Product Info

LTE Module Series
EG61-NA Hardware Design
EG61-NA_Hardware_Design 26 / 77
SPI_MISO 28 DI
Master input slave
output of SPI
interface
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
1.8V power domain.
If unused, keep it
open.
RF Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
ANT_GNSS 49 AI GNSS antenna pad
50Ω impedance.
If unused, keep it
open.
ANT_DIV 56 AI
Receive diversity
antenna pad
50Ω impedance.
If unused, keep it
open.
ANT_MAIN 60 IO Main antenna pad
50Ω impedance.
If unused, keep it
open.
Other Pins
Pin Name Pin No. I/O Description DC Characteristics Comment
AP_READY 19 DI
Application
processor sleep
state detection
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
1.8V power domain.
If unused, keep it
open.
USB_BOOT 75 DI
Force the module to
enter into
emergency
download mode
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
1.8V power domain.
If unused, keep it
open.
RESERVED Pins
Pin Name Pin No. I/O Description DC Characteristics Comment
NC
1, 2,
11~14, 16,
51,57,
63~66,
78,
88, 92~99
NC
Keep these pins
unconnected.
RESERVED
18, 24,25
76, 77
Reserved
Keep these pins
unconnected.