REVISIONS DESCRIPTION REVISION A B C D Updated part numbers Edited Part Numbers Edited Changed par. 3.1.1 split supply and load variation from frequency stability Vs. temperature characteristics, phase noise limits @10Hz and 100 Hz) Add par. 3.4.2 Logic microcircuits and Radiation (ECO# 10549) APPROVED DATE Luis Vargas Luis Vargas Luis Vargas 1/9/09 6/21/2009 12/2/2010 C. Albright 4/26/12 CONSULT FACTORY FOR CURRENT REVISION 50MHz TCXO ,Vcc=12v,+25ºC 9/17/08 -30 Aging Data 0.
1.0 SCOPE This specification establishes the detail requirements for low profile hybrid, hermetically sealed, HCMOS output temperature compensated crystal oscillators (TCXO) for use in space flight missions 2.0 APPLICABLE DOCUMENTS The following documents of the latest issue form a part of this drawing to the extent specified herein. 2.
.1.1 Electrical Characteristics PARAMETER Frequency Nom. Supply voltage, Nom. SYMBOL fo Vs Input Current, max. Freq. stability vs. Operating temperature Electrical Frequency Adjustment Min. (when specified) Is Δf/fc (Ta) Freq. stability vs. ±5 % Input Voltage Variation Freq. stability vs. ±5 % Load Variation Aging Max Freq. stability vs. Vacuum Short term stability RF Output Output CONDITIONS VALUE 3. to 90 Vs±5% See part number generation table UNIT MHz V 50 Vs, nom.
3.2.1 Physical Characteristics 3.2.1.1 Dimensions - The TCXO outline dimensions and terminal connections shall be as shown in Figure 1 herein. 3.2.1.2 Weight - The TCXO shall weigh less than or equal to 15 grams. 3.2.1.3 Materials - The TCXO package body and lead finish shall be gold in accordance with MIL-PRF-38534. 3.3 Design and Construction The design and construction of the crystal oscillator shall be as specified herein.
Group A Inspection PARAMETER Input Current, max. Freq. stability vs. temperature SYMBOL CONDITIONS Is Vs, nom. / Ta=+25°C Δf/fc (Ta) Vs, nominal and over the temperature range indicated under part number definition Electrical Frequency Adjustment Min. (when specified) Δf/fo (ΔVcc) ± Vs, nom.
Group C Inspection SUBGROUP TEST DESCRIPTION Vibration (random) Shock Hermetic Seal Fine Leak – MIL-STD-883 Method 1014 Condition A1 Gross Leak – MIL-STD-883, Method 1014 Condition C Electrical Test Ambient Pressure (Non-Operating Electrical Test Storage Temperature Hermetic Seal Electrical Test 3 MI-STD 202 Method 213 T.C. F (1500g, 0.
3.3.1 All piece parts shall be derived from lots that meet the element evaluation requirements of MILPRF-38534, Class K, with the following exceptins: Active elements a) Visual inspection of silicon on sapphire microcircuits. Semicircular crack(s) or multiple adjacent cracks, not in the active area, starting and terminating at the edge of the die are acceptable.
3.5 Traceability Requirements Material, element and process traceability requirements shall be as specified by MIL-PRF-38534 for Class K hybrids. 3.6 Data 3.6.1. Design Documentation - When required by the purchase order, design, topography, process and flow charts for all assembly/inspection and test operation for devices to be supplied under this specification on the initial procurement shall be established and shall be available in-plant for review by the procuring activity upon request.
3.8 Engineering Models Engineering Models are fit, form, and function representative of Flight Models and of commercial construction using commercial parts of same generic type as Flight Models. Completed oscillators are not screened. NOTES: This oscillator is offered to meet the specifications above and is not guaranteed to meet any other requirements. ▀ PART NUMBER GENERATION SERIES QT80: 24 Pin DDIP Output type and supply voltage TEMPERATURE RANGE (°C) Stability Over Temperature 1: HCMOS, 5.
RECOMMENDED ELECTRICAL TEST DIAGRAM FLUKE 8050A AMPMETER mA COM V HP6205C POWER SUPPLY Vcc VC VOLTMETER .01 uF .01 uF TEK2465B DEVICE UNDER TEST OUT HP53181A FREQ COUNTER GND .01 uF common OSCILLOSCOPE VERT SIGNAL OUT 15 pF (including probes) FIGURE 1 INTERFACE CONTROL DRAWING 24 Pin DDIP Q-TECH USA PART NUMBER FREQUENCY D/C S/N PIN NO. 1 ESD SYMBOL FOR PIN No. 1 .300 MAX. 24X .200 MIN.