EM120R-GL&EM160R-GL Hardware Design LTE-A Module Series Rev. EM120R-GL&EM160R-GL_Hardware_Design_V1.0 Date: 2020-07-02 Status: Preliminary www.quectel.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit: http://www.quectel.com/support/sales.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design About the Document Revision History Version Date Author Description 1.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Contents About the Document ................................................................................................................................... 2 Contents ....................................................................................................................................................... 3 Table Index.......................................................................................................................
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.12. Antenna Tuner Control Interfaces*............................................................................................ 51 3.12.1. Antenna Tuner Control Interface through GPIOs .......................................................... 51 3.12.2. Antenna Tuner Control Interface through RFFE............................................................ 51 3.13. Configuration Pins ...............................................................
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Table Index Table 1: Frequency Bands and GNSS Types of EM120R-GL&EM160R-GL .............................................11 Table 2: Definition of I/O Parameters ......................................................................................................... 18 Table 3: Pin Description..............................................................................................................................
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Table 42: Related Documents .................................................................................................................... 77 Table 43: Terms and Abbreviations ............................................................................................................
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Figure Index Figure 1: Functional Diagram ..................................................................................................................... 14 Figure 2: Pin Assignment ........................................................................................................................... 17 Figure 3: Power Supply Limits during Radio Transmission .......................................................................
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Figure 42: Top View of the Module............................................................................................................. 73 Figure 43: Bottom View of the Module ....................................................................................................... 73 Figure 44: Top View of the Module.............................................................................................................
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 1 Introduction This document defines EM120R-GL&EM160R-GL and describes its air interfaces and hardware interfaces which are connected to customers’ applications. This document is applicable to the following modules: ⚫ ⚫ EM120R-GL EM160R-GL This document can help customers quickly understand the interface specifications, electrical and mechanical details, as well as other related information of EM120R-GL&EM160R-GL.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating EM120R-GL&EM160R-GL modules. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 2 Product Concept 2.1. General Description EM120R-GL&EM160R-GL are LTE-A/UMTS/HSPA+ wireless communication modules with receive diversity. It provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA networks with standard PCI Express M.2 interface. It supports embedded operating systems such as Windows, Linux and Android, and provides GNSS and voice functionality 2) to meet customers’ specific application demands.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design carrier. 4. 4) EM160R-GL supports up to 4 × 4 MIMO in DL direction. 5. 5) MIMO antennas only apply for EM160R-GL. 6. For details about CA combinations, refer to document [1]. EM120R-GL&EM160R-GL can be applied in the following fields: ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ Tablet PC and Laptop Remote Monitor System Vehicle System Wireless POS System Smart Metering System Wireless Router and Switch Other Wireless Terminal Devices 2.2.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design UMTS Features Support 3GPP R9 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA Support QPSK, 16QAM and 64QAM modulation ⚫ DC-HSDPA: Max 42 Mbps (DL) ⚫ HSUPA: Max 5.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Extended temperature range: -40 °C to +85 °C 2) Storage temperature range: -40 °C to +90 °C Firmware Upgrade USB 2.0 interface, PCIe interface and DFOTA RoHS All hardware components are fully compliant with EU RoHS directive NOTES 1. 2. 3. 1) Within operating temperature range, the module is 3GPP compliant.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design NOTE MIMO1 and MIMO2 antennas are only applicable to the EM160R-GL module. 2.4. Evaluation Board To help customers develop applications conveniently with EM120R-GL&EM160R-GL, Quectel supplies the evaluation board (M.2 EVB), USB to RS-232 converter cable, USB type-C cable, earphone, antenna and other peripherals to control or test the module. For more details, refer to document [2].
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3 Application Interfaces The physical connections and signal levels of EM120R-GL&EM160R-GL comply with PCI Express M.2 specifications.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.1. Pin Assignment The following figure shows the pin assignment of EM120R-GL&EM160R-GL. The top side contains EM120R-GL&EM160R-GL and antenna connectors. No.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.2. Pin Description The following tables show the pin definition and description of EM120R-GL&EM160R-GL. Table 2: Definition of I/O Parameters Type Description AI Analog Input AO Analog Output DI Digital Input DO Digital Output IO Bidirectional OD Open Drain PI Power Input PO Power Output Table 3: Pin Description Pin No. M.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design off. When it is at high level, the module is powered on. 7 USB_D+ USB_DP AI/AO USB 2.0 differential data bus (+) 8 W_DISABLE1# W_DISABLE1# DI Airplane mode control. Active low. 9 USB_D- USB_DM AI/AO USB 2.0 differential data bus (-) 10 GPIO_9 WWAN_LED# OD RF status indication. Active low.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 25 DPR DPR DI Dynamic power reduction. Active low. 1.8 V power domain. 26 GPIO_10 (W_DISABLE2#) W_DISABLE2# DI GNSS enable control. Active low. 1.8/3.3 V power domain 27 GND GND 28 GPIO_8 (AUDIO_3) PCM_SYNC IO PCM data frame synchronization 29 USB3.0-TX- USB_SS_TX_M AO USB 3.0 transmit data (-) 30 UIM-RESET USIM1_RST DO (U)SIM1 card reset 31 USB3.0-TX+ USB_SS_TX_P AO USB 3.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 45 GND GND 46 GPIO_3 (SIM_RST2) USIM2_RST DO (U)SIM2 card reset 47 PERn0 PCIE_RX_M AI PCIe receive data (-) 48 GPIO_4 (SIM_PWR2) USIM2_VDD PO Power supply for (U)SIM2 card 49 PERp0 PCIE_RX_P AI PCIe receive data (+) 50 PCIE_RST_N PCIE_RST_N DI PCIe reset input. Active low. 51 GND GND 52 PCIE_CLKREQ_ N PCIE_CLKREQ_N DO PCIe clock request. Active low.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design domain. 67 RESET# RESET# 68 SUSCLK (32kHz) ANT_CONFIG 69 CONFIG_1 CONFIG_1 70 3.3V VCC 71 GND GND 72 3.3V VCC 73 GND GND 74 3.3V VCC 75 CONFIG_2 CONFIG_2 DI DI WWAN reset input Active low. Pulled up internally. 1.8 V power domain. Antenna configuration Pulled up internally. 1.8 V power domain. Connected to GND internally PI Power supply Vmin = 3.135 V Vnorm = 3.7 V Vmax = 4.4 V Ground PI Power supply Vmin = 3.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.3. Power Supply The following table shows definition of VCC pins and ground pins. Table 4: Pin Definition of VCC and GND Pin No. Pin Name I/O Power Domain Description 2, 4, 70, 72, 74 VCC PI 3.135–4.4 V 3.7 V typical DC supply 3, 5, 11, 27, 33, 39, 45, 51, 57, 71, 73 GND Ground 3.3.1. Decrease Voltage Drop The power supply range of the module is from 3.135 V to 4.4 V. Make sure that the input voltage never drops below 3.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design circuit of VCC. VCC Module VCC + D1 5.1 V C2 C1 220 μF C3 C4 C5 1 μF 100 nF 33 pF 10 pF Figure 4: Reference Circuit of VCC 3.3.2. Reference Design for Power Supply Power design for the module is very important, as the performance of the module largely depends on the power source. The power supply can provide sufficient current (at least 2.5 A).
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design NOTE In order to avoid damages to the internal flash, do not cut off the power supply directly when the module is working. It is suggested that the power supply should be cut off after the module is shut down. 3.4. Turn-on and Turn-off Scenarios 3.4.1. Turn on the Module Pulling up the FULL_CARD_POWER_OFF# pin will power on the module. The following table shows the pin definition of FULL_CARD_POWER_OFF#.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.4.1.2. Turn on the Module Automatically If FULL_CARD_POWER_OFF# is pulled up to VCC with a 5–10 kΩ resistor, the module will be powered on automatically when the power supply for VCC is applied. A reference circuit is shown in the following figure. Host Module VCC_IO_HOST R1 10K 6 GPIO FULL_CARD_POWER_OFF# GND GND Notes: 1. The voltage of pin 6 should be no less than 1.19 V when it is at HIGH level. 2.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design The turn-on scenario is illustrated in the following figure. VCC T1 RESET# T2 FULL_CARD_POWER_OFF# T3 DPR/ANT_CONFIG T4 PCIE_RST_N Typical 11.6 s Booting OFF Active Figure 9: Turn-on Timing of the Module Table 6: Description of Turn-on Timing of the Module Index Min. Typical Max. Comment T1 0 ms 50 ms - RESET# is pulled up internally, and it would be de-asserted 50 ms after VCC is powered on.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.4.2. Turn off the Module 3.4.2.1. Turn off the Module through FULL_CARD_POWER_OFF# Pulling down the FULL_CARD_POWER_OFF# pin will turn off the module. The turn-off scenario is illustrated in the following figure. VCC T3 FULL_CARD_POWER_OFF# T2 RESET# PCIE_RST_N T1 Figure 10: Timing of Turning off the Module through FULL_CARD_POWER_OFF# Table 7: Description of the Timing of Resetting the Module througn FULL_CARD_POWER_OFF# Index Min.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design VCC RESET#(H) AT+QPOWD USB/PCIe USB/PCIe remove FULL_CARD_POWER_OFF# Module Status Running Power-off procedure OFF Figure 11: Timing of Turning off the Module through AT Command and FULL_CARD_POWER_OFF# For the circuit design of Figure 7, cut off power supply of VCC after the module’s USB/PCIe is removed, as illustrated in Figure 11. Otherwise, the module will be powered on again.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.5. Reset The RESET# pin is used to reset the module. The module can be reset by driving RESET# to a low-level voltage for 200–700 ms. Table 8: Pin Definition of RESET# Pin Name Pin No. Description DC Characteristics Comment RESET# 67 Reset the module VIHmax = 2.1 V VIHmin = 1.3 V VILmax = 0.5 V Pulled up internally. 1.8 V power domain. An open collector/drain driver or button can be used to control the RESET# pin. Host Module VDD 1.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Host Module VDD 1.8 V R1 100K RESET_N Reset pulse GPIO R4 10Ω 67 Reset Logic Q2 NMOS R5 100K 200–700 ms Figure 14: Reference Circuit of RESET_N with NMOS Driving Circuit Module VDD 1.8 V R1 100K RESET_N 67 Reset Logic S1 TVS C1 33 pF 200–700 ms Note: The capacitor C1 is recommended to be less than 47 pF.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design The reset scenario is illustrated in the following figure. VCC (H) FULL_CARD_POWER_OFF# T2 RESET# T3 T5 T1 PCIE_RST_N T4 Figure 16: Timing of Resetting the Module Table 9: Timing of Resetting the Module Index Min. Typical Max. Comments T1 0 ms 20 ms - PCIE_RST_N should be asserted before RESET#.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Table 10: Pin Definition of (U)SIM Interfaces Pin Name Pin No. I/O Description Comment USIM1_VDD 36 PO Power supply for (U)SIM1 card Either 1.8 V or 3.0 V is supported by the module automatically. USIM1_DATA 34 IO (U)SIM1 card data USIM1_CLK 32 DO (U)SIM1 card clock USIM1_RST 30 DO (U)SIM1 card reset USIM1_DET 66 DI (U)SIM1 card insertion detection. Active high. Internally pulled up.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design The following figure shows a reference design for a (U)SIM interface with normally closed (U)SIM card connector.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Normally Open (U)SIM Card Connector: ⚫ ⚫ When the (U)SIM is absent, CD is open to SW and USIM_DET is at low level. When the (U)SIM is inserted, CD is short-circuited to SW and USIM_DET is at high level. If (U)SIM card detection function is not needed, keep USIM_DET unconnected. The following figure shows a reference circuit for a (U)SIM card interface with a 6-pin (U)SIM card connector.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design A recommended compatible design of (U)SIM2 interface is shown below. USIM2_VDD Module eSIM USIM2_VDD 48 0Ω USIM2_RST 46 0Ω 22Ω USIM2_CLK 22Ω 44 0Ω USIM2_DET 40 0Ω USIM2_DATA 42 0Ω 10-20K (U)SIM Card Connector 100 nF VCC VPP RST CLK CD 22Ω IO GND GND 33 pF33 pF33 pF TVS Note: The five 0Ω resistors must be close to M.2 socket connector, and all other components should be close to (U)SIM card connector in PCB layout.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.7. USB Interface EM120R-GL&EM160R-GL provide one integrated Universal Serial Bus (USB) interface which complies with the USB 3.0/2.0 specifications and supports super speed (5 Gbps) on USB 3.0, high speed (480 Mbps) and full speed (12 Mbps) modes on USB 2.0. The USB interface is used for AT command communication, data transmission, GNSS NMEA sentences output, software debugging, firmware upgrade and voice over USB*.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design The USB 2.0 interface is recommended to be reserved for firmware upgrade in customers’ designs. The following figure shows a reference circuit of USB 3.0/USB 2.0 interface.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design NOTE “*” means under development. 3.8. PCIe Interface EM120R-GL and EM160R-GL provide one integrated PCIe (Peripheral Component Interconnect Express) interface which complies with the PCI Express Specification, Revision 2.1 and supports 5 Gbps per lane. The PCIe interface is used for data transmission, GNSS NMEA sentences output, software debugging and firmware upgrade. The following table shows the pin definition of PCIe interface.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.8.1. Endpoint Mode EM120R-GL and EM160R-GL support endpoint (EP) mode. In this mode, the modules are configured as a PCIe EP device. The following figure shows a reference circuit of PCIe endpoint mode.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Figure 23: PCIe Power-on Timing Requirements of M.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Table 13: Description of PCIe Power-on Timing Requirements of the Module Index Min. Typical Max. T1 0 ms 20 ms - T2 - 50 ms - T3 - 70 ms - T4 - 100 ms - T5 100 μs - - Comment FULL_CARD_POWER_OFF# could be de-asserted before or after RESET#, 20 ms is a recommended value when it is controlled by GPIO. RESET# is pulled up internally, and it would be de-asserted 50 ms after VCC is powered on.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.9. PCM Interface* EM120R-GL&EM160R-GL support audio communication via Pulse Code Modulation (PCM) digital interface. The PCM interface supports the following modes: ⚫ ⚫ Primary mode (short frame synchronization, works as both master and slave) Auxiliary mode (long frame synchronization, works as master only) In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 125 μs 1 PCM_CLK 2 31 32 PCM_SYNC MSB LSB MSB LSB PCM_OUT PCM_IN Figure 26: Auxiliary Mode Timing The following table shows the pin definition of PCM interface which can be applied on audio codec design. Table 14: Pin Definition of PCM Interface Pin Name Pin No. I/O Description Comment PCM_DIN 22 DI PCM data input 1.8 V power domain PCM_DOUT 24 DO PCM data output 1.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design NOTE “*” means under development. 3.10. Control and Indicator Signals* The following table shows the pin definition of control and indicator signals. Table 15: Definition of Control and Indicator Signals Pin Name Pin No. I/O Power Domain Description WWAN_LED# 10 OD 3.3 V RF status indication. Active low. WAKE_ON_WAN# 23 OD 1.8/3.3 V Wake up the host. Active low. W_DISABLE1# 8 DI 1.8/3.3 V Airplane mode control. Active low.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Table 16: RF Function Status W_DISABLE1# Level AT Commands RF Function Status High Level AT+CFUN=1 Enabled High Level AT+CFUN=0 AT+CFUN=4 Disabled Low Level AT+CFUN=0 AT+CFUN=1 AT+CFUN=4 Disabled 3.10.2. W_DISABLE2# Signal EM120R-GL&EM160R-GL provide a W_DISABLE2# pin to disable or enable the GNSS function. The W_DISABLE2# pin is pulled up by default. Driving it to low level will disable the GNSS function.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design A simple level shifter based on diodes is used on W_DISABLE1# pin and W_DISABLE2# pin which are pulled up to a 1.8 V voltage in the module, as shown in the following figure. So, the control signals (GPIO) of the host device could be a 1.8 V or 3.3 V voltage level and pull-up resistor is not needed on the host side. These two signals are active low, and a reference circuit is shown below. Host Module VCC_IO_HOST R1 10K VDD 1.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design The following table shows the RF status indicated by WWAN_LED# signal. Table 18: RF Status Indications of WWAN_LED# Signal WWAN_LED# Level LED RF Status Low Level On On High Level Off Off NOTE RF function is turned off if any of the following circumstances occurs: ⚫ The (U)SIM card is not working. ⚫ W_DISABLE1# signal is at low level (airplane mode enabled). 3.10.4.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Host Module VCC_IO_HOST R1 10K WAKE_ON_WAN# 23 GPIO H BB 1s L Wake up the host Note: The voltage level on VCC_IO_HOST depends on the host side due to open drain in pin 23. Figure 29: WAKE_ON_WAN# Signal Reference Circuit Design 3.10.5. DPR EM120R-GL&EM160R-GL provide a DPR (Dynamic Power Reduction) signal for body SAR (Specific Absorption Rate) detection.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.10.6. ANT_CONFIG Signal EM160R-GL provides an ANT_CONFIG signal for antenna configuration, however, EM120R-GL does not support it since EM120R-GL only supports 2 antennas. The signal is sent by a host system to EM160R-GL module. ANT_CONFIG is an input port which is pulled high internally by default. The definition of ANT_CONFIG signal is shown as below table.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.12. Antenna Tuner Control Interfaces* ANTCTL [0:3] and RFFE signals are used for antenna tuner control and should be routed to an appropriate antenna control circuit. More details about the interface will be added in a future version of the document. 3.12.1. Antenna Tuner Control Interface through GPIOs Table 23: Pin Definition of Antenna Tuner Control Interface through GPIOs Pin Name Pin No.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.13. Configuration Pins EM120R-GL&EM160R-GL provide four configuration pins which are defined as below. 3.13.1. EM160R-GL configuration pins Table 25: List of EM160R-GL Configuration Pins Pin No. Pin Name Power Domain Description 21 CONFIG_0 0 NC 69 CONFIG_1 0 Connected to GND internally. 75 CONFIG_2 0 NC 1 CONFIG_3 0 NC The following figure shows a reference circuit of these four pins.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Table 26: List of EM160R-GL Configuration Pins Config_0 (Pin 21) Config_1 (Pin 69) Config_2 (Pin 75) Config_3 (Pin 1) Module Type and Main Host Interface Port Configuration NC GND NC NC Vender defined N/A 3.13.2. EM120R-GL configuration pins Table 27: List of EM120R-GL Configuration Pins Pin No. Pin Name Power Domain Description 21 CONFIG_0 0 Connected to GND internally. 69 CONFIG_1 0 Connected to GND internally.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Table 28: List of EM120R-GL Configuration Pins Config_0 (Pin 21) Config_1 (Pin 69) Config_2 (Pin 75) Config_3 (Pin 1) Module Type and Main Host Interface Port Configuration GND GND NC NC Vender defined N/A EM120R-GL&EM160R-GL_Hardware_Design 54 / 79
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 4 GNSS Receiver 4.1. General Description EM120R-GL&EM160R-GL include a fully integrated global navigation satellite system solution that supports Gen9-Lite of Qualcomm (GPS, GLONASS, BeiDou/Compass and Galileo). The modules support standard NMEA-0183 protocol, and output NMEA sentences at 1 Hz data update rate via USB interface by default. By default, EM120R-GL&EM160R-GL GNSS engine is switched off. It can only be switched on via AT command.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 5 Antenna Connection EM120R-GL and EM160R-GL provide Main, Rx-diversity/GNSS and MIMO antenna connectors 1) which are used to resist the fall of signals caused by high speed movement and multipath effect. The impedance of antenna ports is 50 Ω. EM160R-GL provides a Main, an Rx-diversity/GNSS and two MIMO antenna connectors. EM120R-GL provides a Main and an Rx-diversity/GNSS antenna connectors. 5.1.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Figure 33: Antenna Connectors on the EM120R-GL Module 5.1.1.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design LTE B1 1920–1980 2110–2170 MHz LTE B2 1850–1910 1930–1990 MHz LTE B3 1710–1785 1805–1880 MHz LTE B4 1710–1755 2110–2155 MHz LTE B5 824–849 869–894 MHz LTE B7 2500–2570 2620–2690 MHz LTE B8 880–915 925–960 MHz LTE B12 699–716 729–746 MHz LTE B13 777–787 746–756 MHz LTE B14 788–798 758–768 MHz LTE B17 704–716 734–746 MHz LTE B18 815–830 860–875 MHz LTE B19 830–845 875–890 MHz LTE B20 832–862 791–821
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design LTE B43 3600–3800 3600–3800 MHz LTE B46 1) 5150–5925 5150–5925 MHz LTE B48 3550–3700 3550–3700 MHz LTE B66 1710–1780 2110–2200 MHz NOTE 1) LTE-FDD B29/32 and LTE-TDD B46 support Rx only and are only for secondary component carrier. 5.2. GNSS Antenna Connector The following table shows frequency specification of GNSS antenna connector. Table 30: GNSS Frequency Type Frequency Unit GPS/Galileo 1575.42 ±1.023 MHz GLONASS 1601.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 5.3. Antenna Installation 5.3.1. Antenna Requirements The following table shows the requirements on Main, Rx-diversity/GNSS and MIMO antennas. Table 31: Antenna Requirements of EM160R-GL Type Requirements Main Antenna (Tx/Rx) VSWR: ≤ 2 Efficiency: > 30% Max Input Power: 50 W Input Impedance: 50 Ω Cable Insertion Loss: < 1 dB (699–960 MHz) Cable Insertion Loss: < 1.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Cable Insertion Loss: < 2 dB (2300–2690 MHz) MIMO2 Antenna (Rx) VSWR: ≤ 2 Efficiency: > 30% Max Input Power: 50 W Input Impedance: 50 Ω Cable Insertion Loss: < 1 dB (699–960 MHz) Cable Insertion Loss: < 1.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 5.3.2. Recommended RF Connector for Antenna Installation EM120R-GL and EM160R-GL are mounted with standard 2 mm × 2 mm receptacle RF connectors for convenient antenna connection.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design The following figure shows the specifications of mating plugs using Ø0.81 mm coaxial cables. Figure 35: Specifications of Mating Plugs Using Ø0.81 mm Coaxial Cables The following figure illustrates the connection between the receptacle RF connector on EM120R-GL&EM160R-GL and the mating plug using a Ø0.81 mm coaxial cable. Figure 36: Connection between RF Connector and Mating Plug Using Ø0.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 6 Electrical, Reliability and Radio Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the modules are listed in the following table. Table 34: Absolute Maximum Ratings Parameter Min. Max. Unit VCC -0.3 4.7 V Voltage at Digital Pins -0.3 2.3 V 6.2. Power Supply Requirements The typical input voltage of EM120R-GL&EM160R-GL is 3.7 V, as specified by PCIe M.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 6.3. I/O Requirements Table 36: I/O Requirements Parameter Description Min. Max. Unit VIH Input high voltage 0.7 × VDD18 1) VDD18 + 0.3 V VIL Input low voltage -0.3 0.3 × VDD18 V VOH Output high voltage VDD18 - 0.5 VDD18 V VOL Output low voltage 0 0.4 V NOTE 1) VDD18 refers to I/O power domain. 6.4. Operation and Storage Temperatures Table 37: Operation and Storage Temperatures Parameter Min. Typ. Max.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Pout might reduce in their values and exceed the specified tolerances. When the temperature returns to the normal operating temperature level, the module will meet 3GPP specifications again. 6.5. Current Consumption Table 38: EM120R-GL&EM160R-GL Current Consumption Parameter Description Conditions Typ. Unit IVCC OFF state Power down TBD μA 6.6. RF Output Power The following table shows the RF output power of EM120R-GL&EM160R-GL.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 6.7. RF Receiving Sensitivity The following tables show conducted RF min. receiving sensitivity of EM120R-GL and EM160R-GL. Table 40: EM120R-GL&EM160R-GL Conducted RF Min. Receiving Sensitivity Frequency Primary Diversity SIMO 1) SIMO 2) (Worst Case) WCDMA B1 -111 -110 -110.5 -106.7 dBm WCDMA B2 -109.5 -110 -110 -104.7 dBm WCDMA B3 -109.5 -110.5 -111 -103.7 dBm WCDMA B4 TBD TBD TBD -106.7 dBm WCDMA B5 -111 -111 -112 -104.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design LTE-FDD B19 (10 MHz) -99.7 -99 -102 -96.3 dBm LTE-FDD B20 (10 MHz) -99.7 -99.5 -102.2 -93.3 dBm LTE-FDD B25 (10 MHz) -97.8 -97.6 -100.3 -92.8 dBm LTE-FDD B26 (10 MHz) -99.4 -99.1 -101.9 -93.8 dBm LTE-FDD B28 (10 MHz) -99.3 -99.6 -102.1 -94.8 dBm LTE-FDD B30 (10 MHz) -96 -97.4 -99.5 -95.3 dBm LTE-TDD B38 (10 MHz) -98.4 -97 -100.1 -96.3 dBm LTE-FDD B39 (10 MHz) -98.4 -97.5 -100.5 -96.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design The following table shows the modules’ electrostatic discharge characteristics. Table 41: Electrostatic Discharge Characteristics (Temperature: 25 ºC, Humidity: 40%) Interfaces Contact Discharge Air Discharge Unit VCC, GND TBD TBD kV Antenna Interfaces TBD TBD kV Other Interfaces TBD TBD kV 6.9. Thermal Dissipation EM120R-GL&EM160R-GL are designed to work over an extended temperature range.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design There are some other measures to enhance heat dissipation performance: ⚫ Add ground vias as many as possible on PCB. ⚫ Maximize airflow over/around the module. ⚫ Place the module away from other heating sources. ⚫ Module mounting holes must be used to attach (ground) the device to the main PCB ground. ⚫ It is NOT recommended to apply solder mask on the main PCB where the module’s thermal dissipation area is located.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 7 Mechanical Dimensions and Packaging This chapter mainly describes mechanical dimensions and packaging specifications of EM120R-GL&EM160R-GL. All dimensions are measured in mm, and the dimensional tolerances are ±0.05 mm unless otherwise specified. 7.1.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 7.2. Standard Dimensions of M.2 PCI Express The following figure shows the standard dimensions of M.2 PCI Express, refer to document [6]. Figure 40: Standard Dimensions of M.2 Type 3042-S3 (Unit: mm) According to M.2 nomenclature, EM120R-GL&EM160R-GL are Type 3042-S3-B (30.0 mm × 42.0 mm, max component height on the top is 1.5 mm and single-sided, key ID is B). Figure 41: M.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 7.3. Design Effect Drawings of the Module 7.3.1.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 7.3.2. Design Renderings of EM120R-GL Module Figure 44: Top View of the Module Figure 45: Bottom View of the Module NOTE These are renderings of EM120R-GL&EM160R-GL. For authentic appearance, refer to the modules that you receive from Quectel.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 7.4. M.2 Connector EM120R-GL&EM160R-GL adopt a standard PCI Express M.2 connector which compiles with the directives and standards listed in the document [6]. 7.5. Packaging EM120R-GL&EM160R-GL are packaged in trays. The following figure shows the tray size. Figure 46: Tray Size (Unit: mm) Each tray contains 10 modules. The smallest package contains 100 modules. Tray packaging procedures are as below. 1. 2. 3. 4. 5. 6.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Figure 47: Tray Packaging Procedure EM120R-GL&EM160R-GL_Hardware_Design 76 / 79
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 8 Appendix References Table 42: Related Documents SN Document Name Remark [1] Quectel_EM120R-GL&EM160R-GL_CA_Feature EM120R-GL&EM160R-GL CA Feature [2] Quectel_M.2_EVB_User_Guide M.
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design GPS Global Positioning System GSM Global System for Mobile Communications HSPA High Speed Packet Access HSUPA High Speed Uplink Packet Access kbps Kilo Bits Per Second LED Light Emitting Diode LTE Long Term Evolution Mbps Million Bits Per Second ME Mobile Equipment (Module) MIMO Multiple-Input Multiple-Output MLCC Multiplayer Ceramic Chip Capacitor MMS Multimedia Messaging Service MO Mobile Originated MT Mobile Terminated P
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design (U)SIM (Universal) Subscriber Identification Module WCDMA Wideband Code Division Multiple Access EM120R-GL&EM160R-GL_Hardware_Design 79 / 79
FCC KDB996369 D03v01 Requirements List of applicable FCC rules FCC Part 15 Subpart B, Part 22 Subpart H, Part 24 Subpart E, Part 27 Subpart D & L & H & F & M & N, Part 90 Subpart R & S, Part 96 Summarize the specific operational use conditions Not Applicable Limited module procedures Not Applicable Trace antenna designs Refer to Manual Section 4 RF exposure considerations Refer to FCC certification requirements Antennas Technology Frequency Range (MHz) WCDMA & LTE Band 2 1850 ~ 1910 1.
Additional testing, Part 15 Subpart B disclaimer Refer to FCC 15B Report
FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met: 1. This Modular Approval is limited to OEM installation for mobile and fixed applications only.
provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesir ed operation. Changes or modifications not expressly approved by the manufacturer could void the user's authority to operate the equipment.
IC Statement IRSS-GEN This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may ca use undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
Antennes Technologie Gamme de Type d'antenne Gain de crête fréquences (MHz) maximum (dBi) WCDMA & LTE Band 2 1850 ~ 1910 1.15 WCDMA & LTE Band 4 1710 ~ 1755 -0.50 WCDMA & LTE Band 5 824 ~ 849 1.85 LTE Bande 7 2500 ~ 2570 1.32 LTE Bande 12 699 ~ 716 -2.43 LTE Bande 13 777 ~ 787 LTE Bande 14 788 ~ 798 LTE Bande 25 1850 ~ 1915 1.15 LTE Bande 30 2305 ~ 2315 -3.64 LTE Bande 38 2570 ~ 2620 0.93 LTE Bande 41 2500 ~ 2690 0.93 LTE Bande 66 1710 ~ 1780 -0.50 Dipole -0.10 2.
