Product Info

LTE Module Series
AG35-Quecopen
Hardware Design
AG35-QuecOpen_Hardware_Design 6 / 137
3.14.1. SDIO1 Interface ........................................................................................................... 64
3.14.2. SDIO2 Interface ........................................................................................................... 64
3.14.2.1. Reference Design for SD Card Application ....................................................... 65
3.14.2.2. Reference Design for eMMC Application .......................................................... 67
3.15. SPI Interfaces ......................................................................................................................... 68
3.16. SGMII Interface (Optional) ...................................................................................................... 70
3.17. Wireless Connectivity Interfaces ............................................................................................ 72
3.17.1. WLAN Interface ........................................................................................................... 75
3.17.2. BT Interface* ................................................................................................................ 75
3.18. ADC Interfaces ....................................................................................................................... 75
3.19. Network Status Indication ....................................................................................................... 76
3.20. STATUS .................................................................................................................................. 77
3.21. USB_BOOT Interface ............................................................................................................. 78
3.22. RTC ........................................................................................................................................ 79
4 GNSS Receiver ................................................................................................................................ 80
4.1. General Description ...........................................
..................................................................... 80
4.2. GNSS Performance ................................................................................................................ 80
4.3. Layout Guidelines ................................................................................................................... 83
5 Antenna Interfaces .......................................................................................................................... 84
5.1. Main/Rx-diversity Antenna Interface ....................................................................................... 84
5.1.1. Pin Definition ................................................................................................................ 84
5.1.2. Operating Frequency ................................................................................................... 84
5.1.3. Reference Design of RF Antenna Interface ................................................................. 88
5.1.4. Reference Design of RF Layout ................................................................................... 89
5.2. GNSS Antenna Interface ........................................................................................................ 91
5.3. Antenna Installation ................................................................................................................ 92
5.3.1. Antenna Requirements ................................................................................................ 92
5.3.2. Recommended RF Connector for Antenna Installation ................................................ 93
6 Electrical, Reliability and Radio Characteristics .......................................................................... 95
6.1. Absolute Maximum Ratings .................................................................................................... 95
6.2. Power Supply Ratings ..........................................
.................................................................. 96
6.3. Operation and Storage Temperatures .................................................................................... 96
6.4. Current Consumption ............................................................................................................. 97
6.5. RF Output Power ................................................................................................................... 111
6.6. RF Receiving Sensitivity ........................................................................................................ 115
6.7. Electrostatic Discharge .......................................................................................................... 119
6.8. Thermal Consideration .......................................................................................................... 119
7 Mechanical Dimensions................................................................................................................ 122
7.1. Mechanical Dimensions of the Module ................................................................................. 122
7.2. Recommended Footprint ...................................................................................................... 124
7.3. Design Effect Drawings of the Module .................................................................................. 125
8 Storage, Manufacturing and Packaging ...................................................................................... 126