Specifications

Pages: 168-172
Language: English
ISSN: 02555476
CODEN: MSFOEP
ISBN-13: 9783037856093
Document type: Conference article (CA)
Conference name: Chinese Materials Congress 2012, CMC 2012
Conference date: July 13, 2012 - July 18, 2012
Conference location: Taiyuan, China
Conference code: 96431
Sponsor: 667
Publisher: Trans Tech Publications Ltd, Kreuzstrasse 10, Zurich-Durnten, CH-8635, Switzerland
Abstract: The copper alloy/30CrMnSi steel bi-metal composite materials were prepared by the
interface diffusion bonding method. The diffusion of elements close to the bonding interface was
studied and the formation and growth mechanism of dissolution layer were discussed as well.
The results showed that a diffusion transition layer could be formed with the different widths for
copper alloy/30CrMnSi steel integrated material. A diffusion transition layer was formed close to
30CrMnSi steel side due to the inter-diffusion of the alloy elements. The microstructure
characterization showed that no harmful brittle phase presented around the interface, and two
heterogeneous materials had a good metallurgical bonding. © (2013) Trans Tech Publications,
Switzerland.
Number of references: 14
Main heading: Interfaces (materials)
Controlled terms: Alloy steel - Characterization - Computer simulation - Copper -
Copper alloys - Diffusion - Diffusion bonding
Uncontrolled terms: 30CrMnSi steels - Diffusion transition - Heterogeneous materials
- Integrated materials - Interface diffusion - Metallurgical bonding - Microstructure
characterization - Transition layers
Classification code: 951 Materials Science - 931.1 Mechanics - 812.1 Ceramics -
723.5 Computer Applications - 545.3 Steel - 544.2 Copper Alloys - 544.1 Copper
DOI: 10.4028/www.scientific.net/MSF.749.168
Database: Compendex
Compilation and indexing terms, © 2013 Elsevier Inc.
13.
Accession number: 20131516189236
Title: Investigation on the preparation and properties of mocu gradientmaterial
Authors: Yang, Xiaohong1 ; Zhang, Nina1 ; Xiao, Peng1 ; You, Caiyin1/杨晓红;张妮娜;肖鹏;游才
印
Author affiliation: 1 School of Materials Science and Engineering, Xi'an University of
Technology, Xi'an 710048, China
Corresponding author: Yang, X. ([e-mail])
Source title: Materials Science Forum
Abbreviated source title: Mater. Sci. Forum
Volume: 749