Specifications

Author affiliation:
1 School of Mechanical and Precision Instrument Engineering, Xi'an University of Technology,
Xi'an 710048, China
2 School of Printing and Packaging Engineering, Xi'an University of Technology, Xi'an 710048,
China
Corresponding author: Lu, Y. ([e-mail])
Source title: Applied Mechanics and Materials
Abbreviated source title: Appl. Mech. Mater.
Volume: 278-280
Monograph title: Advances in Mechatronics and Control Engineering
Issue date: 2013
Publication year: 2013
Pages: 852-855
Language: English
ISSN: 16609336
E-ISSN: 16627482
ISBN-13: 9783037855959
Document type: Conference article (CA)
Conference name: 2012 International Conference on Mechatronics and Control Engineering,
ICMCE 2012
Conference date: November 29, 2012 - November 30, 2012
Conference location: Guangzhou, China
Conference code: 95258
Sponsor: Queensland University of Technology, Australia; Korea Maritime University; Hong
Kong Industrial Technology Research Centre; Inha University, Korea
Publisher: Trans Tech Publications, P.O. Box 1254, Clausthal-Zellerfeld, D-38670,
Germany
Abstract: The prospective application of flexible electronics is feasible by shielding the
silicon ribbons from damage in the structure. The silicon failure in the design of strain isolation
for stretchable and flexible sensors is analyzed by FEM. The destruction of the silicon circuit is
different with the change of the thickness of the PDMS layer in stretchable sensors. Owing to the
fact that the PDMS layer is not infinitely thick in the application, the purpose of the paper is to
provide a reference for choosing the thickness of the PDMS layer in the design of stretchable
sensors. © (2013) Trans Tech Publications, Switzerland.
Number of references: 9
Main heading: Sensors
Controlled terms: Finite element method - Microchannels - Silicon
Uncontrolled terms: Flexible sensor - Prospective applications - Silicon circuits -
Silicon ribbons - Strain isolation - Thickness of the PDMS layer
Classification code: 604 Metal Cutting and Machining - 631 Fluid Flow - 712.1.1
Single Element Semiconducting Materials - 801 Chemistry - 921.6 Numerical Methods
DOI: 10.4028/www.scientific.net/AMM.278-280.852
Database: Compendex
Compilation and indexing terms, © 2013 Elsevier Inc.