Product Info

Table Of Contents
LTE Module Series
EG61-NA Hardware Design
EG61-NA_Hardware_Design 72 / 77
7.2. Recommended Footprint
1.00
1.70
0.70
0.55
0.85
1.00
1.70
1.70
62x0.7
40x1.0
40x1.0
25±0.15
31±0.15
3.90
2.75
2.75
3.90
1.15
1.15
7.45 7.15
0.85
8.50
5.10
0.20
1.10
1.90
1.10
1.95
1.00
1.10
1.10
62x1.15
1.50
1.70
1.70
0.40
1.70
1.70
0.40
0.50
1.50
5.95
4.25
0.50
1.70
Figure 43: Recommended Footprint (Top View)
For easymaintenance of the module, please keep about 3mm between the module and other components
in thehost PCB.
NOTE