Product Info
8
S
8.1. Sto
r
EC25 is sto
1. Shelf lif
e
2. After th
i
proces
s
M
o
St
o
3. Device
s
H
u
M
o
4. If bakin
g
As plastic c
container f
o
IPC/JEDE
C
8.2. Ma
n
The squee
g
openings a
n
clean stenc
the hole of
t
It is sugge
s
max reflow
NOTE
E
S
tora
g
r
age
red in avac
u
e
in sealed
b
i
s bag is op
s
es must be
:
o
unted withi
o
red at <10
%
s
require ba
k
u
midity indic
o
unted for
m
g
is require
d
ontainer ca
n
or
high tem
C
J-STD-033
n
ufacturi
g
ee should
n
d penetrat
e
il surface o
n
t
he module
s
ted that th
e
temperatu
r
E
C25-A_U
s
g
e a
n
u
um-sealed
b
ag is 12 m
o
ened, devic
:
n 72 hours
a
%
RH.
k
e before m
ator card is
m
ore than 7
2
d
, devices
m
n
not be sub
j
perature (1
for bakingp
ng and
W
push the p
a
e
to the PC
n
a single p
a
pads shoul
d
e
peak reflo
w
r
e is 260ºC
s
e
r
_Manual
C
n
d M
a
bag. The r
e
o
nths at <
4
es that will
a
t factory c
o
ounting, if:
>10% whe
n
2
hours at f
a
m
ay be bake
d
j
ected to hi
g
25ºC) baki
rocedure.
W
elding
a
ste on the
B. The forc
e
a
ss. To ens
u
d
be 0.18m
m
w
temperat
u
. To avoid
d
C
onfidenti
a
a
nuf
a
e
strictions o
f
4
0ºC/90%R
H
be subjecte
o
nditions of
≤
n
ambient t
e
a
ctory condi
t
d
for 48 ho
u
g
h temperat
u
ng. If sho
r
surface of
e
on the sq
u
u
re the mo
d
m
. For detail
u
re is 235 ~
d
amage to
a
l / Release
a
cturi
f
storage co
n
H
.
d to reflow
s
≤
30ºC/60%
e
mperature i
t
ions of ≤ 3
0
u
rs at 125ºC
u
re, the mo
d
r
ter baking
stencil,so
a
u
eegee sho
d
ule solderi
n
s, please re
245ºC (for
the modul
e
d 60 /
6
ng
n
dition ares
s
olde
r
ing o
r
RH.
s23ºC±5ºC.
0
ºC/60% RH
±5ºC.
d
ule needs
t
time is d
e
a
s to make
uld be adju
s
n
g quality, t
h
fer to
docu
m
SnAg3.0Cu
e
when it is
L
EC25-AU
6
9
hown as be
r
other high
.
t
o be taken
e
sired, ple
a
the paste fi
s
ted so as
t
h
e thicknes
s
m
ent
[
4]
.
0.5 alloy).
T
repeatedly
L
TE Modul
e
ser Manu
a
low.
temperatur
e
out from th
e
a
se refer t
o
ll the stenc
i
t
o produce
a
s
of stencil
a
T
he absolut
e
heated, it i
s
e
a
l
e
e
o
i
l
a
a
t
e
s