Specifications

AMP2-T assembly instructions. © 41Hz Audio / www.41hz.com Revision 1.0T boards
- Connection terminals and connection wire. I recommend soldering wires to the board
unless you plan to connect and disconnect them a lot. I also recommend you use the wire
you plan to use in your final application right from the start. The PCB leads and wire
required for connecting the power supply and speakers are heavy duty. Soldering them
requires substantial heat and with repeated soldering you risk damaging the PCB. There
is much debate in the audio world about connectors and IMO the best connector is none
at all; a well made solder connection is better than the best connector. Unless you need to
disconnect them frequently.
- Wire jumpers. Depending on how you configure the board you will need some wire
jumpers.
Mounting the components
1. First, decide how to solder the TP2350B chip. If you are soldering the heat slug to the
board this must be done first, or at the same time as soldering the other components in an
oven. You should read more in APPENDIX 3 about this.
2. Solder all surface mount components on the bottom side. A picture of how the
components are placed is included below in Figure 2: Components, bottom view.
3. Mount the axial lead diodes D12, D22, D23, and D24 on the bottom side. Cut the leads
snugly on the top side of the board (and always do the final soldering after cutting the
wires).
4. Turn the board over and solder all surface mount components on the top side. A picture
of the component placement can be found in Figure 3: Components top view. The
component numbers are better seen in this figure than on the board. Most surface mount
components are placed around the U2 chip. Four diodes and four 0.1 uF decoupling
capacitors are placed above the U1 chip.
a. J1 is a jumper wires that set the BBM (Break Before Make) timing. Normally set
the BBM to 80 nS by placing the jumpers as shown in Figure 4. Shorter BBM
timing may cause current shoot-trough and is not recommended. 120 nS BBM
timing can be used for heavy duty (woofer amps) for increased shoot through
margin but may increase distortion in the > 2 kHz range.
b. Leave R33 open. It’s connected to an undocumented test pin. Tripath just state it
should be left open.
5. Solder the L3 inductor bead. This component connects the analogue signal ground plane
around the TC2001 chip to the rail power ground plane and dampens HF power ground
plane fluctuations from disturbing the analogue section.
6. Solder the axial resistors and diodes.
a. R31 and R32 are placed vertically, with one lead doubling back.