Product Info
Table Of Contents
- About the Document
- Contents
- Table Index
- Figure Index
- 1 Introduction
- 2 Product Concept
- 3 Application Interfaces
- 3.1. General Description
- 3.2. Pin Assignment
- 3.3. Pin Description
- 3.4. Operating Modes
- 3.5. Power Saving
- 3.6. Power Supply
- 3.7. Power-on/off Scenarios
- 3.8. Reset the Module
- 3.9. (U)SIM Interfaces
- 3.10. USB Interface
- 3.11. UART Interfaces
- 3.12. PCM and I2C Interfaces
- 3.13. SPI Interface
- 3.14. Network Status Indication
- 3.15. STATUS
- 3.16. ADC Interface
- 3.17. Behaviors of RI
- 3.18. USB_BOOT Interface
- 4 GNSS Receiver
- 5 Antenna Interfaces
- 6 Electrical, Reliability and Radio Characteristics
- 7 Mechanical Dimensions
- 8 Storage, Manufacturing and Packaging
- 9 Appendix A References
- 10 Appendix B GPRS Coding Schemes
- 11 Appendix C GPRS Multi-slot Classes
- 12 Appendix D EDGE Modulation and Coding Schemes
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 76 / 93
Do not place components on the opposite side of the PCB area where the module is mounted, in order
to facilitate adding of heatsink when necessary.
Do not apply solder mask on the opposite side of the PCB area where the module is mounted, so as
to ensure better heat dissipation performance.
The reference ground of the area where the module is mounted should be complete, and add ground
vias as many as possible for better heat dissipation.
Make sure the ground pads of the module and PCB are fully connected.
According to customers’ application demands, the heatsink can be mounted on the top of the module,
or the opposite side of the PCB area where the module is mounted, or both of them.
The heatsink should be designed with as many fins as possible to increase heat dissipation area.
Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and
module/PCB.
The following shows two kinds of heatsink designs for reference and customers can choose one or both
of them according to their application structure.
Heatsink
EG
91 Module
Application Board
Application Board
H
eatsink
Thermal Pad
Shielding Cover
Figure 39: Referenced Heatsink Design (Heatsink at the Top of the Module)