User guide

Recommended Processing Parameters
Figure 11: Lead Free Reflow Profile
Table 14 Recommended Processing Parameters
a
Reflow Parameter Temperature (°C) Time (sec)
Preheat Temperature (T
Smin
to T
Smax
) 150°C – 200°C 60-180
Temperature T
L
(typical solder melting point) >218°C
T
Smax
to T
L
Ramp-up Rate 3°C/second max
Peak Temperature T
P
260°C
Time 25°C to Peak T
P
6 minute max
Time Maintained Above Temperature T
L
(t
L
) 218°C 60-120
Soak (time within 5° of actual Peak T
P
) 10-20
Ramp-down Rate 4°C/second max
a. Meets lead-free profile recommendations (IPC/JEDEC J-STD-020)
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