Specifications

TABLE OF CONTENTS
1. OPERATION ........................................................................................................................ 3
1.1 Outline .............................................................................................. 3
1.2 Special Characteristics of a CCD ....................................................... 3
2. COMPREHENSIVE SPECIFICATIONS ................................................................................. 4
3. THEORY OF OPERATION .............................................................................................. 4
3.1 Operation Principles of the CCD ....................................................... 4
3.2 Mechanism of the CCD Electrical Charge Transmission ................ 5
3.3 The Interline-Transfer Organization of the CCD Image Sensors ................ 6
3.4 Instructions for Powering TMC-73M/TMC-63M ............................. 6
4. ALIGNMENT AND ADJUSTMENT ................................................................................. 8
4.1 Equipment .................................................................................. 8
4.2 Preparation ................................................................................. 9
4.3 Adjustment Procedures .................................................................... 9
5. OPERATION ........................................................................................................................ 11
6. IMAGER COLOR FILTERS
6.1 Diagram of Complementary Mosaic Filter .......................................... 11
6.2 Spectral Response With Optical Filter (IR Cut Filter) ............................. 11
7. TIMING CHART ........................................................................................................... 12
8.SERIAL DATA INPUT FORMAT ................................................................................. 13
9. MECHANICAL DRAWINGS ................................................................................. 14
9.1 Standard Configuration .................................................................... 14
9.2 OEM internal board assembly ....................................................... 14
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