Specifications

increasedsignificantly after solid solution and ageing treatment. The strengthening effect of
Cu-3Ti-1Al alloywas attributed to the formation of intermetallic phase such as Ti3Al and fine
precipitates of coherentβ′-Cu4Ti. With increase of the aging time and the temperature, the
precipitates became coarse andincoherent with Cu matrix, and the discontinuous precipitate β
started to grow from grain boundariestoward grain interior, which decreased hardness. As the
formation of Ti3Al, β-Cu3Ti and β′-Cu4Tiphase can efficiently reduce Ti concentration in Cu
matrix. The electrical conductivity of Cu-3Ti-1Alalloy increases. In the range of experiments, the
optimal heat treatment process for Cu-3Ti-1Al alloyis solid solution at 850°C for 4h and ageing
500°C for 2h, and the hardness and electrical conductivityare 227HV and 12.3%IACS, respectively.
© (2013) Trans Tech Publications, Switzerland.
Number of references: 17
Main heading: Titanium alloys
Controlled terms: Alloys - Aluminum - Cerium alloys - Computer simulation -
Electric conductivity - Hardness - Heat treatment - Microstructure - Precipitates
- Scanning electron microscopy - Solid solutions
Uncontrolled terms: Ageing - Discontinuous precipitates - Effect of heat treatments -
Electrical conductivity - Heat treatment process - Intermetallic phase - Microstructure
and properties - Strengthening effect
Classification code: 933 Solid State Physics - 804 Chemical Products Generally - 741.1
Light/Optics - 723.5 Computer Applications - 701.1 Electricity: Basic Concepts and
Phenomena - 951 Materials Science - 547.2 Rare Earth Metals - 541.1 Aluminum -
537.1 Heat Treatment Processes - 531.1 Metallurgy - 421 Strength of Building Materials;
Mechanical Properties - 542.3 Titanium and Alloys
DOI: 10.4028/www.scientific.net/MSF.749.282
Database: Compendex
Compilation and indexing terms, © 2013 Elsevier Inc.
7.
Accession number: 20131516191859
Title: VLSI design of configurable integer pixel motion estimation with a reservoir architecture
Authors: Lu, Wei1 ; Yu, Ningmei1 ; Qu, Boqiang1 ; Ren, Ru1/路伟;余宁梅;;
Author affiliation: 1 School of Automation and Information Engineering, Xi'an University of
Technology, Xi'an 710048, China
Corresponding author: Yu, N. ([e-mail])
Source title: Journal of Computational Information Systems
Abbreviated source title: J. Comput. Inf. Syst.
Volume: 9
Issue: 4
Issue date: February 15, 2013
Publication year: 2013
Pages: 1315-1322
Language: English
ISSN: 15539105
Document type: Journal article (JA)
Publisher: Binary Information Press, P.O. Box 162, Bethel, CT 06801-0162, United States