User's Manual
Table Of Contents
- Contents
- Table Index
- Figure Index
- 0. Revision history
- 1. Introduction
- 2. Product concept
- 3. Application interface
- 3.1. Pin
- 3.2. Operating modes
- 3.3. Power supply
- 3.4. Power on and down scenarios
- 3.5. Charging interface
- 3.6. Power saving
- 3.7. Summary of state transitions
- 3.8. RTC backup
- 3.9. Serial interfaces
- 3.10. Audio interfaces
- 3.11. SIM card interface
- 3.12. SD card interface
- 3.13. PCM interface
- 3.14. ADC
- 3.15. Behaviors of the RI
- 3.16. Network status indication
- 3.17. Operating status indication
- 4. Antenna interface
- 5. Electrical, reliability and radio characteristics
- 6. Mechanical dimensions
- 7. Storage and manufacturing
- Appendix A: GPRS coding schemes
- Appendix B: GPRS multi-slot classes
M80 Hardware Design
M80_HD_V1.2 - 86 -
7. Storage and manufacturing
7.1. Storage
M80 is distributed in vacuum-sealed bag. The restriction of storage condition is shown as below.
Shelf life in sealed bag: 12 months at <40℃/ 90%RH
After this bag is opened, devices that will be subjected to reflow solder or other high temperature
process must be:
Mounted within 72 hours at factory conditions of ≤30℃/60% RH
Stored at <10% RH
Devices require bake before mounting, if:
Humidity indicator card is >10% when read at 23℃±5 ℃
Mounted exceed 72 hours at factory conditions of ≤30℃/60% RH
If baking is required, devices may be baked for 48 hours at 125℃±5 ℃
Note: As plastic container cannot be subjected to high temperature, devices must be removed
prior to high temperature (125
℃
) bake. If shorter bake times are desired, refer to
IPC/JEDECJ-STD-033 for bake procedure.