Manual

PNI Sensor Corporation Doc 1017252 r03
RM3100 & RM2100 Sensor Suite User Manual Page 14 of 45
Figure 3-9: Recommended Solder Reflow Profile
Table 3-6: Recommended Solder Processing Parameters
1
Parameter
Symbol
Value
Preheat Temperature, Minimum
T
Smin
150°C
Preheat Temperature, Maximum
T
Smax
200°C
Preheat Time (T
Smin
to T
Smax
)
60 – 180 seconds
Solder Melt Temperature
T
L
>218°C
Ramp-Up Rate (T
Smax
to T
L
)
3°C/second maximum
Peak Temperature
T
P
<260°C
Time from 25°C to Peak (T
P
)
6 minutes maximum
Time above T
L
t
L
60 – 120 seconds
Soak Time (within 5°C of T
P
)
t
P
10 – 20 seconds
Rampdown Rate
4°C/second maximum
Footnote:
1. Meets IPC/JEDEC J-STD-020 profile recommendations. Sen-XY-f and Sen-
Z-f classified as moisture sensitivity level 1. MagI2C MLF classified as
moisture sensitivity level 3.
PB