Product Info
Table Of Contents
- About the Document
- Contents
- Table Index
- Figure Index
- Introduction
- Product Concept
- Application Interfaces
- GNSS Receiver
- Antenna Interfaces
- Electrical, Reliability and RadioCharacteristics
- Mechanical Dimensions
- Storage, Manufacturing and Packaging
- Appendix A References
LTE Module Series
EG61-NA Hardware Design
EG61-NA_Hardware_Design 44 / 77
VCCA VCCB
OE
A1
A2
A3
A4
A5
A6
A7
A8
GND
B1
B2
B3
B4
B5
B6
B7
B8
VDD_EXT
RI
DCD
RTS
RXD
DTR
CTS
TXD
51K
51K
0.1uF
0.1uF
RI_MCU
DCD_MCU
RTS_MCU
RXD_MCU
DTR_MCU
CTS_MCU
TXD_MCU
VDD_MCU
Translator
Figure 20: Reference Circuit with Translator Chip
Please visit
http://www.ti.com formore information.
Another example with transistor translation circuit is shown as below. Thecircuitdesign of dotted line
section can refer to the circuitdesign of solid linesection, in terms of both module input and output circuit
design. Please pay attention to the direction of connection.
MCU/ARM
TXD
RXD
VDD_EXT
10K
VCC_MCU
4.7K
10K
VDD_EXT
TXD
RXD
RTS
CTS
DTR
RI
RTS
CTS
GND
GPIO DCD
Module
GPIO
EINT
VDD_EXT
4.7K
GND
1nF
1nF
Figure 21: Reference Circuit with Transistor Circuit
Transistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps.
NOTE