Product Info

Table Of Contents
LTE Module Series
EG61-NA Hardware Design
EG61-NA_Hardware_Design 18 / 77
3 Application Interfaces
3.1. General Description
EG61-NAis equipped with 62-pin 1.1mm pitch SMT pads plus 44-pin ground/reserved pads that can be
connected to customers cellular application platforms. Sub-interfaces included in these pads are
described in detail in the following chapters:
Power supply
(U)SIMinterfaces
USB interface
UART interfaces
PCMand I2C interfaces
SPI interface
Statusindication