Datasheet

WWW.PRECIDIP.COM TEL +41 32 421 04 00 SALES@PRECIDIP.COM
DIL SOCKETS
GENERAL SPECIFICATIONS
127
Due to technical progress, all information provided is subject to change without prior notice.
The values listed below are general specs applying for Preci-Dip DIL sockets. Please see individual catalog page for additional and product
specific technical data.
OPERATING TEMPERATURE RANGE -55 ... +125 °C
CLIMATIC CATEGORY (IEC) 55/125/21
OPERATING HUMIDITY RANGE Annual mean 75%
MAX. WORKING VOLTAGE 100 VRMS/150 VDC
Preci-Dip sockets are recognized by Underwriters Laboratories Inc. and listed under “Connectors for Use in Data, Signal, Control and
Power Applications“, File Nr. E174442.
PACKAGING
Standard packaging for DIL sockets is tube
packaging.
SMD mount sockets available on request
with Tape & Reel packaging acc. to EIA Standard 481.
These products are marked with the symbol:
Please consult www.precidip.com for availability,
size of tape, size of reel, number of components
per reel and packing units.
MECHANICAL CHARACTERISTICS
CLIP RETENTION Min. 40 N (no displacement under axial force applied)
CONTACT (SLEEVE / CLIP) RETENTION Min. 3.3 N acc. to MIL-DTL-83734, pt 4.6.4.2
ELECTRICAL CHARACTERISTICS
INSULATION RESISTANCE AT 500 V AC BETWEEN ANY TWO ADJACENT CONTACTS Min. 10’000 MΩ
CAPACITANCE BETWEEN ANY TWO ADJACENT CONTACTS Max. 1 pF
AIR AND CREEPAGE DISTANCES BETWEEN ANY TWO ADJACENT CONTACTS
(Min. 0.2 mm FOR SHRINK-DIP SOCKETS)
Min. 0.6 mm
ENVIRONMENTAL CHARACTERISTICS
The sockets withstand the following environmental tests without mechanical
and electrical defects:
• Dry heat steady state IEC 60512-11-9.11i / 60068-2-2.Bb: 125 °C, 16 h
Damp heat cyclic IEC 60512-11-12.11m / 60068-2-30.Db: 25/55 °C, 90 – 100 %rH,
1 cycle of 24 h
• Cold steady state IEC 60512-11-10.11j / 60068-2-1.A: -55 °C, 2 h
• Thermal shock IEC 60512-11-4.11d / 60068-2-14.Na: -55/125 °C, 5 cycles 30 min.
Sinusoidal vibrations IEC 60512-6-4.6d / 60068-2-6.Fc: 10 to 500 Hz, 10 g,
1 octave/min, 10 cycles for each axis
• Shock IEC 60512-6-3.6c / 60068-2-27.Ea: 50 g, 11 ms, 3 shocks in three axis
During the above two tests, no contact interruption >50 ns does appear.
• Solderability J-STD-002A, Test A, 245 °C, 5 s, solder alloy SnAg3.8Cu0.7
• Resistance to soldering heat J-STD-020C, 260 °C, 20 s
• Moisture sensitivity J-STD-020C level 1
• Resistance to corrosion:
1) Salt spray test IEC 60068-2-11.Ka: 48 h
2) Sulfur dioxide (SO
2
) test IEC 60068-2-42 Kc: 96 h at 25 ppm SO
2
,
25 °C, 75 %rH
3) Hydrogen sulfide (H
2
S) test IEC 60068-2-43 Kd: 96 h at 12 ppm H
2
S,
25 °C, 75 %rH
SOLDERLESS COMPLIANT PRESS-FIT CHARACTERISTICS
PRESS-FIT CHARACTERISTICS MEASURED ACC. TO IEC 60352-5
Press-in force: 90 N max. (at min. hole dia.) / 65 N typ.
Push-out force: 30 N min. (at max. hole dia.) / 50 N typ.
Push-out 3
rd
cycle: 20 N min. (at max. hole dia.)
PCB HOLE DIMENSIONS
2.54 mm grid Finished hole Ø: 1 + 0.09/-0.06 mm
Drilled hole Ø: 1.15 ± 0.025 mm
PCB HOLE PLATING
PCB surface finish Hole plating
Tin 5-15 μm tin over min. 25 μm copper
Copper min. 25 μm copper
Gold over nickel 0.05-0.2 μm gold over 2.5-5 μm nickel
over min. 25 μm copper
®
U
L
T & R Packaging
DIL SOCKETS

Summary of content (3 pages)