EM06 Hardware Design LTE-A Module Series Rev. EM06_Hardware_Design_V1.0 Date: 2018-07-17 Status: Released www.quectel.
LTE-A Module Series EM06 Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters: Quectel Wireless Solutions Co., Ltd. 7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit: http://quectel.com/support/sales.
LTE-A Module Series EM06 Hardware Design About the Document History Revision Date Author Description 1.
LTE-A Module Series EM06 Hardware Design Contents About the Document ................................................................................................................................... 2 Contents ....................................................................................................................................................... 3 Table Index .....................................................................................................................................
LTE-A Module Series EM06 Hardware Design 5.1.1. Operating Frequency ..................................................................................................... 41 5.2. GNSS Antenna Interface........................................................................................................... 43 5.3. Antenna Installation .................................................................................................................. 44 5.3.1. Antenna Requirements ............................
LTE-A Module Series EM06 Hardware Design Table Index TABLE 1: FREQUENCY BANDS AND GNSS TYPE OF EM06 SERIES MODULE ........................................... 9 TABLE 2: KEY FEATURES OF EM06 ............................................................................................................... 10 TABLE 3: DEFINITION OF I/O PARAMETERS ................................................................................................. 16 TABLE 4: PIN DESCRIPTION ..........................................
LTE-A Module Series EM06 Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 13 FIGURE 2: PIN ASSIGNMENT ......................................................................................................................... 15 FIGURE 3: POWER SUPPLY LIMITS DURING RADIO TRANSMISSION ....................................................... 20 FIGURE 4: REFERENCE CIRCUIT OF VCC..............
LTE-A Module Series EM06 Hardware Design 1 Introduction This document defines EM06 module and describes its air interface and hardware interfaces which are connected with customers’ applications. This document can help customers to quickly understand the interface specifications, electrical and mechanical details, as well as other related information of EM06 module. To facilitate its application in different fields, reference design is also provided for customers’ reference.
LTE-A Module Series EM06 Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating EM06 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product.
LTE-A Module Series EM06 Hardware Design 2 Product Concept 2.1. General Description EM06 is a series of LTE-A/UMTS/HSPA+ wireless communication module with receive diversity. It provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA networks with standard PCI Express M.2 interface. EM06 supports embedded operating systems such as Windows CE, Linux and Android, and also provides GNSS1) and voice functionality2) to meet customers’ specific application demands.
LTE-A Module Series EM06 Hardware Design B13/B26/B293)/ B66 WCDMA (with Rx-diversity) B1/B3/B5/B8 B1/B3/B6/B8/ B19 B2/B4/B5 B2/B3/B4/B5/ B8 GNSS 1) GPS, GLONASS, BeiDou/Compass Galileo, QZSS GPS, GLONASS, BeiDou/Compass Galileo, QZSS GPS, GLONASS, BeiDou/Compass Galileo, QZSS GPS, GLONASS, BeiDou/Compass Galileo, QZSS NOTES 1) GNSS function is optional. EM06 series module (EM06-E/EM06-J/EM06-A*/EM06-LA*) contains Telematics version and Data-only version.
LTE-A Module Series EM06 Hardware Design Transmitting Power Class 3 (23dBm±2dB) for LTE-FDD bands Class 3 (23dBm±2dB) for LTE-TDD bands Class 3 (24dBm+1/-3dB) for WCDMA LTE Features Support up to LTE Cat 6 Support 1.
LTE-A Module Series EM06 Hardware Design Rx-diversity Support LTE/WCDMA Rx-diversity GNSS Features Gen8C Lite of Qualcomm Protocol: NMEA 0183 AT Commands Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT commands Physical Characteristics Size: (42.0±0.15)mm × (30.0±0.15)mm × (2.3±0.1)mm Weight: approx. 6.0g Temperature Range Operation temperature range: -30°C~ +70°C 1) Extended temperature range: -40°C~ +85°C 2) Storage temperature range: -40°C ~ +90°C Firmware Upgrade USB 2.
LTE-A Module Series EM06 Hardware Design 2.3. Functional Diagram The following figure shows a block diagram of EM06. VCC FULL_CARD_POWER_OFF# Control Tx USB2.0&USB3.0 ANT_MAIN (U)SIM1&(U)SIM2 IQ W_DISABLE1# WWAN_LED# WAKE_ON_WAN# Baseband PCM Control GPIOs Tx/Rx Blocks PRx Transceiver PCI Express M.2 Key-B Interface 19.2M XO APT PMIC RESET# W_DISABLE2# DRx ANT_GNSS ANT_DIV NAND + DDR2 SDRAM Figure 1: Functional Diagram 2.4.
LTE-A Module Series EM06 Hardware Design 3 Application Interfaces The physical connections and signal levels of EM06 comply with PCI Express M.2 specifications. This chapter mainly describes the definition and application of the following interfaces/signals/pins of EM06: Power supply (U)SIM interfaces USB interface PCM and I2C interfaces Control and indicator signals Tunable antenna control interface* Configuration pins NOTE “*” means under development.
LTE-A Module Series EM06 Hardware Design 3.1. Pin Assignment The following figure shows the pin assignment of EM06. The top side contains EM06 module and antenna connectors. No.
LTE-A Module Series EM06 Hardware Design 3.2. Pin Description The following tables show the pin definition and description of EM06 on the 75-pin application. Table 3: Definition of I/O Parameters Type Description IO Bidirectional DI Digital input DO Digital output OD Open drain PI Power input PO Power output Table 4: Pin Description Pin No. 1 M.2 Socket 2 USB 3.0-Based Pinout CONFIG_3 EM06 Pin Name I/O 3.3V VCC 3 GND GND PI Power supply Vmin=3.135V Vnorm=3.7V Vmax=4.
LTE-A Module Series EM06 Hardware Design 8 W_DISABLE1# W_DISABLE1# DI Airplane mode control. Active low. 9 USB_D- USB_DM IO USB 2.0 differential data bus (-) OD It is an open collector and active low signal. It allows the module to provide RF status indication via LED devices provided by the system. 1.8V/3.3V power domain 3.
LTE-A Module Series EM06 Hardware Design 29 USB3.0-TX- USB3.0_TX- DO USB 3.0 transmit data (-) 30 UIM-RESET USIM1_RESET DO (U)SIM1 card reset 31 USB3.0-TX+ USB3.0_TX+ DO USB 3.0 transmit data (+) 32 UIM-CLK USIM1_CLK DO (U)SIM1 card clock 33 GND GND 1.8V/3.0V power domain Ground 34 UIM-DATA USIM1_DATA IO (U)SIM1 card data 35 USB3.0-RX- USB3.0_RX- DI USB 3.0 receive data (-) 36 UIM-PWR USIM1_VDD PO Power supply for (U)SIM1 card 37 USB3.0-RX+ USB3.0_RX+ DI USB 3.
LTE-A Module Series EM06 Hardware Design 52 N/C NC NC 53 N/C NC NC 54 N/C NC NC 55 N/C NC NC 56 N/C I2C_SDA 57 GND GND 58 N/C I2C_SCL DO I2C serial clock. Used for external codec. 59 ANTCTL0 ANTCTL0* DO Tunable antenna control. 60 COEX3 RESERVED 61 ANTCTL1 ANTCTL1* 62 COEX2 RESERVED 63 ANTCTL2 ANTCTL2* 64 COEX1 RESERVED 65 ANTCTL3 ANTCTL3* DO Tunable antenna control. 1.
LTE-A Module Series EM06 Hardware Design 74 75 3.3V VCC CONFIG_2 PI Vmin=3.135V Vnorm=3.7V Vmax=4.4V Power supply Not connected internally. EM06 is configured as WWAN-USB 3.0. CONFIG_2 NOTES 1. 2. Keep all NC, reserved and unused pins unconnected. “*” means under development. 3.3. Power Supply The following table shows pin definition of VCC pins and ground pins. Table 5: Definition of VCC and GND Pins Pin No. Pin Name I/O Power Domain Description 2, 4, 70, 72, 74 VCC PI 3.135V~4.4V 3.
LTE-A Module Series EM06 Hardware Design To decrease voltage drop, a bypass capacitor of about 220µF with low ESR (ESR=0.7Ω) should be used, and a multi-layer ceramic chip capacitor (MLCC) array should also be reserved due to its ultra-low ESR. It is recommended to use three ceramic capacitors (100nF, 33pF, 10pF) for composing the MLCC array, and place these capacitors close to VCC pins. The main power supply from an external application has to be a single voltage source.
LTE-A Module Series EM06 Hardware Design MIC29302WU U1 VCC LDO_IN 100nF 51K ADJ 470uF 5 TVS GND C2 OUT 4 3 C1 1 R1 D1 EN 2 IN R2 100K 1%R4 470R R3 R5 4.7K MCU_POWER _ON/OFF C3 C4 470uF 100nF C5 C6 33pF 10pF 51K 1% R6 47K Figure 5: Reference Design of Power Supply NOTE In order to avoid damages to the internal flash, please do not switch off the power supply directly when the module is working.
LTE-A Module Series EM06 Hardware Design 3.4.1.1. Turn on the Module Through GPIO Controlled FULL_CARD_POWER_OFF# It is recommended to use a GPIO from host to control FULL_CARD_POWER_OFF#. A simple reference circuit is illustrated in the following figure. Host Module 3.3V GPIO FULL_CARD_POWER_OFF# GND GND Figure 6: Turn on the Module Through GPIO Controlled FULL_CARD_POWER_OFF# 3.4.1.2. Turn on the Module Automatically If FULL_CARD_POWER_OFF# is pulled up to 3.
LTE-A Module Series EM06 Hardware Design The turn on scenario is illustrated in the following figure. NOTE VCC RESET# VIH≥1.19V FULL_CARD_POWER_OFF# VIL≤0.2V Module Status ≥12.5s Booting OFF Active Figure 8: Timing of Turning on Module NOTE Please make sure that VCC is stable before pulling down FUL_CARD_POWER_OFF# pin. The time between them is no less than 30ms. 3.4.2. Turn off the Module 3.4.2.1.
LTE-A Module Series EM06 Hardware Design 3.4.2.2. Turn off the Module via AT Command The module can also be turned off by AT+QPOWD command. For more details about the command, please refer to document [2]. 3.5. Reset the Module The RESET# pin is used to reset the module. The module can be reset by driving RESET# to a low level voltage for 250ms~600ms. Table 7: RESET# Pin Definition Pin Name RESET# Pin No. 67 Description DC Characteristics Reset the module VIHmax=2.1V VIHmin=1.3V VILmax=0.
LTE-A Module Series EM06 Hardware Design S2 RESET# TVS Close to S2 Figure 11: Reference Circuit of RESET# by Using Button The reset scenario is illustrated in the following figure. VCC ≤600ms ≥250ms RESET# VIH≥1.3V VIL≤0.5V Module Status Running Resetting Restart Figure 12: Timing of Resetting Module NOTE Please ensure that there is no large capacitance on RESET# pin. 3.6. (U)SIM Interfaces The (U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8V and 3.
LTE-A Module Series EM06 Hardware Design Table 8: Pin Definition of (U)SIM Interfaces Pin Name Pin No. I/O Description Comment USIM1_VDD 36 PO Power supply for (U)SIM1 card Either 1.8V or 3.0V is supported by the module automatically. USIM1_DATA 34 IO Data signal of (U)SIM1 card USIM1_CLK 32 DO Clock signal of (U)SIM1 card USIM1_RESET 30 DO Reset signal of (U)SIM1 card USIM1_DET 66 DI (U)SIM1 card insertion detection. Active high. Pulled up internally.
LTE-A Module Series EM06 Hardware Design USIM_VDD GND 15K 100nF Module USIM_VDD USIM_RESET USIM_CLK USIM_DET USIM_DATA (U)SIM Card Connector VCC RST CLK CD 22R 22R GND VPP IO SW GND 22R 33pF 33pF 33pF GND GND Figure 13: Reference Circuit of Normally Short-Circuited (U)SIM Card Connector Normally Short-Circuited (U)SIM Card Connector: When the (U)SIM is absent, CD is short-circuited to SW and USIM_DET is at low level.
LTE-A Module Series EM06 Hardware Design If (U)SIM card detection function is not needed, please keep USIM_DET unconnected. A reference circuit for (U)SIM card interface with a 6-pin (U)SIM card connector is illustrated in the following figure.
LTE-A Module Series EM06 Hardware Design 3.7. USB Interface EM06 provides one integrated Universal Serial Bus (USB) interface which complies with the USB 3.0/2.0 specifications and supports super speed (5Gbps) on USB 3.0, high speed (480 Mbps) and full speed (12 Mbps) modes on USB 2.0. The USB interface is used for AT command communication, data transmission, GNSS NMEA output, software debugging, firmware upgrade and voice over USB*. The following table shows the pin definition of USB interface.
LTE-A Module Series EM06 Hardware Design Test Points Minimize these stubs NM_0R R3 NM_0R R4 USB_DM USB_DP USB3.0_RX+ USB3.0_RX- ESD Array R1 0R R2 0R USB_DM USB_DP C3 100nF C4 100nF USB3.0_TX+ USB3.0_TX- USB3.0_TX+ C1 100nF USB3.0_RX+ C2 100nF USB3.0_RX- USB3.0_TX- GND Module GND MCU Figure 16: Reference Circuit of USB 2.0 & 3.0 Interface In order to ensure the integrity of USB 2.0 & 3.
LTE-A Module Series EM06 Hardware Design NOTE S “*” means under development. 3.8. PCM and I2C Interfaces EM06 supports audio communication via Pulse Code Modulation (PCM) digital interface and I2C interface. The PCM interface supports the following modes: Primary mode (short frame synchronization, works as both master and slave) Auxiliary mode (long frame synchronization, works as master only) In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge.
LTE-A Module Series EM06 Hardware Design 125us 1 PCM_CLK 2 31 32 PCM_SYNC MSB LSB MSB LSB PCM_OUT PCM_IN Figure 18: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design. Table 10: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Description Comment PCM_IN 22 DI PCM data input 1.8V power domain. PCM_OUT 24 DO PCM data output 1.8V power domain.
LTE-A Module Series EM06 Hardware Design PCM_CLK BCLK PCM_SYNC LRCK PCM_OUT DAC PCM_IN ADC I2C_SCL SCL I2C_SDA SDA INP INN BIAS MICBIAS Module 4.7K 4.7K LOUTP LOUTN Codec 1.8V Figure 19: Reference Circuit of PCM Application with Audio Codec NOTES 1. 2. It is recommended to reserve an RC (R=22Ω, C=22pF) circuit on the PCM lines, especially for PCM_CLK. EM06 works as a master device pertaining to I2C interface. 3.9.
LTE-A Module Series EM06 Hardware Design NOTE “*” means under development. 3.9.1. W_DISABLE1# Signal EM06 provides a W_DISABLE1# signal to disable or enable airplane mode through hardware operation. The W_DISABLE1# pin is pulled up by default. Driving it to low level will let the module enter into airplane mode. In airplane mode, the RF function will be disabled. The RF function can also be enabled or disabled through software AT commands. The following table shows the RF function status of the module.
LTE-A Module Series EM06 Hardware Design The following table shows the RF status indicated by WWAN_LED# signal. Table 13: Network Status Indications of WWAN_LED# Signal WWAN_LED# Level Description Low Level (LED ON) RF function is turned on High Level (LED OFF) RF function is turned off if any of the following circumstances occurs: The (U)SIM card is not powered W_DISABLE1# signal is at low level (airplane mode enabled). AT+CFUN=4 (RF function disabled) 3.9.3.
LTE-A Module Series EM06 Hardware Design VCC from the Host Host Module 10K WAKE_ON_WAN# Figure 22: WAKE_ON_WAN# Signal Reference Circuit Design 3.9.4. DPR Signal EM06 provides a DPR (Dynamic Power Reduction) signal for body SAR (Specific Absorption Rate) detection. The signal is sent by a host system proximity sensor to EM06 module to provide an input trigger which will reduce the output power in the radio transmission.
LTE-A Module Series EM06 Hardware Design Table 16: Pin Definition of Tunable Antenna Control Interface* Pin Name Pin No. I/O Description Comment ANTCTL0* 59 DO Tunable antenna control 1.8V power domain ANTCTL1* 61 DO Tunable antenna control 1.8V power domain ANTCTL2* 63 DO Tunable antenna control 1.8V power domain ANTCTL3* 65 DO Tunable antenna control 1.8V power domain NOTE “*” means under development. 3.11.
LTE-A Module Series EM06 Hardware Design 4 GNSS Receiver 4.1. General Description EM06 includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou/Compass, Galileo and QZSS). EM06 supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default. By default, EM06 GNSS engine is switched off. It has to be switched on via AT command.
LTE-A Module Series EM06 Hardware Design 5 Antenna Interfaces EM06 provides a main antenna interface, an Rx-diversity antenna interface which is used to resist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna interface. The antenna ports have an impedance of 50Ω. 5.1. Main/Rx-diversity Antenna Interfaces The main/Rx-diversity/GNSS antenna interfaces are shown as below.
LTE-A Module Series EM06 Hardware Design 5.1.1.
LTE-A Module Series EM06 Hardware Design WCDMA B19 830~845 875~890 MHz LTE B1 1920~1980 2110~2170 MHz LTE B3 1710~1785 1805~1880 MHz LTE B8 880~915 925~960 MHz LTE B18 815~830 860~875 MHz LTE B19 830~845 875~890 MHz LTE B26 814~849 859~894 MHz LTE B28 703~748 758~803 MHz LTE B41 2545~2655 2545~2655 MHz Table 21: EM06-A* Operating Frequencies 3GPP Band Transmit Receive Unit WCDMA B2 1850~1910 1930~1990 MHz WCDMA B4 1710~1755 2110~2155 MHz WCDMA B5 824~849 86
LTE-A Module Series EM06 Hardware Design Table 22: EM06-LA* Operating Frequencies 3GPP Band Transmit Receive Unit WCDMA B2 1850~1910 1930~1990 MHz WCDMA B3 1710~1785 1805~1880 MHz WCDMA B4 1710~1755 2110~2155 MHz WCDMA B5 824~849 869~894 MHz WCDMA B8 880~915 925~960 MHz LTE B2 1850~1910 1930~1990 MHz LTE B3 1710~1785 1805~1880 MHz LTE B4 1710~1755 2110~2155 MHz LTE B5 824~849 869~894 MHz LTE B7 2500~2570 2620~2690 MHz LTE B8 880~915 925~960 MHz LTE B20 832~8
LTE-A Module Series EM06 Hardware Design GLONASS 1597.5~1605.8 MHz BeiDou/Compass 1561.098±2.046 MHz 5.3. Antenna Installation 5.3.1. Antenna Requirements The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Table 23: Antenna Requirements Type Requirements GNSS 1) Frequency range: 1559MHz ~ 1609MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive antenna gain: > 0dBi Active antenna noise figure: < 1.
LTE-A Module Series EM06 Hardware Design Figure 24: EM06 RF Connector Dimensions (Unit: mm) Table 24: Major Specifications of the RF Connector Item Specification Nominal Frequency Range DC to 6GHz Nominal Impedance 50Ω Temperature Rating -40°C to +85°C Voltage Standing Wave Ratio (VSWR) Meet the requirements of: Max 1.3 (DC~3GHz) Max 1.45 (3GHz~6GHz) The receptacle RF connector used in conjunction with EM06 will accept two types of mating plugs that will meet a maximum height of 1.
LTE-A Module Series EM06 Hardware Design Figure 25: Specifications of Mating Plugs Using Ø 0.81mm Coaxial Cables The following figure illustrates the connection between the receptacle RF connector on EM06 and the mating plug using a Ø0.81mm coaxial cable. Figure 26: Connection between RF Connector and Mating Plug Using Ø 0.81mm Coaxial Cable The following figure illustrates the connection between the receptacle RF connector on EM06 and the mating plug using a Ø1.13mm coaxial cable.
LTE-A Module Series EM06 Hardware Design Figure 27: Connection between RF Connector and Mating Plug Using Ø 1.
LTE-A Module Series EM06 Hardware Design 6 Electrical, Reliability and Radio Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 25: Absolute Maximum Ratings Parameter Min. Max. Unit VCC -0.3 4.7 V Voltage at Digital Pins -0.3 2.3 V 6.2. Power Supply Requirements The typical input voltage of EM06 is 3.7V, as specified by PCIe M.2 Electromechanical Spec Rev1.0.
LTE-A Module Series EM06 Hardware Design 6.3. I/O Requirements Table 27: I/O Requirements Parameter Description Min. Max. Unit VIH Input high voltage 0.7 × VDD18 1) VDD18+0.3 V VIL Input low voltage -0.3 0.3 × VDD18 V VOH Output high voltage VDD18-0.5 VDD18 V VOL Output low voltage 0 0.4 V NOTE 1) V DD18 refers to I/O power domain. 6.4. Operation and Storage Temperatures Table 28: Operation and Storage Temperatures Parameter Min. Typ. Max.
LTE-A Module Series EM06 Hardware Design 6.5. Current Consumption Table 29: EM06-E Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 50 uA AT+CFUN=0 (USB disconnected) 2.77 mA WCDMA PF=64 (USB disconnected) 2.91 mA WCDMA PF=128 (USB disconnected) 3.05 mA WCDMA PF=256 (USB disconnected) 2.83 mA LTE-FDD PF=64 (USB disconnected) 3.88 mA LTE-FDD PF=128 (USB disconnected) 3.88 mA LTE-FDD PF=256 (USB disconnected) 4.
LTE-A Module Series EM06 Hardware Design LTE data transfer (GNSS OFF) 2CA data transfer EM06_Hardware_Design WCDMA B5 HSUPA CH4407 @22dBm 572 mA WCDMA B8 HSDPA CH3012 @22.3dBm 566 mA WCDMA B8 HSUPA CH3012 @21.8dBm 553 mA LTE-FDD B1 CH300 @23.8dBm 670 mA LTE-FDD B3 CH1575 @23.8dBm 830 mA LTE-FDD B5 CH2525 @23.3dBm 647 mA LTE-FDD B7 CH3100 @23.48dBm 880 mA LTE-FDD B8 CH3625 @23.2dBm 640 mA LTE-FDD B20 CH6300 @22.8dBm 770 mA LTE-FDD B28 CH27460 @22.
LTE-A Module Series EM06 Hardware Design WCDMA voice call LTE-FDD B7+B20 @20.7dBm 840 mA LTE-FDD B7+B28 @20.1dBm 830 mA LTE-FDD B20+B32 @21.9dBm 701 mA LTE-TDD B38+B38 @21.4dBm 424 mA LTE-TDD B40+B40 @21.8dBm 464 mA LTE-TDD B41+B41 @21.5dBm 435 mA WCDMA B1 CH10700 @23.1dBm 663 mA WCDMA B3 CH1338 @22.6dBm 665 mA WCDMA B5 CH4407 @22.7dBm 625 mA WCDMA B8 CH3012 @22.9dBm 633 mA Table 30: EM06-J Current Consumption Parameter Description Conditions Typ.
LTE-A Module Series EM06 Hardware Design LTE data transfer (GNSS OFF) 2CA data transfer EM06_Hardware_Design WCDMA B3 HSDPA CH1338 @23.4dBm 704 mA WCDMA B3 HSUPA CH1338 @22.7dBm 655 mA WCDMA B6 HSDPA CH4175 @23.7dBm 589 mA WCDMA B6 HSUPA CH4175 @23.5dBm 578 mA WCDMA B8 HSDPA CH3012 @23.4dBm 653 mA WCDMA B8 HSUPA CH3012 @22.4dBm 584 mA WCDMA B19 HSDPA CH738 @23.4dBm 628 mA WCDMA B19 HSUPA CH738 @22.4dBm 575 mA LTE-FDD B1 CH300 @23.3dBm 707 mA LTE-FDD B3 CH1575 @23.
LTE-A Module Series EM06 Hardware Design WCDMA voice call WCDMA B1 CH10700 @23.7dBm 735 mA WCDMA B3 CH1338 @23.8dBm 740 mA WCDMA B6 CH4175 @23.7dBm 610 mA WCDMA B8 CH3012 @23.8dBm 675 mA WCDMA B19 CH738 @23.9dBm 650 mA 6.6. RF Output Power The following table shows the RF output power of EM06 module. Table 31: RF Output Power Frequency Max. Min. WCDMA bands 24dBm+1/-3dB <-50dBm LTE- FDD bands 23dBm±2dB <-40dBm LTE-TDD bands 23dBm±2dB <-40dBm 6.7.
LTE-A Module Series EM06 Hardware Design LTE-FDD B3 (10M) -97dBm -97dBm -100dBm -93.3dBm LTE-FDD B5 (10M) -97dBm -99dBm -100.5dBm -94.3dBm LTE-FDD B7 (10M) -95.5dBm -98dBm -99.5dBm -94.3dBm LTE-FDD B8 (10M) -97.5dBm -98dBm -100.5dBm -93.3dBm LTE-FDD B20 (10M) -96.5dBm -98.5dBm -100.5dBm -93.3dBm LTE-FDD B28 (10M) -96.5dBm -98.5dBm -100.5dBm -94.8dBm LTE-TDD B38 (10M) -96dBm -97.5dBm -99dBm -96.3dBm LTE-TDD B40 (10M) -96dBm -97.5dBm -98.5dBm -96.
LTE-A Module Series EM06 Hardware Design NOTES 1) SIMO is a smart antenna technology that uses a single antenna at the transmitter side and multiple (two for EM06) antennas at the receiver side, which can improve Rx performance. 2. 2) Per 3GPP specification. 1. 6.8. ESD Characteristics The module is not protected against electrostatic discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components.
LTE-A Module Series EM06 Hardware Design Figure 28: Thermal Dissipation Area on Bottom Side of Module (Top View) There are some other measures to enhance heat dissipation performance: Add ground vias as many as possible on PCB. Maximize airflow over/around the module. Place the module away from other heating sources. Module mounting holes must be used to attach (ground) the device to the main PCB ground.
LTE-A Module Series EM06 Hardware Design 7 Mechanical Dimensions and Packaging This chapter mainly describes mechanical dimensions and packaging specifications of EM06 module. All dimensions are measured in mm, and the tolerances for dimensions without tolerance values are ±0.05mm. 7.1.
LTE-A Module Series EM06 Hardware Design 7.2. Standard Dimensions of M.2 PCI Express The following figure shows the standard dimensions of M.2 PCI Express. Please refer to document [4] for detailed A and B. Figure 30: Standard Dimensions of M.2 Type 3042-S3 (Unit: mm) According to M.2 nomenclature, EM06 is Type 3042-S3-B (30.0mm × 42.0mm, max component height on the top is 1.5mm and single-sided, key ID is B). Figure 31: M.
LTE-A Module Series EM06 Hardware Design 7.3. Design Effect Drawings of the Module Figure 32: Top View of the Module Figure 33: Bottom View of the Module NOTE These are design effect drawings of EM06 module. For more accurate pictures, please refer to the module that you get from Quectel.
LTE-A Module Series EM06 Hardware Design 7.4. M.2 Connector EM06 adopts a standard PCI Express M.2 connector which compiles with the directives and standards listed in the document [4]. 7.5. Packaging EM06 modules are packaged in trays. Each tray contains 10 modules. The smallest package contains 100 modules.
LTE-A Module Series EM06 Hardware Design 8 Appendix References Table 35: Related Documents SN Document Name Remark [1] Quectel_M.2_EVB_User_Guide M.2 EVB User Guide [2] Quectel_EP06&EG06&EM06_AT_Commands_Manual EP06, EG06 and EM06 AT Commands Manual [3] Quectel_EP06&EG06&EM06_GNSS_AT_Commands_ Manual EP06, EG06 and EM06 GNSS AT Commands Manual [4] PCI Express M.
LTE-A Module Series EM06 Hardware Design HSPA High Speed Packet Access HSUPA High Speed Uplink Packet Access kbps Kilo Bits Per Second LED Light Emitting Diode LTE Long Term Evolution Mbps Million Bits Per Second ME Mobile Equipment (Module) MIMO Multiple-Input Multiple-Output MLCC Multiplayer Ceramic Chip Capacitor MMS Multimedia Messaging Service MO Mobile Originated MT Mobile Terminated PDU Protocol Data Unit PPP Point-to-Point Protocol RF Radio Frequency Rx Receive SAR
LTE-A Module Series EM06 Hardware Design 9 IC & FCC Requirement FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met: 1. This Modular Approval is limited to OEM installation for mobile and fixed applications only.
LTE-A Module Series EM06 Hardware Design configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs: A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above).
LTE-A Module Series EM06 Hardware Design L’exploitation est autorisée aux deux conditions suivantes : 1) l’appareil ne doit pas produire de brouillage; 2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement.
