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Automotive Module Series
AG35 Hardware Design
AG35_Hardware_Design 3 / 129
16. Updated the recommended reflow soldering
thermal profile and involved parameters (Chapter
8.2).
1.2
2019-04-30
Eden LIU/
Dominic GONG
1. Removed the optional LTE-FDD B28 from
AG35-NA.
2. Enabled HSIC interface (pin 194/195) and added
related information thereof (Chapter 2.2, Chapter
2.3, Chapter 3.2, Chapter 3.3 and Chapter 3.23).
3. Added audio interface characteristics (Table 17).
4. Updated the reference circuit for connection with
AF20 module (Figure 29).
5. Added AG35-E and AG35-LA GNSS performance
parameters (Table 33 and Table 35).
6. Updated AG35-J GNSS performance parameters
(Table 36).
7. Updated GNSS frequency (Table 44).
8. Updated current consumption values of the module
(Chapter 6.4).
9. Updated RF receiving sensitivity (Chapter 6.6).
10. Updated electrostatic discharge characteristics
(Table 69).
11. Updated the recommended stencil thickness and
the peak reflow temperature (Chapter 8.2).
1.3
2019-05-20
Eden LIU
Corrected some pin names in the pin assignment
figure (Figure 2).