Data Sheet

2
7
Version 1.0
The above prole is based on Alpha CVP–390 solder paste, which has been successfully tested with our devices.
Table 22 – Soldering prole temperatures
Stage Duration/Rate Temperature
Ramp to soak 2°C/s Ambient – 185°C
Soak 60s 185°C
Ramp to peak 1°C/s 240°C
Reow 45s >225°C
Cool down 2°C/s
21.0 SolderingProle
21.1 Withheaders
This device is not recommended for reow soldering.
The plastic of the pin headers will melt, instead please
hand solder the module or use sockets.
21.2 Withoutheaders
Figure 9 – Reow soldering temperature prole (surface mount)