Datasheet
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DIL SOCKETS
GENERAL SPECIFICATIONS
127
Due to technical progress, all information provided is subject to change without prior notice.
The values listed below are general specs applying for Preci-Dip DIL sockets. Please see individual catalog page for additional and product
specific technical data.
OPERATING TEMPERATURE RANGE -55 ... +125 °C
CLIMATIC CATEGORY (IEC) 55/125/21
OPERATING HUMIDITY RANGE Annual mean 75%
MAX. WORKING VOLTAGE 100 VRMS/150 VDC
Preci-Dip sockets are recognized by Underwriters Laboratories Inc. and listed under “Connectors for Use in Data, Signal, Control and
Power Applications“, File Nr. E174442.
PACKAGING
• Standard packaging for DIL sockets is tube
packaging.
• SMD mount sockets available on request
with Tape & Reel packaging acc. to EIA Standard 481.
These products are marked with the symbol:
Please consult www.precidip.com for availability,
size of tape, size of reel, number of components
per reel and packing units.
MECHANICAL CHARACTERISTICS
CLIP RETENTION Min. 40 N (no displacement under axial force applied)
CONTACT (SLEEVE / CLIP) RETENTION Min. 3.3 N acc. to MIL-DTL-83734, pt 4.6.4.2
ELECTRICAL CHARACTERISTICS
INSULATION RESISTANCE AT 500 V AC BETWEEN ANY TWO ADJACENT CONTACTS Min. 10’000 MΩ
CAPACITANCE BETWEEN ANY TWO ADJACENT CONTACTS Max. 1 pF
AIR AND CREEPAGE DISTANCES BETWEEN ANY TWO ADJACENT CONTACTS
(Min. 0.2 mm FOR SHRINK-DIP SOCKETS)
Min. 0.6 mm
ENVIRONMENTAL CHARACTERISTICS
The sockets withstand the following environmental tests without mechanical
and electrical defects:
• Dry heat steady state IEC 60512-11-9.11i / 60068-2-2.Bb: 125 °C, 16 h
• Damp heat cyclic IEC 60512-11-12.11m / 60068-2-30.Db: 25/55 °C, 90 – 100 %rH,
1 cycle of 24 h
• Cold steady state IEC 60512-11-10.11j / 60068-2-1.A: -55 °C, 2 h
• Thermal shock IEC 60512-11-4.11d / 60068-2-14.Na: -55/125 °C, 5 cycles 30 min.
• Sinusoidal vibrations IEC 60512-6-4.6d / 60068-2-6.Fc: 10 to 500 Hz, 10 g,
1 octave/min, 10 cycles for each axis
• Shock IEC 60512-6-3.6c / 60068-2-27.Ea: 50 g, 11 ms, 3 shocks in three axis
During the above two tests, no contact interruption >50 ns does appear.
• Solderability J-STD-002A, Test A, 245 °C, 5 s, solder alloy SnAg3.8Cu0.7
• Resistance to soldering heat J-STD-020C, 260 °C, 20 s
• Moisture sensitivity J-STD-020C level 1
• Resistance to corrosion:
1) Salt spray test IEC 60068-2-11.Ka: 48 h
2) Sulfur dioxide (SO
2
) test IEC 60068-2-42 Kc: 96 h at 25 ppm SO
2
,
25 °C, 75 %rH
3) Hydrogen sulfide (H
2
S) test IEC 60068-2-43 Kd: 96 h at 12 ppm H
2
S,
25 °C, 75 %rH
SOLDERLESS COMPLIANT PRESS-FIT CHARACTERISTICS
PRESS-FIT CHARACTERISTICS MEASURED ACC. TO IEC 60352-5
• Press-in force: 90 N max. (at min. hole dia.) / 65 N typ.
• Push-out force: 30 N min. (at max. hole dia.) / 50 N typ.
• Push-out 3
rd
cycle: 20 N min. (at max. hole dia.)
PCB HOLE DIMENSIONS
• 2.54 mm grid Finished hole Ø: 1 + 0.09/-0.06 mm
Drilled hole Ø: 1.15 ± 0.025 mm
PCB HOLE PLATING
PCB surface finish Hole plating
• Tin 5-15 μm tin over min. 25 μm copper
• Copper min. 25 μm copper
• Gold over nickel 0.05-0.2 μm gold over 2.5-5 μm nickel
over min. 25 μm copper
®
U
L
T & R Packaging
DIL SOCKETS