Product Info
Table Of Contents
- About the Document
- Contents
- Table Index
- Figure Index
- 1 Introduction
- 2 Product Concept
- 3 Application Interfaces
- 3.1. General Description
- 3.2. Pin Assignment
- 3.3. Pin Description
- 3.4. Operating Modes
- 3.5. Power Saving
- 3.6. Power Supply
- 3.7. Power-on/off Scenarios
- 3.8. Reset the Module
- 3.9. (U)SIM Interfaces
- 3.10. USB Interface
- 3.11. UART Interfaces
- 3.12. PCM and I2C Interfaces
- 3.13. SPI Interface
- 3.14. Network Status Indication
- 3.15. STATUS
- 3.16. ADC Interface
- 3.17. Behaviors of RI
- 3.18. USB_BOOT Interface
- 4 GNSS Receiver
- 5 Antenna Interfaces
- 6 Electrical, Reliability and Radio Characteristics
- 7 Mechanical Dimensions
- 8 Storage, Manufacturing and Packaging
- 9 Appendix A References
- 10 Appendix B GPRS Coding Schemes
- 11 Appendix C GPRS Multi-slot Classes
- 12 Appendix D EDGE Modulation and Coding Schemes
LTE Standard Module Series
EG91 Hardware Design
EG91_Hardware_Design 82 / 93
8 Storage, Manufacturing and
Packaging
8.1. Storage
EG91 is stored in a vacuum-sealed bag. It is rated at MSL 3, and its storage restrictions are listed below.
1. Shelf life in vacuum-sealed bag: 12 months at <40ºC/90%RH.
2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other high
temperature processes must be:
Mounted within 168 hours at the factory environment of ≤30ºC/60%RH.
Stored at <10% RH.
3. Devices require bake before mounting, if any circumstances below occurs:
When the ambient temperature is 23ºC±5ºC and the humidity indicator card shows the humidity
is >10% before opening the vacuum-sealed bag.
Device mounting cannot be finished within 168 hours at factory conditions of ≤30ºC/60%RH.
If baking is required, devices may be baked for 8 hours at 120ºC±5ºC.
As the plastic package cannot be subjected to high temperature, it should be removed from devices
before high temperature (120ºC) baking. If shorter baking time is desired, please refer to IPC/JEDECJ-
STD-033 for baking procedure.
NOTE