Product Info
Table Of Contents
- About the Document
- Contents
- Table Index
- Figure Index
- 1 Introduction
- 2 Product Concept
- 3 Application Interfaces
- 3.1. General Description
- 3.2. Pin Assignment
- 3.3. Pin Description
- 3.4. Operating Modes
- 3.5. Power Saving
- 3.6. Power Supply
- 3.7. Power-on/off Scenarios
- 3.8. Reset the Module
- 3.9. (U)SIM Interfaces
- 3.10. USB Interface
- 3.11. UART Interfaces
- 3.12. PCM and I2C Interfaces
- 3.13. SPI Interface
- 3.14. Network Status Indication
- 3.15. STATUS
- 3.16. ADC Interface
- 3.17. Behaviors of RI
- 3.18. USB_BOOT Interface
- 4 GNSS Receiver
- 5 Antenna Interfaces
- 6 Electrical, Reliability and Radio Characteristics
- 7 Mechanical Dimensions
- 8 Storage, Manufacturing and Packaging
- 9 Appendix A References
- 10 Appendix B GPRS Coding Schemes
- 11 Appendix C GPRS Multi-slot Classes
- 12 Appendix D EDGE Modulation and Coding Schemes
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 75 / 93
WCDMA B8 TBD TBD TBD -103.7dBm
LTE-FDD B1 (10M) TBD TBD TBD -96.3dBm
LTE-FDD B3 (10M) TBD TBD TBD -93.3dBm
LTE-FDD B7 (10M) TBD TBD TBD -94.3dBm
LTE-FDD B8 (10M)
TBD TBD TBD -93.3dBm
LTE-FDD B20 (10M) TBD TBD TBD -93.3dBm
LTE-FDD B28 (10M) TBD TBD TBD -94.8dBm
6.7. Electrostatic Discharge
The module is not protected against electrostatic discharge (ESD) in general. Consequently, it is subject
to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and
packaging procedures must be applied throughout the processing, handling and operation of any
application that incorporates the module.
The following table shows the module’s electrostatic discharge characteristics.
Table 44: Electrostatic Discharge Characteristics
Test Points Contact Discharge Air Discharge Unit
VBAT, GND ±5 ±10 KV
All Antenna Interfaces ±4 ±8 KV
Other Interfaces ±0.5 ±1 KV
6.8. Thermal Consideration
In order to achieve better performance of the module, it is recommended to comply with the following
principles for thermal consideration:
On customers’ PCB design, please keep placement of the module away from heating sources,
especially high power components such as ARM processor, audio power amplifier, power supply, etc.