Product Info

Automotive Module Series
AG35 Hardware Design
AG35_Hardware_Design 117 / 129
Thermal Pad
Heatsink
Application Board
Application Board
Heatsink
Thermal Pad
AG35 Module
Shielding Cover
Figure 43: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB)
1. For better performance, the maximum temperature of the internal BB chip should be kept below
105°C. When the maximum temperature of the BB chip reaches or exceeds 105°C, the module
works normal but provides reduced performance (such as RF output power, data rate, etc.). When
the maximum BB chip temperature reaches or exceeds 118°C, the module will disconnect from the
network, and it will recover to network connected state after the maximum temperature falls below
118°C. Therefore, the thermal design should be maximally optimized to make sure the maximum BB
chip temperature always maintains below 105°C. Customers can execute AT+QTEMP command
and get the maximum BB chip temperature from the first returned value.
2. For more detailed introduction on thermal design, please refer to document [7].
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