BG G96 6-NA A Hardw warre Des D sign n LTEM Module Series S Rev. BG96-NA A_Hardware_Desiign_V1.0 4-28 Date: 2017-04 www.quectel.
LTE Module Series BG96-NA Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters: Quectel Wireless Solutions Co., Ltd. Office 501, Building 13, No.99, Tianzhou Road, Shanghai, China, 200233 Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit: http://www.quectel.com/support/salesupport.
LTE Module Series BG96-NA Hardware Design About the Document History Revision Date Author Description 1.
LTE Module Series BG96-NA Hardware Design Contents About the Document ................................................................................................................................ 2 Contents .................................................................................................................................................... 3 Table Index ..........................................................................................................................................
LTE Module Series BG96-NA Hardware Design 3.16. USB_BOOT Interface............................................................................................................ 42 4 GNSS Receiver ................................................................................................................................ 43 4.1. General Description .............................................................................................................. 43 4.2. GNSS Performance .....................
LTE Module Series BG96-NA Hardware Design Table Index TABLE 1: FREQUENCY BANDS OF BG96-NA MODULE ................................................................................ 12 TABLE 2: KEY FEATURES OF BG96-NA ......................................................................................................... 13 TABLE 3: I/O PARAMETERS DEFINITION ....................................................................................................... 18 TABLE 4: PIN DESCRIPTION .....................
LTE Module Series BG96-NA Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 15 FIGURE 2: PIN ASSIGNMENT (TOP VIEW) .................................................................................................... 17 FIGURE 3: SLEEP MODE APPLICATION VIA UART .......................................................................................
LTE Module Series BG96-NA Hardware Design 1 Introduction This document defines the BG96-NAmodule and describes its air interface and hardware interface which are connected with your application. This document can help you quickly understand module interface specifications, electrical andmechanical details, etc. Associated with application note and user guide, you can use BG96-NA module to design and set up mobile applications easily.
LTE Module Series BG96-NA Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating BG96-NA module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product.
LTE Module Series BG96-NA Hardware Design 1.2 FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met: 1. This Modular Approval is limited to OEM installation for mobile and fixed applications only.
LTE Module Series BG96-NA Hardware Design If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8.
LTE Module Series BG96-NA Hardware Design This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate the equipment.
LTE Module Series BG96-NA Hardware Design 2 Product Concept 2.1. General Description BG96-NAmodule is anembeddedIoT(LTE CatM1) wireless communication modulewithout receive diversity. It supportsHalf-duplex LTE-FDD wireless communication, whichprovides data connectivity on LTE-FDDnetworks. The following table shows the frequency bands of BG96-NA module.
LTE Module Series BG96-NA Hardware Design 2.2. Key Features The following table describes the detailed features of BG96-NA module. Table 2: Key Features of BG96-NA Features Details Power Supply Supply voltage: 3.3V~4.3V Typical supply voltage: 3.8V Transmitting Power Class 3 (23dBm±2.7dB) for LTE-FDD bands LTE Features Support up to LTE Cat M1 Support 1.08MHz RF bandwidth Support SISO in DL direction Cat M1: Max.
LTE Module Series BG96-NA Hardware Design Antenna Interfaces Including main antenna (ANT_MAIN) and GNSS antenna (ANT_GNSS) interfaces Physical Characteristics Size: 22.5mm ×26.5mm×2.3mm Weight: 3.1g Temperature Range Operation temperature range: -35°C ~ +75°C1) Extended temperature range: -40°C ~ +85°C2) Firmware Upgrade USB interface and DFOTA* RoHS All hardware components are fully compliant with EU RoHS directive NOTES 1. 2.
LTE Module Series BG96-NA Hardware Design Figure 1: Functional Diagram NOTE “*” means under development. 2.4. Evaluation Board In order to help customers develop applications conveniently with BG96-NA, Quectel supplies theevaluation board (EVB), USB data cable, earphone, antenna and other peripherals to control or test the module.
LTE Module Series BG96-NA Hardware Design 3 Application Interfaces 3.1. General Description BG96-NAis equipped with 62-pin 1.1mm pitch SMT pads plus 40-pin ground pads and reserved pads that can be connected to customers’ cellular application platform.
LTE Module Series BG96-NA Hardware Design 3.2. Pin Assignment The following figure shows the pin assignment of the BG96-NA module. Figure 2: Pin Assignment (Top View) NOTES 1. 2. 3. 4. Keep all RESERVEDpins and unused pins unconnected. GND pads should be connected to ground in the design. 1) PWRKEY output voltage is 0.8V because of the diode drop in the Qualcomm chipset. “*” means under development.
LTE Module Series BG96-NA Hardware Design 3.3. Pin Description The following tables show the pin definition and description of BG96-NA. Table 3: I/O Parameters Definition Type Description IO Bidirectional DI Digital input DO Digital output PI Power input PO Power output AI Analog input AO Analog output OD Open drain Table 4: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics VBAT_BB 32, 33 PI Power supply for module baseband part. Vmax=4.3V Vmin=3.
LTE Module Series BG96-NA Hardware Design Turn on/off Pin Name PWRKEY RESET_N I/O Description DC Characteristics Comment DI Turnon/off the module VIHmax=2.1V VIHmin=1.3V VILmax=0.5V The output voltage is0.8V because of thediode drop in theQualcomm chipset. DI Reset the module VIHmax=2.1V VIHmin=1.3V VILmax=0.5V If unused, keep this pin open. I/O Description DC Characteristics Comment OD Indicate the module’s operating status. VOHmin=1.35V VOLmax=0.45V 1.8V power domain.
LTE Module Series BG96-NA Hardware Design For 3.0V(U)SIM: Vmax=3.05V Vmin=2.7V IOmax=50mA USIM_DATA USIM_CLK USIM_RST 45 46 44 IO DO DO Data signal of (U)SIM card Clock signal of (U)SIM card Reset signal of (U)SIM card For 1.8V (U)SIM: VILmax=0.6V VIHmin=1.2V VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM: VILmax=1.0V VIHmin=1.95V VOLmax=0.45V VOHmin=2.55V For 1.8V (U)SIM: VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM: VOLmax=0.45V VOHmin=2.55V For 1.8V (U)SIM: VOLmax=0.45V VOHmin=1.35V For 3.
LTE Module Series BG96-NA Hardware Design VIHmin=1.2V VIHmax=2.0V CTS 36 DO Clear to send VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. TXD 35 DO Transmit data VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. Receive data VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. Pull-up by default. Low level wakes up the module.
LTE Module Series BG96-NA Hardware Design ANT_GNSS 49 AI GNSS antenna interface 50Ωimpedance If unused, keep it open. Pin No. I/O Description DC Characteristics Comment DO Power saving mode indicator VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. 75 DI Force the module to boot from USB port. VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. Pin No.
LTE Module Series BG96-NA Hardware Design 3.4. Operating Modes The table below briefly summarizes the various operating modes referred in the following chapters. Table 5: Overview of Operating Modes Mode Normal Operation Details Idle Software is active. The module hasregistered on network, and it is ready to send and receive data. Data Network connection is ongoing. In this mode, the power consumption is decided by network settingand data transfer rate.
LTE Module Series BG96-NA Hardware Design 3.5.1.1. UART Application If the host communicates with module via UART interface, the following preconditions can let the module enter into sleep mode. Execute AT+QSCLK=1commandto enable sleep mode. Drive DTR to high level. The following figure shows the connection between the module and the host. Figure 3: Sleep Mode Application via UART Driving the host DTR to low level will wake up the module.
LTE Module Series BG96-NA Hardware Design The following figure shows the connection between the module and the host. Figure 4: Sleep Mode Application with USB Remote Wakeup Sending data to BG96-NAthrough USB will wake up the module. When BG96-NAhas URC to report, the module will send remote wake-up signals viaUSB bus so as to wake up the host. 3.5.1.3.
LTE Module Series BG96-NA Hardware Design Figure 5: Sleep Mode Application with RI Sending data to BG96-NAthrough USB will wake up the module. When BG96-NAhas URC to report, RI signal will wake up the host. 3.5.1.4. USB Application without USB Suspend Function If the host does not support USB suspend function, you should disconnect USB_VBUS with additional control circuit to let the module enter into sleep mode. Execute AT+QSCLK=1commandto enable the sleep mode.
LTE Module Series BG96-NA Hardware Design NOTE 1. 2. Please pay attention to the level match shown in dotted line between the module and the host. Refer to document [1] for more details about BG96-NA power management application. “*” means under development. 3.5.2. Airplane Mode When the module enters into airplane mode, the RF function does not work, and all AT commands correlative with RF function will be inaccessible. This mode can be set via the following ways.
LTE Module Series BG96-NA Hardware Design Table 6: VBAT and GND Pins Pin Name Pin No. Description Min. Typ. Max. Unit VBAT_RF 52,53 Power supply for module RF part. 3.3 3.8 4.3 V VBAT_BB 32,33 Power supply for module baseband part. 3.3 3.8 4.3 V GND 3, 31, 48,50, 54, 55,58, 59, 61,62, 67~74, 79~82,89~91, 100~102 Ground - - - - 3.6.2. Decrease Voltage Drop The power supply range of the module is from 3.3Vto4.3V. Please make sure that the input voltage will never drop below 3.3V.
LTE Module Series BG96-NA Hardware Design 3.6.3. Monitor the Power Supply AT+CBC command can be usedto monitor the VBAT_BB voltage value. For more details, please refer to document [2]. 3.7. Turn on and off Scenarios 3.7.1. Turn on Module Using the PWRKEY The following table shows the pin definition of PWRKEY. Table 7: PWRKEY Pin Description Pin Name PWRKEY Pin No. 15 Description DC Characteristics Comment Turn on/off the module VIHmax=2.1V VIHmin=1.3V VILmax=0.5V The output voltage is0.
LTE Module Series BG96-NA Hardware Design Figure 9: Turn on the Module Using Keystroke The turn on scenario is illustrated in the following figure. Figure 10: Timing of Turning on Module NOTE Make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is no less than 30ms.
LTE Module Series BG96-NA Hardware Design 3.7.2. Turn off Module The following procedures can be used to turn off the module: Normal power down procedure: Turn off the module using the PWRKEY pin. Normal power down procedure: Turn off the module using AT+QPOWDcommand. 3.7.2.1. Turn off Module Using the PWRKEY Pin Driving the PWRKEY pin to a low level voltage(the specific time is TBD), the module will execute power-down procedure after the PWRKEY is released.
LTE Module Series BG96-NA Hardware Design Table 8: RESET_N Pin Description Pin Name RESET_N Pin No. 17 Description DC Characteristics Reset the module VIHmax=2.1V VIHmin=1.3V VILmax=0.5V Comment The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N.
LTE Module Series BG96-NA Hardware Design The reset scenario is illustrated inthe following figure. Figure 14: Timing of Resetting Module NOTES 1. 2. Use RESET_N only when turning off the module by AT+QPOWDcommand and PWRKEY pin failed. Ensure that there is no large capacitance on PWRKEY and RESET_N pins. 3.9. (U)SIM Card Interfaces The(U)SIM card interface circuitrymeets ETSI and IMT-2000 SIM interface requirements. Both 1.8V and 3.0V (U)SIM cards are supported.
LTE Module Series BG96-NA Hardware Design BG96-NA supports (U)SIM card hot-plug via the USIM_PRESENCEpins. The function supports low level and high level detections andisdisabled by default. Please refer to document [2] about AT+QSIMDETcommand for details. The following figure shows a reference design for (U)SIM card interface with an 8-pin (U)SIM card connector.
LTE Module Series BG96-NA Hardware Design In order to enhance the reliability and availability of the (U)SIM card in applications, please follow the criteria below in (U)SIM circuit design: Keep layout of (U)SIM card as close to the module as possible. Keep the trace length as less than 200mm as possible. Keep (U)SIM card signals away from RF and VBAT traces. Assure the ground between the module and the (U)SIM card connector short and wide.
LTE Module Series BG96-NA Hardware Design Figure 17: Reference Circuit of USB Application In order to meet ensurethe integrity of USB data line signal, components R1, R2, R3 and R4 must be placed close to the module, and also these resistors should be placed close to each other. The extra stubs of trace must be as short as possible. In order to ensure the USB interface design corresponding with the USB 2.0 specification, please comply with the following principles.
LTE Module Series BG96-NA Hardware Design 3.11. UART Interfaces The module provides two UART interfaces: the UART1interface andUART2interface. The following are theirfeatures. The UART1 interface supports 9600, 19200, 38400, 57600, 115200, 230400, 460800, 921600 and 3000000bpsbaud rates, and the default is 115200bps. This interface is used for data transmission and AT command communication. The UART2interface supports 115200bps baud rate. It is used for module debugging and log output.
LTE Module Series BG96-NA Hardware Design The logic levels are described in the following table. Table 13:Logic Levels of Digital I/O Parameter Min. Max. Unit VIL -0.3 0.6 V VIH 1.2 2.0 V VOL 0 0.45 V VOH 1.35 1.8 V The module provides 1.8V UART interface. A level translator should be used if your application is equipped with a 3.3V UART interface. A level translator TXS0108EPWR provided by Texas Instrument is recommended. The following figure shows a reference design.
LTE Module Series BG96-NA Hardware Design Figure 19: Reference Circuit with Transistor Circuit NOTE Transistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps. 3.12. I2C Interfaces BG96-NA provides one I2C interface. The following table shows the pin definition of I2C interfaces which can be applied on audio codec design. Table 14: Pin Definition of I2C Interfaces Pin Name Pin No.
LTE Module Series BG96-NA Hardware Design 3.13. Network Status Indication BG96-NA provides one network indication pin:NETLIGHT. The pin is used to drive a network status indicationLED. The following tables describe the pin definition and logic level changes ofNETLIGHT in different network status. Table 15: Pin Definition of Network Status Indicator Pin Name Pin No. I/O Description Comment NETLIGHT 21 DO Indicate the module’snetwork activity status. 1.
LTE Module Series BG96-NA Hardware Design 3.14. STATUS The STATUS pin is an open drain output for indicating the module’s operation status. It can be connected to a GPIO of DTE with a pulled up resistor, or an LED indication circuit as below. When the module is turned on normally, the STATUS will present a low state. Otherwise, the STATUS will present high-impedance state. Table 17: Pin Definition of STATUS Pin Name STATUS Pin No.
LTE Module Series BG96-NA Hardware Design The default behaviors of RI are shown as below. Table 18:Default Behavior of RI State Response Idle RI keeps athigh level. URC RI outputs 120ms low pulse when new URC returns. The RI behavior can be changed by AT+QCFG=“urc/ri/ring”command.Please refer to document [2] for details. 3.16. USB_BOOT Interface BG96-NA provides a USB_BOOT pin. During development or factory production, USB_BOOT pin can force the module to boot from USB port for firmware upgrade.
LTE Module Series BG96-NA Hardware Design 4 GNSS Receiver 4.1. General Description BG96-NA includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou/Compass, Galileo and QZSS). BG96-NA supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default. By default, BG96-NA GNSS engine is switched off. It has to be switched on via AT command.
LTE Module Series BG96-NA Hardware Design Accuracy (GNSS) @open sky XTRA* enabled TBD s CEP-50 Autonomous @open sky TBD m NOTES 1. 2. 3. 4. Tracking sensitivity: the lowest GNSS signal value at the antenna port on which the module can keep on positioning for 3 minutes. Reacquisition sensitivity: the lowest GNSS signal value at the antenna port on which the module can fix position again within 3 minutes after loss of lock.
LTE Module Series BG96-NA Hardware Design 5 Antenna Interfaces BG96-NA antenna interfaces include a main antenna interface andaGNSS antennainterface. The antenna interfaceshave an impedance of 50ohm. 5.1. MainAntenna Interface 5.1.1. Pin Definition The pin definition of main antenna interface is shown below. Table 21: Pin Definition of the RF Antenna Interface Pin Name Pin No. I/O Description Comment ANT_MAIN 60 IO Main antennainterface 50ohmimpedance 5.1.2.
LTE Module Series BG96-NA Hardware Design Figure 23: Reference Circuit of RF Antenna Interface NOTE Place theπ-type matching components (R1, C1, C2) as close to the antenna as possible. 5.1.4. Reference Design of RF Layout For user’s PCB, the characteristic impedance of all RF traces should be controlled as 50 ohm.
LTE Module Series BG96-NA Hardware Design Figure 25: Coplanar Waveguide Line Design on a 2-layer PCB Figure 26: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 27: Coplanar Waveguide Line Designon a4-layer PCB (Layer 4 as Reference Ground) BG96-NA_Hardware_Design Confidential / Released 47 / 64
LTE Module Series BG96-NA Hardware Design In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design: Use impedance simulation tool to control the characteristic impedanceof RF tracesas 50ohm. The GND pins adjacent to RF pins should not be hot welded, and should be fully connected to ground. The distance between the RF pinsand the RFconnectorshould be as short as possible, and all the right angle tracesshould be changed to curved ones.
LTE Module Series BG96-NA Hardware Design A reference design of GNSS antenna interface is shown as below. Figure 28: Reference Circuit of GNSS Antenna Interface NOTES 1. 2. An external LDO can be selected to supply power according to the active antenna requirement. If the module is designed with a passive antenna, then the VDD circuit is not needed. 5.3. Antenna Installation 5.3.1. Antenna Requirements The following table shows the requirements on main antenna.
LTE Module Series BG96-NA Hardware Design 5.3.2. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use the UF.L-R-SMTconnector provided by HIROSE. Figure 29: Dimensions of the UF.L-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the UF.L-R-SMT. Figure 30:Mechanicals of UF.
LTE Mod dule Series s BG96--NA Hardw ware Design n The followin ng figure desscribes the space s factorr of mated connector. Figure 31:S Space Facto or of Mated d Connectorr (Unit: mm m) For more de etails, please visithttp://w www.hirose..com.
LTE Module Series BG96-NA Hardware Design 6 Electrical, Reliability and RadioCharacteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 26: Absolute Maximum Ratings Parameter Min. Max. Unit VBAT_RF/VBAT_BB -0.3 4.7 V USB_VBUS -0.3 5.5 V Peak Current of VBAT_BB 0 TBD A Peak Current of VBAT_RF 0 TBD A Voltage at Digital Pins -0.3 2.3 V 6.2.
LTE Module Series BG96-NA Hardware Design Parameter Description IVBAT Peak supply current (during transmissionslot) USB_VBUS USB detection Conditions Min. 3.0 Typ. Max. Unit TBD TBD A 5.0 5.25 V 6.3. Operating Temperature The operating temperature is listed in the following table. Table 28: Operating Temperature Parameter Min. Typ. Max. Unit OperationTemperature Range1) -35 +25 +75 ºC Extended Temperature Range2) -40 +85 ºC NOTES 1. 2.
LTE Module Series BG96-NA Hardware Design 6.5. RF Output Power The following table shows the RF output power of BG96-NA module. Table 29: Conducted RF Output Power Frequency Max. LTE-FDD B2/B4B12/B13 Min. 23dBm±2.7dB TBD 6.6. RF Receiving Sensitivity The following table shows the conducted RF receiving sensitivity of BG96-NA module. Table 30: BG96-NA Conducted RF Receiving Sensitivity Frequency Primary Diversity SISO 3GPP LTE-FDD B2 TBD Not Supported TBD -100.
LTE Module Series BG96-NA Hardware Design 7 Mechanical Dimensions This chapter describes the mechanical dimensions of the module.All dimensions are measured in mm. 7.1. Mechanical Dimensions of the Module 26.50±0.1 22.50±0.1 Figure 32: Module Top and Side Dimensions BG96-NA_Hardware_Design Confidential / Released 55 / 64 2.3±0.
LTE Module Series BG96-NA Hardware Design 22.50 7.45 0.92 0.92 7.15 1.10 1.95 0.55 1.10 1.66 1.50 5.10 1.00 1.70 8.50 0.85 26.50 1.90 1.10 0.85 1.00 1.70 0.70 0.50 1.65 1.15 1.70 1.00 0.55 1.50 40x1.0 62x0.7 62x1.15 40x1.
LTE Module Series BG96-NA Hardware Design 7.2. Recommended Footprint 9.95 9.95 7.15 7.45 1.95 0.55 1.10 11.80 9.70 4.25 0.20 7.65 5.95 2.55 0.85 0.85 29.00 2.55 4.25 1.90 2.55 11.80 9.60 0.85 4.25 5.95 5.95 7.65 2.55 0.85 4.25 5.95 62x0.7 1.00 62x2.35 40x1.00 40x1.00 Figure 34: Recommended Footprint (Top View) NOTE For easymaintenance of the module, please keep about 3mm between the module and other components in thehost PCB.
LTE Mod dule Series s BG96--NA Hardw ware Design n 7.3. Design Effec ct Drawin ngs of th he Module Figure 35: Top T View off the Modu ule Fig gure 36: Bo ottom View of the Module NOTE These are design d effecct drawings of BG96-NA A module. For F more acccurate pictu ures, please e refer to the e module thatt you get from Quectel.
LTE Module Series BG96-NA Hardware Design 8 Storage, Manufacturing and Packaging 8.1. Storage BG96-NA is stored in avacuum-sealed bag. The storage restrictionsareshown as below. 1. Shelf life in the vacuum-sealed bag: 12 months at <40ºC/90%RH. 2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other high temperature processes must be: Mounted within 72 hours at the factory environment of ≤30ºC/60%RH. Stored at <10%RH. 3.
LTE Module Series BG96-NA Hardware Design 8.2. Manufacturing and Welding Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properlyso as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, thethickness of stencil for the module is recommended to be 0.18mm. For more details, please refer todocument [5].
LTE Module Series BG96-NA Hardware Design 9 Appendix A References Table 31: Related Documents SN Document Name Remark [1] Quectel_BG96_Power_Management_Application_Note BG96 Power Management Application Note [2] Quectel_BG96_AT_Commands_Manual BG96 AT Commands Manual [3] Quectel_BG96_GNSS_AT_Commands_Manual BG96 GNSS AT Commands Manual [4] Quectel_RF_Layout_Application_Note RF Layout Application Note [5] Quectel_Module_Secondary_SMT_User_Guide Module Secondary SMT User Guide Table 32: T
LTE Module Series BG96-NA Hardware Design DTX Discontinuous Transmission EFR Enhanced Full Rate ESD Electrostatic Discharge FDD Frequency Division Duplex FR Full Rate GMSK Gaussian Minimum Shift Keying GSM Global System for Mobile Communications HR Half Rate HSPA High Speed Packet Access HSDPA High Speed Downlink Packet Access HSUPA High Speed Uplink Packet Access I/O Input/Output Inorm Normal Current LED Light Emitting Diode LNA Low Noise Amplifier LTE Long Term Evolution M
LTE Module Series BG96-NA Hardware Design QPSK Quadrature Phase Shift Keying RF Radio Frequency RHCP Right Hand Circularly Polarized Rx Receive SISO Single Input Single Output SMS Short Message Service TDD Time Division Duplexing TX Transmitting Direction UL Uplink UMTS Universal Mobile Telecommunications System URC Unsolicited Result Code (U)SIM (Universal) Subscriber Identity Module Vmax Maximum Voltage Value Vnorm Normal Voltage Value Vmin Minimum Voltage Value VIHmax Maxi
LTE Module Series BG96-NA Hardware Design VSWR Voltage Standing Wave Ratio WCDMA Wideband Code Division Multiple Access BG96-NA_Hardware_Design Confidential / Released 64 / 64
LTE Module Series BG96-NA Hardware Design 10 Appendix B GPRS Coding Schemes Table 33: Description of Different Coding Schemes Scheme CS-1 CS-2 CS-3 CS-4 Code Rate 1/2 2/3 3/4 1 USF 3 3 3 3 Pre-coded USF 3 6 6 12 Radio Block excl.USF and BCS 181 268 312 428 BCS 40 16 16 16 Tail 4 4 4 - Coded Bits 456 588 676 456 Punctured Bits 0 132 220 - Data Rate Kb/s 9.05 13.4 15.6 21.
LTE Module Series BG96-NA Hardware Design 11 Appendix C GPRS Multi-slot Classes Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots.
LTE Mo odule Sires s BG96--NA Hardw ware Design n 12 Apppendixx D EDGE E E Mod dulationan nd Cod ding Schem S mes E Modu ulation and Coding Sch hemes Table 35: EDGE Coding Schemes Mod dulation Coding Family 1 Timeslot 2 Tim meslot 4 Timeslot CS-1: GMSK / 9.05kbps 9 18.1kkbps 36.2kbps CS-2: GMSK / 13.4kbps 26.8kkbps 53.6kbps CS-3: GMSK / 15.6kbps 31.2kkbps 62.4kbps CS-4: GMSK / 21.4kbps 2 42.8kkbps 85.6kbps MCS-1 GMSK C 8.80kbps 8 17.60 0kbps 35.20kbps MCS-2 GMSK B 11.