User's Manual
Table Of Contents
- Contents
- Table Index
- Figure Index
- 0. Revision history
- 1. Introduction
- 2. Product concept
- 3. Application interface
- 3.1. Pin
- 3.2. Operating modes
- 3.3. Power supply
- 3.4. Power on and down scenarios
- 3.5. Charging interface
- 3.6. Power saving
- 3.7. Summary of state transitions
- 3.8. RTC backup
- 3.9. Serial interfaces
- 3.10. Audio interfaces
- 3.11. SIM card interface
- 3.12. SD card interface
- 3.13. PCM interface
- 3.14. ADC
- 3.15. Behaviors of the RI
- 3.16. Network status indication
- 3.17. Operating status indication
- 4. Antenna interface
- 5. Electrical, reliability and radio characteristics
- 6. Mechanical dimensions
- 7. Storage and manufacturing
- Appendix A: GPRS coding schemes
- Appendix B: GPRS multi-slot classes
M80 Hardware Design
M80_HD_V1.2 - 87 -
7.2. Soldering
The squeegee should push the paste on the surface of the stencil that makes the paste fill the
stencil openings and penetrate to the PCB. The force on the squeegee should be adjusted so as to
produce a clean stencil surface on a single pass. To ensure the module soldering quality, the
thickness of stencil at the hole of the module pads should be 0.13mm for M80.
Figure 55: Paste application
Suggest peak reflow temperature is from 235 ºC to 245ºC (for SnAg3.0Cu0.5 alloy). Absolute
max reflow temperature is 260ºC. To avoid damage to the module when it was repeatedly heated,
it is suggested that the module should be mounted after the first panel has been reflowed. The
following picture is the actual diagram which we have operated.