Product Info

LTE Module Series
EG61-NA Hardware Design
EG61-NA_Hardware_Design 7 / 77
FIGURE 39: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) .................. 68
FIGURE 40: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BOTTOM OF CUSTOMERS’ PCB) . 68
FIGURE 41: MODULE TOP AND SIDE DIMENSIONS ..................................................................................... 70
FIGURE 42: MODULE BOTTOM DIMENSIONS (TOP VIEW) ......................................................................... 71
FIGURE 43: RECOMMENDED FOOTPRINT (TOP VIEW) .............................................................................. 72
FIGURE 44: TOP VIEW OF THE MODULE ...................................................................................................... 73
FIGURE 45: BOTTOM VIEW OF THE MODULE .............................................................................................. 73
FIGURE 46: REFLOW SOLDERING THERMAL PROFILE .............................................................................. 75
FIGURE 47: TAPE DIMENSIONS ..................................................................................................................... 77
FIGURE 48: REEL DIMENSIONS ..................................................................................................................... 77