode Considerations
- 9.2.2.4 Resistor (R1, R2, R3, R4) Considerations
- 9.2.2.5 Noise and Input Impedance Considerations
- 9.2.2.6 First-order RC Filter Considerations
- 9.2.2.7 Circuit Implementation
- 9.2.2.8 Results Summary
- 9.2.3 Application Curves
- 10 Power Supply Recommendations
- 11 Layout
- 12 Device and Documentation Support
- 13 Mechanical, Packaging, and Orderable Information
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EXAMPLE BOARD LAYOUT
(4.4)
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
10X (1.45)
10X (0.3)
8X (0.5)
(R )
TYP
0.05
4221984/A 05/2015
VSSOP - 1.1 mm max heightDGS0010A
SMALL OUTLINE PACKAGE
SYMM
SYMM
LAND PATTERN EXAMPLE
SCALE:10X
1
5
6
10
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED