TDA8007BHL Multiprotocol IC card interface Rev. 9.1 — 18 June 2012 Product data sheet 1. General description The TDA8007BHL is a cost-effective card interface for dual smart card readers. Controlled through a parallel bus, it meets all requirements of ISO 7816, GSM 11-11, EMV4.2 and EMV 2000. It is addressed on a non-multiplexed 8-bit databus, by means of address registers AD0, AD1, AD2 and AD3. TDA8007BHL/C3 can be also addressed through a multiplexed access.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface – in Protocol T = 0: 11.8 ETU – in Protocol T = 1: 10.8 ETU Supports synchronous cards Current limitations in the event of short-circuit (pins I/O1, I/O2, VCC1, VCC2, RST1 and RST2) Special circuitry for killing spikes during power-on/power-off Supply supervisor for power-on/power-off reset Step-up converter (supply voltage from 2.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface Table 1. Quick reference data …continued VDD = 3.3 V; fXTAL = 10 MHz; GND = 0 V; Tamb = 25 C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VCC card supply output voltage 5 V card including static loads 4.75 5.0 5.25 V with 40 nC dynamic loads on 200 nF capacitor 4.6 - 5.4 V including static loads 2.78 - 3.22 V with 24 nC dynamic loads on 200 nF capacitor 2.75 - 3.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface 6.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface 7. Pinning information 37 WR 38 CS 39 ALE 40 INT 41 INTAUX 42 AD3 43 AD2 44 AD1 45 AD0 46 XTAL2 RSTOUT 1 36 RD I/OAUX 2 35 D7 I/O1 3 34 D6 C81 4 33 D5 PRES1 5 32 D4 C41 6 CGND1 7 CLK1 8 29 D1 VCC1 9 28 D0 31 D3 TDA8007BHL 30 D2 SBM 24 VDDA 23 SBP 22 SAP 21 VUP 20 GND 19 RST2 18 VCC2 17 25 AGND CLK2 16 26 SAM C82 12 CGND2 15 27 VDD I/O2 11 C42 14 RST1 10 PRES2 13 Fig 2.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface Table 3.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface Table 3. Pin description …continued Symbol Pin Description AD0 45 register selection address 0 input XTAL2 46 connection for an external crystal XTAL1 47 connection for an external crystal or input for an external clock signal DELAY 48 connection for an external delay capacitor 8. Functional description Remark: Throughout this document, it is assumed that the reader is familiar with ISO7816 terminology. 8.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface CS D0 to D7 AD0 to AD3 WR RD REC REGISTERS 001aam017 Fig 3. Non-multiplexed bus configuration AD0 to AD3 RD t1 t2 t3 CS WR D0 to D7 DATA OUT fce840 Fig 4. TDA8007BHL Product data sheet Control with non-multiplex bus (read) All information provided in this document is subject to legal disclaimers. Rev. 9.1 — 18 June 2012 © NXP B.V. 2012. All rights reserved.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface AD0 to AD3 RD t7 CS t6 WR t4 D0 to D7 t5 DATA IN fce841 Fig 5. Control with non-multiplex bus (Write with CS) AD0 to AD3 RD t7 CS WR t6 D0 to D7 t4 t5 DATA IN fce842 Fig 6. Control with non-multiplex bus (Write with EN) 8.1.2 Multiplexed configuration The TDA8007BHL/C3 offers a multiplexed configuration in addition to a nun multiplexed configuration. The TDA8007BHL/C4 does not offer the multiplexed configuration.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface If a microcontroller with a multiplexed address and data bus (such as 80C51) is used, then pins D0 to D7 may be directly connected to port P0 to P7, see Figure 7. Automatic switching to the multiplexed bus configuration occurs only for TDA8007BHL/C3, if a rising edge is detected on signal ALE. In this event, pins AD0 to AD3 play no role and may be tied to VDD or ground.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface Cards 1, 2 and 3 have dedicated registers for setting the parameters of the ISO UART (see Figure 9). Programmable Divider Register (PDR) Guard Time Register (GTR) UART Configuration register 1 (UCR1) UART Configuration Register 2 (UCR2) Clock Configuration Register (CCR) Cards 1 and 2 also have dedicated registers for controlling their power and clock configuration. The Power Control Register (PCR) for card 3 is controlled externally.
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TDA8007BHL NXP Semiconductors Multiprotocol IC card interface 8.2.1 General registers 8.2.1.1 Card select register The Card Select Register (CSR) is used for selecting the card on which the UART will act, and also to reset the ISO UART. Table 4. [1] 7 6 5 4 3 2 1 0 CS7 CS6 CS5 CS4 RIU SC3 SC2 SC1 Register value at reset: all significant bits are cleared after reset, except bits CS7 to CS4 which are set to their default value Table 5.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface Table 7. Description of HSR bits Bit Symbol Description 7 HS7 not used 6 PRTL2 protection 2: Bit PRTL2 = 1 when a fault has been detected on card reader 2. Bit PRTL 2 is the OR-function of the protection on pin VCC2 and pin RST2. 5 PRTL1 protection 1:. Bit PRTL1 = 1 when a fault has been detected on card reader 1. Bit PRTL 1 is the OR-function of the protection on pin VCC1 and pin RST1. 4 SUPL supervisor latch.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface Table 10. [1] 8.2.1.4 Register TOR3 (address 0Bh; write only)[1] 7 6 5 4 3 2 1 0 TOL23 TOL22 TOL21 TOL20 TOL19 TOL18 TOL17 TOL16 Register value at reset: all bits are cleared after reset. Time-out configuration register The Time-Out Configuration (TOC) register is used for setting different configurations of the time-out counter as given in Table 11; all other configurations are undefined. Table 11.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface Table 12. Card registers (address 00h to F5h …continued Register Description 75H Counter 1 is an 8-bit auto-reload counter, and counters 3 and 2 form a 16-bit counter. Counter 1 starts counting the content of register TOR1 on the first START bit (reception or transmission) detected on pin I/O after 75H is written in register TOC.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface 8.2.2 ISO UART registers 8.2.2.1 UART Transmit Register (UTR) Table 13. [1] Register UTR (address 0DH; write only)[1] 7 6 5 4 3 2 1 0 UT7 UT6 UT5 UT4 UT3 UT2 UT1 UT0 Register value at reset: all bits are cleared after reset. When the microcontroller wants to transmit a character to the selected card, it writes the data in direct convention in the UART transmit register.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface 8.2.2.3 Mixed Status Register (MSR) The MSR relates the status of pin INTAUX, the cards presence contacts PRES1 and PRES2, the BGT counter, the FIFO empty indication and the transmit or receive ready indicator TBE/RBF. It also gives useful indications when switching the clock to or from 1/2 fint and when driving the TDA8007BHL/C4 with fast controllers. No bits within register MSR act upon signal INT. Table 15.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface Table 16. Description of MSR bits …continued Bit Symbol Description 2 PR1 card 1 present. Bit PR1 = 1 when card 1 is present. 1 INTAUX auxiliary interrupt. Bit INTAUX is set when pin INTAUX = high and it is reset when pin INTAUX = low. 0 TBE/RBF transmit buffer empty/receive buffer full. Bit TBE/RBF = 1 when: - changing from reception mode to transmission mode - the reception FIFO is full.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface I/O bit TBE INT RD CS tW(WR) bit CRED tWR(UTR) 001aam016 Fig 11. Minimum time between two write operations in register UTR - non-multiplexed bus RD CS TW(RD) bit CRED 001aam018 TWR(TOC) Fig 12. Minimum time between two write operations in register TOC - non-multiplexed bus TDA8007BHL Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 9.1 — 18 June 2012 © NXP B.V. 2012.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface I/O bit RBF bit FE tSB(FE) INT tSB(RBF) RD tW(RD) bit CRED tRD(URR) tRD(URR) fce903 Fig 13. Minimum time between two read operations in register URR - multiplexed mode TDA8007BHL/C3 I/O bit TBE INT WR tW(WR) bit CRED fce902 tWR(UTR) Fig 14. Minimum time between two write operations in register UTR - multiplexed mode TDA8007BHL/C3 WR tW(WR) bit CRED fce904 tWR(TOC) Fig 15.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface 8.2.2.4 FIFO Control Registers (FSR) The FCR relates the parity error count and the FIFO length. Table 17. [1] Register FCR (address 0Ch; write only)[1] 7 6 5 4 3 2 1 0 FC7 PEC2 PEC1 PEC0 FC3 FL2 FL1 FL0 Register value at reset: all relevant bits are cleared after reset. Table 18.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface If LCT mode is used for transmitting the last character, then bit TBE is not set at the end of the transmission. Table 19. [1] Register USR (address 0Eh; read only)[1] 7 6 5 4 3 2 1 0 TO3 TO2 TO1 EA PE OVR FER TBE/RBF Register value at reset: all relevant bits are cleared after reset. Table 20. Description of USR bits Bit Symbol Description 7 TO3 Time-Out counter 3.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface 8.2.3 Card registers When cards 1, 2 or 3 are selected, the following registers may be used for programming some specific parameters. 8.2.3.1 Programmable Divider Register (PDR) The programmable divider registers PDR1, PDR2 and PDR3 are used for counting the cards clock cycles forming the ETU (see Figure 16). These are auto-reload 8-bit counters. Table 21.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface Table 23. Description of UCR2 bits Bit Symbol Description 4 PDWN power-down mode. If bit PDWN is set by software, the crystal oscillator is stopped. This mode allows low power consumption in applications where this is required. During the Power-down mode, it is not possible to select a card other than the one currently selected.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface Table 24. Baud rate selection using values F and D[1] PSC = 31: fCLK = 3.58 MHz; PSC = 32: fCLK = 4.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface Table 27. 8.2.3.5 Description of UCRx1 bits Bit Symbol Description 7 UC17 not used 6 FIP Force Inverse Parity (FIP). If bit FIP is set to logic 1, the UART will NAK a correctly received character, and will transmit characters with wrong parity bits. 5 FC Test. Bit FC is a test bit, and must be left at logic 0. 4 PROT Protocol (PROT).
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface Table 29. Description of CCRx bits …continued Bit Symbol Description 4 CST Clock Stop (CST). In the case of an asynchronous card, bit CST defines whether the clock to the card is stopped or not; if bit CST is reset, then the clock is determined by bits AC0, AC1 and AC2. 3 SC Synchronous Clock (SC).
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface Table 31. TDA8007BHL Product data sheet Description of PCRx bits Bit Symbol Description 7 PCR7 not used 6 PCR6 not used 5 C8 Contact 8 (C8). When writing to register PCR, pin C8 will output the value of bit C8. When reading from register PCR, bit C8 will store the value on pin C8 4 C4 Contact 4 (C4). When writing to register PCR, pin C4 will output the value of bit C4.
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TDA8007BHL NXP Semiconductors Multiprotocol IC card interface 8.3 Supply Vth1 VDD Vth2 CDELAY tw RSTOUT SUPL INT Status read Supply dropout Power-on Reset by CDELAY Power-off fce683 Fig 17. voltage supervisor The TDA8007BHL/C4 operates within a supply voltage range of 2.7 V to 6 V. The supply pins are VDD, VDDA, GND and AGND.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface 8.4 Step up converter Except for the VCC generator and the other cards contacts buffers, the whole circuit is powered by VDD, and VDDA. If the supply voltage is 2.5 V, then a higher voltage is needed for the ISO contacts supply. When a card session is requested by the microcontroller, the sequencer first enables the step-up converter (a switched capacitors type) which is clocked by an internal oscillator at a frequency of approximately 2.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface 8.6 Activation sequence When the cards are inactive, pins VCC, CLK, RST, C4x, C8x and I/O are at low level and have a low impedance with respect to ground. The step-up converter is stopped. When everything is satisfactory (voltage supply, card present and no hardware problems), the system microcontroller may initiate an activation sequence of a present card.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface 8.7 Deactivation sequence When the session is completed, the microcontroller resets bit START at t10. The circuit then executes an automatic deactivation sequence (see Figure 19): 1. The card is reset by signal RST = low (t11). 2. Clock pulse CLK is stopped (t12). 3. Pins I/O, C4x and C8x fall to 0 V (t13). 4. Pin VCC falls to 0 V with typical 0.17 V/µs slew rate (t14). 5.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface 9. Limiting values Table 33. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDD Conditions Min Max Unit supply voltage 0.5 +6.5 V VDDA analog supply voltage 0.5 +6.5 V VI input voltage on pins SAM, SAP, SBM, SBP and VUP 0.5 +7.5 V on all other pins 0.5 VDD + 0.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface Table 35. Characteristics …continued VDD = 3.3 V; VDDA = 3.3 V; Tamb = 25 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit IDD(oper) supply current in operating modem 5 V cards ICC1 = 65 mA; ICC2 = 15 mA; fXTAL = 20 MHz; fCLK = 10 MHz; VDD = 2.7 V - - 315 mA VDD = 2.7 V - - 215 mA VDD = 5 V - - 100 mA 2.10 - 2.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface Table 35. Characteristics …continued VDD = 3.3 V; VDDA = 3.3 V; Tamb = 25 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit tr rise time CL = 30 pF - - 0.1 µs tf fall time CL = 30 pF - - 0.1 µs no load 0 - 0.1 V Io(inactive) = 1 mA 0 - 0.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface Table 35. Characteristics …continued VDD = 3.3 V; VDDA = 3.3 V; Tamb = 25 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit V Configured as output VOL low-level output voltage IOL = 1 mA 0 - 0.3 VOH high-level output voltage IOH < 20 µA 0.8VCC - VCC + 0.25 V IOH < 40 µA for 5 V and 3 V cards 0.75VCC - VCC + 0.25 V CL < 30 pF - - 0.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface Table 35. Characteristics …continued VDD = 3.3 V; VDDA = 3.3 V; Tamb = 25 °C; unless otherwise specified. Symbol Parameter IRST(sd) Conditions Min Typ Max Unit shutdown current on pin RST - - 20 - mA IRST(lim) limitation current on pin RST 20 - +20 mA Tsd shutdown temperature - 150 - °C Card presence inputs: pins PRES1 and PRES2 VIL low-level input voltage - - 0.3VDD V VIH high-level input voltage 0.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface Table 35. Characteristics …continued VDD = 3.3 V; VDDA = 3.3 V; Tamb = 25 °C; unless otherwise specified. Symbol Parameter Conditions ti(r), ti(f) input transition time (rise and fall time) CL = 30 pF Min Typ Max Unit - - 1.2 µs mV Configured as output VOL low-level output voltage IOL = 1 mA - - 300 VOH high-level output voltage IOH = 40 mA 0.75VDD - VDD + 0.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface Table 36. Timings VDD = 3.3 V; VDDA = 3.3 V; Tamb = 25°C; unless otherwise specified. Symbol Min. Typ. Max.
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TDA8007BHL NXP Semiconductors Multiprotocol IC card interface 14. Package outline LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm SOT313-2 c y X 36 25 A 37 24 ZE e E HE A A2 (A 3) A1 w M θ bp pin 1 index Lp L 13 48 detail X 12 1 ZD e v M A w M bp D B HD v M B 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HD HE L Lp v w y mm 1.6 0.20 0.05 1.45 1.35 0.25 0.27 0.17 0.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface 15. Handling information All input and output pins are protected against ElectroStatic Discharge (ESD) under normal handling. When handling Metal-Oxide Semiconductor (MOS) devices ensure that all normal precautions are taken as described in JESD625-A, IEC 61340-5 or equivalent standards. 16. Soldering of SMD packages This text provides a very brief insight into a complex technology.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface 16.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities 16.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface temperature maximum peak temperature = MSL limit, damage level minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 23. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface 17. Revision history Table 39. Revision history Document ID Release date Data sheet status Change notice Supersedes TDA8007BHL v. 9.1 20120618 Product data sheet - TDA8007BHL v. 9 - TDA8007BHL v. 8 Modifications: TDA8007BHL v. 9 Modifications: TDA8007BHL v.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface 18. Legal information 18.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
TDA8007BHL NXP Semiconductors Multiprotocol IC card interface 20. Contents 1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.1.1 8.1.2 8.2 8.2.1 8.2.1.1 8.2.1.2 8.2.1.3 8.2.1.4 8.2.2 8.2.2.1 8.2.2.2 8.2.2.3 8.2.2.4 8.2.2.5 8.2.3 8.2.3.1 8.2.3.2 8.2.3.3 8.2.3.4 8.2.3.5 8.2.3.6 8.2.4 8.3 8.4 8.5 8.6 8.7 9 10 11 12 13 14 15 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .