Specifications

which requires channel estimates, this method can obtain the same diversity gain. At the same
time, it is relatively simple and more feasible in practice.
Number of references: 18
Main heading: Channel coding
Controlled terms: Atmospheric turbulence - MIMO systems - Modulation - Optical
communication - Pulse position modulation
Uncontrolled terms: Alamouti coding - Atmospheric conditions - Binary pulse position
modulation - Channel estimate - Differential space-time codes - Free Space Optical
communication - Free-space optical - Permutation matrix
Classification code: 443.1 Atmospheric Properties - 716 Telecommunication; Radar, Radio
and Television - 716.1 Information Theory and Signal Processing - 717.1 Optical
Communication Systems - 961 Systems Science
DOI: 10.3788/AOS201333.0206004
Database: Compendex
Compilation and indexing terms, © 2013 Elsevier Inc.
9.
Accession number: 20131516189190
Title: Preparation of tungsten-copper composite powder by electroless plating
Authors: Wang, Ying1 ; Zou, Juntao1 ; Zhang, Qinghe1/;邹军涛;
Author affiliation: 1 School of Materials Science and Engineering, Xi'an University of
Technology, Shaanxi Province, Xi'an 710048, China
Corresponding author: Wang, Y. ([e-mail])
Source title: Materials Science Forum
Abbreviated source title: Mater. Sci. Forum
Volume: 749
Monograph title: Materials Performance, Modeling and Simulation
Issue date: 2013
Publication year: 2013
Pages: 28-34
Language: English
ISSN: 02555476
CODEN: MSFOEP
ISBN-13: 9783037856093
Document type: Conference article (CA)
Conference name: Chinese Materials Congress 2012, CMC 2012
Conference date: July 13, 2012 - July 18, 2012
Conference location: Taiyuan, China
Conference code: 96431
Sponsor: 667
Publisher: Trans Tech Publications Ltd, Kreuzstrasse 10, Zurich-Durnten, CH-8635, Switzerland
Abstract: In this paper, tungsten-copper composite powder was prepared on the particle size of
6 ~ 10μm tungsten powder surface by electroless copper plating. The orthogonal experimental
results show that the primary and secondary order of factors affecting the deposition rate
followwing the sequence: copper sulfate solution concentration > pH value> solution