Datasheet ADS1015
Table Of Contents
- 1 Features
- 2 Applications
- 3 Description
- Table of Contents
- 4 Revision History
- 5 Device Comparison Table
- 6 Pin Configuration and Functions
- 7 Specifications
- 8 Detailed Description
- 9 Application and Implementation
- 9.1 Application Information
- 9.2 Typical Application
- 9.2.1 Design Requirements
- 9.2.2 Detailed Design Procedure
- 9.2.2.1 Shunt Resistor Considerations
- 9.2.2.2 Operational Amplifier Considerations
- 9.2.2.3 ADC Input Common-Mode Considerations
- 9.2.2.4 Resistor (R1, R2, R3, R4) Considerations
- 9.2.2.5 Noise and Input Impedance Considerations
- 9.2.2.6 First-order RC Filter Considerations
- 9.2.2.7 Circuit Implementation
- 9.2.2.8 Results Summary
- 9.2.3 Application Curves
- 10 Power Supply Recommendations
- 11 Layout
- 12 Device and Documentation Support
- 13 Mechanical, Packaging, and Orderable Information
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EXAMPLE STENCIL DESIGN
(4.4)
8X (0.5)
10X (0.3)
10X (1.45)
(R ) TYP0.05
4221984/A 05/2015
VSSOP - 1.1 mm max heightDGS0010A
SMALL OUTLINE PACKAGE
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SYMM
SYMM
1
5
6
10
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:10X