Product Info

Automotive Module Series
AG35 Hardware Design
AG35_Hardware_Design 121 / 129
8 Storage, Manufacturing and
Packaging
8.1. Storage
AG35 is stored in a vacuum-sealed bag. It is rated at MSL 3, and its storage restrictions are shown as
below.
1. Shelf life in the vacuum-sealed bag: 12 months at < 40ºC/90%RH.
2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other
high temperature processes must be:
 Mounted within 168 hours at the factory environment of ≤ 30ºC/60%RH.
 Stored at <10% RH.
3. Devices require baking before mounting, if any circumstance below occurs:
 When the ambient temperature is 23ºC±5ºC and the humidity indicator card shows the humidity
is >10% before opening the vacuum-sealed bag.
 Device mounting cannot be finished within 168 hours at factory conditions of ≤30ºC/60% RH.
4. If baking is required, devices may be baked for 8 hours at 120ºC±5ºC.
As the plastic package cannot be subjected to high temperature, it should be removed from devices
before high temperature (120ºC) baking. If shorter baking time is desired, please refer to
IPC/JEDECJ-STD-033 for baking procedure.
NOTE