Specifications

SKI.WB800D.3
12
10Hz to 30Hz to
10Hz,amplitude 2.0mm,
5 times vibrations, 5x times
vibration.
visual inspection and the products should
be ok.
2-1
Soldering
ability test
(Only for SKI
module)
Soldering
temperature:
245±5℃
Soldering duration:
3±0.5S
3
1.After soldering, the soldered area must
be covered by a smooth bright solder
layer, some deficiencies such as a small
amount of the pinhole, not wetting are
allowed, but the deficiencies can not be
in the same place；
2. At least 90% of soldered area shall be
covered continuously by the soldering
material.
2-2
High
Temperature
and
Humidity
Operation
Test
Leave samples in 60℃, 90%
RH @ 24 hours
4
After test, the products appearance,
power, EVM and frequency error
functional parameter shall be satisfied
with the test specification.
2-3
Low
Temperature
Operation
Test
Leave samples in -15℃
@24 hours
4
After test, the products appearance,
power, EVM and frequency error
functional parameter shall be satisfied
with the test specification.
2-3
High
Temperature
and
Humidity
Start Test
Leave samples in 60℃,
90% RH for 4x hours
4
After test, power on and off the samples
for 3x tiems, the samples should be able
to start normally
2-4
Low
temperature
start test
Leave samples in -15℃ for
4x hours
4
After test, power on and off the samples
for 3x tiems, the samples should be able
to start normally
2-5
High
Temperature
and
Humidity
Storage Test
Leave samples in 85℃, 95%
RH @ 48 hours
4
After test, the products appearance,
power, EVM and frequency error
functional parameter shall be satisfied
with the test specification.
2-6
Low
Temperature
Storage Test
Leave samples in -40℃,
@48 hours
4
After test, the products appearance,
power, EVM and frequency error
functional parameter shall be satisfied
with the test specification.
2-7
Thermal
Shock Test
-40~85℃，dwell time：
30min，50cycles
4
After test, the products appearance,
power, EVM and frequency error
functional parameter shall be satisfied