Data Sheet

DWM3001C
Fully Integrated UWB Transceiver Module
DWM3001C Data Sheet Rev B, May 2022
Subject to change without notice | All rights reserved
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7. Application Information
7.1 Application Board Layout Guidelines
When designing the PCB onto which the DWM3001C will be soldered, the proximity of the DWM3001C on-board antenna to metal and
other non-RF transparent materials needs to be considered carefully. Two suggested placement schemes are shown below.
For best RF performance, ground copper should be flooded in all areas of the application board, except in the areas marked
“Keep-Out Area”, where there should be no metal either side, above or below (e.g. do not place battery under antenna).
The two placement schemes below show an application board with no metallic material in the keep-out area. The diagram on the right
is an application board with the antenna projecting off of the board so that the keep out area is in free space. The diagram on the left
shows an application board which does not have the module in free space but has the PCB copper removed on either side (and behind)
the module antenna. (Note: the rectangular area above the shield on the module is the antenna area)
It is also important to note that the ground plane on the application board affects the antenna radiation pattern. There must be a
minimum spacing of 10 mm (d) without metal either side of the module antenna.
Application Board
d
d
Application Board
d d
Keep-Out
Area
Keep-Out
Area
Figure 3: Board Layout
7.2 Note on Ranging Performance in Harsh Multipath Environments
As can be seen from the radiation patterns in Table 12 and Table 13, the DWM3001C antenna is cross polarized in some regions, i.e.
the horizontally polarized gain is roughly equal to the vertically polarized gain. This is of benefit in maintaining a high link budget as the
orientation of the module changes.
It can be found, however, that this polarization diversity can lead to variation in ranging accuracy as tags move in harsh multipath
environments, such as where there are many reflections in confined indoor spaces, e.g. narrow corridors. In these applications, it is
suggested to optimize the placement of the module on the carrier PCB. Avoid placing the module too close, i.e. less than 1 cm, to the
edge of the PCB. This has the effect of reducing the horizontally polarized radiation component and improving resilience to multipath
fading.