Product Info
Table Of Contents
- About the Document
- Contents
- Table Index
- Figure Index
- Introduction
- Product Concept
- Application Interfaces
- GNSS Receiver
- Antenna Interfaces
- Electrical, Reliability and RadioCharacteristics
- Mechanical Dimensions
- Storage, Manufacturing and Packaging
- Appendix A References
LTE Module Series
EG61-NA Hardware Design
EG61-NA_Hardware_Design 68 / 77
Heatsink
EG61-NA Module
Application Board
Application Board
Heatsink
Thermal Pad
Shielding Cover
Figure 39: Referenced Heatsink Design (Heatsink at the Top of the Module)
Thermal Pad
Heatsink
Application Board
Application Board
Heatsink
Thermal Pad
EG61-NA Module
Shielding Cover
Figure 40: Referenced Heatsink Design (Heatsink at the Bottom of Customers’ PCB)
1. The module offers the best performance when the internal BB chip stays below 105°C. When the
maximum temperature of the BB chip reaches or exceeds 105°C, the module works normal but
provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB
chip temperature reaches or exceeds 115°C, the module will disconnect from the network, and it will
recover to network connected state after the maximum temperature falls below 115°C. Therefore, the
thermal design should be maximally optimized to make sure the maximum BB chip temperature
always maintains below 105°C. Customers can execute AT+QTEMP
command and get the
NOTES