Specifications

Airborne DP550 Family Databook Quatech, Inc.
100-8090-100 4/14/2011 33
11.0 Recommended Footprint
Figure 7 - Recommended PCB Footprint
15.90mm
Ø5.00mm (X4)
Device Standoff Keepout Area
Ø2.30mm (X4)
Board outline
Dimensions: mm
Tolerance: ± 0.15 (unless noted)
29.60mm MAX
40.60mm MAX
2
1
36
35
Hirose DF12(4.0)-36DP-0.5V
21.00mm
32.00mm
16.00mm
10.50mm
VIEWED FROM TOP
11.1 Mounting Hole Specification
The mounting hole specification is important to maintain a tight and reliable
friction based interference between the host PCB and the DP550 stand-off
hardware.
Nominal Radius: 2.2mm
Tolerance: +0.15mm/-0.00mm
Host Board Thickness: 0.8mm to 1.6mm
11.2 Alternate Mounting Hardware
Quatech does support alternate mounting hardware for the DP550 platform.
Please contact your Quatech sales representative for further details.