Product Info

LTE Module Series
AG35-Quecopen
Hardware Design
AG35-QuecOpen_Hardware_Design 21 / 137
3 Application Interfaces
3.1. General Description
AG35-Quecopen is equipped with 299-pin LGA pads that can be connected to cellular application
platform. Sub-interfaces included in these pads are described in detail in the following sub-chapters:
 Power supply
 (U)SIM interface
 USB interface
 UART interfaces
 Audio interface (optional)
 PCM and I2C interfaces
 SDIO interfaces
 SPI interfaces
 SGMII interface (optional)
 Wireless connectivity interfaces
 ADC interfaces
 Status indication interfaces
 USB_BOOT interface
3.2. Pin Assignment
The following figure shows the pin assignment of AG35-Quecopen module.