Specifications

Authors: Zhai, Q.Y.1 ; Xu, J.F.1 ; Zhang, X.1 ; Guo, X.F.1/翟秋亚;徐锦锋;;郭学峰
Author affiliation:
1 School of Materials Science and Engineering, Xi'an University of Technology, Xi'an 710048,
China
Corresponding author: Zhai, Q. Y. ([e-mail])
Source title: Advanced Materials Research
Abbreviated source title: Adv. Mater. Res.
Volume: 630
Monograph title: Manufacturing Technology
Issue date: 2013
Publication year: 2013
Pages: 23-29
Language: English
ISSN: 10226680
ISBN-13: 9783037855836
Document type: Conference article (CA)
Conference name: 2012 International Conference on Manufacturing, Manufacturing 2012
Conference date: November 14, 2012 - November 15, 2012
Conference location: Macau, China
Conference code: 95242
Publisher: Trans Tech Publications, P.O. Box 1254, Clausthal-Zellerfeld, D-38670,
Germany
Abstract: In this study, the spot welding of rapidly solidified Ni-19.8%Sn alloy foils has been
conducted by a micro-type capacitor discharge welder. The configuration and microstructural
morphology of the joint were examined experimentally and he temperature of the micro nugget
was analyzed numerically. The results show that the micro-joint consists of an oblate spheroid
nugget and a 2.0~3.0 μm thick bond zone. The microstructure of the joint is fine and
homogeneous and there is no coarsening sign in the parent materials near nugget. During
solidification, the cooling rate of nugget is so high to the order of 106K/s that the eutectic
reaction of L &rarr α-Ni + Ni3Sn was suppressed or at least partly suppressed and almost all of
the liquid within the joint solidified into supersaturated α-Ni. Therefore, the joint microstructure
which is consistent with the microstructure of the alloy foils shows the characteristics of rapid
solidification. In addition, A kind of streamline due to vortex flow in micro nugget, with dispersed
dross distributes in cluster along the streamline, is formed under electromagnetic force and
electrode pressure. © (2013) Trans Tech Publications, Switzerland.
Number of references: 13
Main heading: Tin alloys
Controlled terms: Alloys - Capacitors - Cerium alloys - Coarsening -
Manufacture - Morphology - Rapid solidification - Soldered joints - Spot welding
- Tin
Uncontrolled terms: Capacitor discharge - Capacitor discharge welding - Cooling
rates - Electrode pressure - Electromagnetic forces - Eutectic reactions - Joint
microstructures - Mcro-joint - Micro-joint - Microstructural morphology - Oblate
spheroid - Parent materials - Rapidly solidified - Sn alloys