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EC21 Hardware Design

LTE Standard Module Series

Rev. EC21_Hardware_Design_V1.7

Date: 2019-08-19

Status: Released

www.quectel.com

Summary of content (124 pages)

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EC21 Hardware Design LTE Standard Module Series Rev. EC21_Hardware_Design_V1.7 Date: 2019-08-19 Status: Released www.quectel.
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LTE Standard Module Series EC21 Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit: http://www.quectel.com/support/sales.
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LTE Standard Module Series EC21 Hardware Design About the Document History Revision Date Author Description 1.0 2016-04-15 Yeoman CHEN Initial Yeoman CHEN/ Frank WANG/ Lyndon LIU 1. Updated frequency bands in Table 1. 2. Updated transmitting power, supported maximum baud rate of main UART, supported internet protocols, supported USB drivers of USB interface, and temperature range in Table 2. 3. Updated timing of turning on module in Figure 12. 4. Updated timing of turning off module in Figure 13.
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LTE Standard Module Series EC21 Hardware Design 6.4 10. Added note about SIMO in Chapter 6.6. 1. 2. 3. 4. 5. 1.3 2017-01-24 Lyndon LIU/ Rex WANG 6. 7. 8. 9. 10. 1.4 2017-03-01 Geely YANG Deleted the LTE band TDD B41 of EC21-CT 1. 2. 3. 4. 5. 6. 7. 8. 9. 1.5 2018-03-05 Annice ZHANG/ Lyndon LIU/ Frank WANG 10. 11. 12. 13. 14. 15. 16. 17. 18. EC21_Hardware_Design Updated frequency bands in Table 1. Updated function diagram in Figure 1. Updated pin assignment (top view) in Figure 2.
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LTE Standard Module Series EC21 Hardware Design 19. Updated GPRS multi-slot classes in Table 55. 20. Updated storage information in Chapter 8.1 1.6 2019-04-30 Woody WU/ Nathan LIU/ Frank WANG 1. Added new variants EC21-EU and related information. 2. Updated star structure of the power supply in Figure 8. 3. Updated power-on scenario of module in Figure 12. 4. Updated reference circuit with translator chip in Figure 20. 5.
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LTE Standard Module Series EC21 Hardware Design 8. Updated EC21-EC current consumption in Table 42. 9. Added EC21-AUX current consumption in Table 43. 10. Updated EC21-EU conducted RF receiving sensitivity in Table 53. 11. Added EC21-AUX conducted RF receiving sensitivity in Table 55. 12. Updated module bottom dimensions (bottom view) in Figure 45. 13. Added tape and reel directions in Figure 51.
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LTE Standard Module Series EC21 Hardware Design Contents About the Document ................................................................................................................................ 2 Contents .................................................................................................................................................... 6 Table Index ....................................................................................................................................
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LTE Standard Module Series EC21 Hardware Design 3.14.1. WLAN Interface ........................................................................................................... 62 3.14.2. BT Interface* ................................................................................................................ 62 3.15. ADC Interfaces ...................................................................................................................... 62 3.16. SGMII Interface ..........................
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LTE Standard Module Series EC21 Hardware Design 11 Appendix C GPRS Multi-slot Classes .......................................................................................... 121 12 Appendix D EDGE Modulation and Coding Schemes ................................................................
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LTE Standard Module Series EC21 Hardware Design Table Index TABLE 1: FREQUENCY BANDS OF EC21 SERIES MODULE........................................................................ 18 TABLE 2: KEY FEATURES OF EC21 MODULE ............................................................................................... 19 TABLE 3: I/O PARAMETERS DEFINITION ....................................................................................................... 26 TABLE 4: PIN DESCRIPTION ..........................
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LTE Standard Module Series EC21 Hardware Design TABLE 42: EC21-EC CURRENT CONSUMPTION........................................................................................... 93 TABLE 43: EC21-AUX CURRENT CONSUMPTION ........................................................................................ 95 TABLE 44: RF OUTPUT POWER ..................................................................................................................... 98 TABLE 45: EC21-E CONDUCTED RF RECEIVING SENSITIVITY .
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LTE Standard Module Series EC21 Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 23 FIGURE 2: PIN ASSIGNMENT (TOP VIEW) .................................................................................................... 25 FIGURE 3: SLEEP MODE APPLICATION VIA UART .......................................................................................
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LTE Standard Module Series EC21 Hardware Design FIGURE 38: REFERENCE CIRCUIT OF GNSS ANTENNA ............................................................................. 78 FIGURE 39: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ................................................ 80 FIGURE 40: MECHANICALS OF U.FL-LP CONNECTORS ............................................................................. 80 FIGURE 41: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ............................................
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LTE Standard Module Series EC21 Hardware Design 1 Introduction This document defines EC21 module and describes its air interface and hardware interfaces which are connected with customers’ applications. This document can help customers quickly understand module interface specifications, electrical and mechanical details, as well as other related information of EC21 module. To facilitate its application in different fields, relevant reference design is also provided for customers’ reference.
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LTE Standard Module Series EC21 Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating EC21 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product.
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LTE Standard Module Series EC21 Hardware Design FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met: 1. This Modular Approval is limited to OEM installation for mobile and fixed applications only.
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LTE Standard Module Series EC21 Hardware Design If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8.
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LTE Standard Module Series EC21 Hardware Design (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate the equipment.
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LTE Standard Module Series EC21 Hardware Design 2 Product Concept 2.1. General Description EC21 is a series of LTE-FDD/LTE-TDD/WCDMA/GSM wireless communication module with receive diversity. It provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks. It also provides GNSS1) and voice functionality2) for customers’ specific applications.
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LTE Standard Module Series EC21 Hardware Design EC21-KL FDD: B1/B3/B5/B7/B8 N N Y N EC21-AUX3) FDD: B1/B2/B3/B4/B5/B7/B8/ B28 TDD: B40 B1/B2/B4/B5/ B8 850/900/ 1800/1900MHz Y Y NOTES 1. 1) 2. 2) 3. 4. GNSS function is optional. EC21 series module contains Telematics version and Data-only version. Telematics version supports voice and data functions, while Data-only version only supports data function. 3) B2 band on EC21-AU and EC21-AUX module does not support Rx-diversity.
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LTE Standard Module Series EC21 Hardware Design Class 3 (24dBm+1/-3dB) for WCDMA bands Class 3 (23dBm±2dB) for LTE-FDD bands Class 3 (23dBm±2dB) for LTE-TDD bands LTE Features Support up to non-CA Cat 1 FDD and TDD Support 1.4/3/5/10/15/20MHz RF bandwidth Support MIMO in DL direction LTE-FDD: Max 10Mbps (DL)/Max 5Mbps (UL) LTE-TDD: Max 8.96Mbps (DL)/Max 3.
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LTE Standard Module Series EC21 Hardware Design synchronization USB Interface UART Interfaces Compliant with USB 2.0 specification (slave only); the data transfer rate can reach up to 480Mbps Used for AT command communication, data transmission, GNSS NMEA output, software debugging, firmware upgrade and voice over USB Support USB serial drivers for: Windows 7/8/8.1/10, Linux 2.6/3.x/4.1~4.15, Android 4.x/5.x/6.x/7.x/8.x/9.x, etc.
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LTE Standard Module Series EC21 Hardware Design NOTES 1. 2. 3. 4. 1) SD card, wireless connectivity and SGMII interfaces are not supported on ThreadX module. Within operation temperature range, the module is 3GPP compliant. 3) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call* (emergency call is not supported on ThreadX module), etc. There is no unrecoverable malfunction.
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LTE Standard Module Series EC21 Hardware Design SAW ANT_MAIN ANT_GNSS ANT_DIV PAM SAW Switch Duplex LNA SAW VBAT_RF APT PA PRx DRx Tx NAND DDR2 SDRAM Transceiver IQ VBAT_BB PMIC Control Control PWRKEY Baseband RESET_N ADCs 19.2M XO STATUS VDD_EXT USB (U)SIM PCM I2C UARTs SGMII WLAN BT GPIOs SD Figure 1: Functional Diagram 2.4.
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LTE Standard Module Series EC21 Hardware Design 3 Application Interfaces 3.1. General Description EC21 is equipped with 80 LCC pads plus 64 LGA pads that can be connected to cellular application platform. The subsequent chapters will provide detailed descriptions of the following functions/pins/ interfaces.
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LTE Standard Module Series EC21 Hardware Design 3.2. Pin Assignment The following figure shows the pin assignment of EC21 module.
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LTE Standard Module Series EC21 Hardware Design 5. 6. 7. 8. 9. Pins 119~126 and 128 are used for SGMII interface. Pins 24~27 for PCM function are multiplexing pins used for audio design on EC21 module and BT function on FC20 module. SD card, wireless connectivity and SGMII interfaces (pins 37~40, 118, 127, 129~139, 119~126, 128, 23, 28~34) are not supported on ThreadX module. Keep all RESERVED pins and unused pins unconnected. GND pads 85~112 should be connected to ground in the design.
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LTE Standard Module Series EC21 Hardware Design VBAT_RF 57, 58 VDD_EXT 7 GND 8, 9, 19, 22, 36, 46, 48, 50~54, 56, 72, 85~112 PI PO Power supply for module’s RF part Provide 1.8V for external circuit Vmax=4.3V Vmin=3.3V Vnorm=3.8V It must be provided with sufficient current up to 1.8A in a burst transmission. Vnorm=1.8V IOmax=50mA Power supply for external GPIO’s pull-up circuits. If unused, keep it open. Ground Power-on/off Pin Name PWRKEY RESET_N Pin No.
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LTE Standard Module Series EC21 Hardware Design USB_VBUS USB_DP USB_DM 71 69 70 USB power supply, used for USB detection Vmax=5.25V Vmin=3.0V Vnorm=5.0V Typical: 5.0V If unused, keep it open. USB differential data bus (+) Compliant with USB 2.0 standard specification. Require differential impedance of 90Ω. If unused, keep it open. IO USB differential data bus (-) Compliant with USB 2.0 standard specification. Require differential impedance of 90Ω. If unused, keep it open.
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LTE Standard Module Series EC21 Hardware Design USIM_RST USIM_ PRESENCE 17 13 DO Reset signal of (U)SIM card For 1.8V (U)SIM: VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM: VOLmax=0.45V VOHmin=2.55V DI (U)SIM card insertion detection VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. I/O Description DC Characteristics Comment DO Ring indicator VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. DO Data carrier detection VOLmax=0.
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LTE Standard Module Series EC21 Hardware Design Pin Name DBG_TXD DBG_RXD Pin No. 12 11 I/O Description DC Characteristics Comment Transmit data VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. DI Receive data VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. I/O Description DC Characteristics Comment AI General purpose analog to digital converter Voltage range: 0.3V to VBAT_BB If unused, keep it open.
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LTE Standard Module Series EC21 Hardware Design I2C Interface Pin Name I2C_SCL I2C_SDA Pin No. 41 42 I/O Description DC Characteristics Comment I2C serial clock. Used for external codec An external pull-up resistor is required. 1.8V only. If unused, keep it open. OD I2C serial data. Used for external codec An external pull-up resistor is required. 1.8V only. If unused, keep it open. I/O Description OD SD Card Interface Pin Name SDC2_ DATA3 SDC2_ DATA2 Pin No.
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LTE Standard Module Series EC21 Hardware Design VILmax=0.76V VIHmin=1.72V VIHmax=3.34V SDC2_ DATA1 SDC2_ DATA0 SDC2_CLK SDC2_CMD 30 31 32 33 EC21_Hardware_Design IO IO DO IO SD card SDIO bus DATA1 SD card SDIO bus DATA0 SD card SDIO bus clock SD card SDIO bus command 1.8V signaling: VOLmax=0.45V VOHmin=1.4V VILmin=-0.3V VILmax=0.58V VIHmin=1.27V VIHmax=2.0V 3.0V signaling: VOLmax=0.38V VOHmin=2.01V VILmin=-0.3V VILmax=0.76V VIHmin=1.72V VIHmax=3.34V 1.8V signaling: VOLmax=0.45V VOHmin=1.
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LTE Standard Module Series EC21 Hardware Design VILmin=-0.3V VILmax=0.58V VIHmin=1.27V VIHmax=2.0V level, please refer to SD 3.0 protocol for more details. If unused, keep it open. 3.0V signaling: VOLmax=0.38V VOHmin=2.01V VILmin=-0.3V VILmax=0.76V VIHmin=1.72V VIHmax=3.34V SD_INS_ DET VDD_SDIO 23 34 DI SD card insertion detect VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. PO SD card SDIO bus pull-up power IOmax=50mA 1.8V/2.85V configurable.
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LTE Standard Module Series EC21 Hardware Design VOLmax=0.35V VOHmin=2.14V VILmax=0.71V VIHmin=1.78V SGMII_ MCLK USIM2_VDD SGMII_TX_M SGMII_TX_P SGMII_RX_P SGMII_RX_M 122 128 123 124 125 126 DO PO AO AO AI AI SGMII MDIO (Management Data Input/Output) clock For 1.8V: VOLmax=0.45V VOHmin=1.4V For 2.85V: VOLmax=0.35V VOHmin=2.14V 1.8V/2.85V power domain. If unused, keep it open. SGMII MDIO pull-up power source Configurable power source. 1.8V/2.85V power domain.
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LTE Standard Module Series EC21 Hardware Design SDC1_ DATA3 SDC1_ DATA2 SDC1_ DATA1 SDC1_ DATA0 SDC1_CLK SDC1_CMD PM_ENABLE WAKE_ON_ WIRELESS WLAN_EN 129 130 131 132 133 134 127 135 136 EC21_Hardware_Design WLAN SDIO data bus D3 VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. WLAN SDIO data bus D2 VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain.
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LTE Standard Module Series EC21 Hardware Design COEX_UART_ 137 RX DI LTE/WLAN&BT coexistence signal COEX_UART_ 138 TX DO LTE/WLAN&BT coexistence signal WLAN_SLP_ CLK DO WLAN sleep clock BT_RTS BT_TXD BT_RXD BT_CTS BT_EN 118 37 38 39 VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. Cannot be pulled up before startup. If unused, keep it open. VOLmax=0.45V VOHmin=1.35V 1.8V power domain. Cannot be pulled up before startup. If unused, keep it open.
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LTE Standard Module Series EC21 Hardware Design Other Interface Pins Pin Name WAKEUP_IN W_DISABLE# AP_READY Pin No. 1 4 2 I/O DI Description Sleep mode control DC Characteristics Comment VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. Cannot be pulled up before startup. Low level wakes up the module. If unused, keep it open. 1.8V power domain. Pull-up by default. At low voltage level, module can enter airplane mode. If unused, keep it open.
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LTE Standard Module Series EC21 Hardware Design NOTES 1. 1. 2. 1) PCM interface pins are multiplexing pins used for audio design on EC25 module and BT function on FC20 module. SD card, wireless connectivity and SGMII interfaces pins are not supported on ThreadX module. BT function is under development. 3.4. Operating Modes The table below briefly summarizes the various operating modes referred in the following chapters.
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LTE Standard Module Series EC21 Hardware Design 3.5.1.1. UART Application If the host communicates with module via UART interface, the following preconditions can let the module enter into sleep mode.   Execute AT+QSCLK=1 command to enable sleep mode. Drive DTR to high level. The following figure shows the connection between the module and the host. Figure 3: Sleep Mode Application via UART    Driving the host DTR to low level will wake up the module.
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LTE Standard Module Series EC21 Hardware Design Figure 4: Sleep Mode Application with USB Remote Wakeup Sending data to EC21 via USB will wake up the module.  When EC21 has a URC to report, the module will send remote wake-up signals via USB bus so as to wake up the host. 3.5.1.3. USB Application with USB Suspend/Resume and RI Function If the host supports USB suspend and resume, but does not support remote wake-up function, the RI signal is needed to wake up the host.
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LTE Standard Module Series EC21 Hardware Design   Sending data to EC21 via USB will wake up the module. When EC21 has a URC to report, RI signal will wake up the host. 3.5.1.4. USB Application without USB Suspend Function If the host does not support USB suspend function, USB_VBUS should be disconnected via an additional control circuit to let the module enter sleep mode.    Execute AT+QSCLK=1 command to enable sleep mode. Ensure the DTR is held at high level or keep it open. Disconnect USB_VBUS.
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LTE Standard Module Series EC21 Hardware Design Hardware: The W_DISABLE# pin is pulled up by default. Driving it to low level will let the module enter airplane mode. Software: AT+CFUN command provides the choice of the functionality level through setting into 0, 1 or 4.  AT+CFUN=0: Minimum functionality mode. Both (U)SIM and RF functions are disabled.  AT+CFUN=1: Full functionality mode (by default).  AT+CFUN=4: Airplane mode. RF function is disabled. NOTES 1.
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LTE Standard Module Series EC21 Hardware Design 3.6.2. Decrease Voltage Drop The power supply range of the module is from 3.3V to 4.3V. Please make sure that the input voltage will never drop below 3.3V. The following figure shows the voltage drop during burst transmission in 2G network. The voltage drop will be less in 3G and 4G networks. Figure 7: Power Supply Limits during Burst Transmission To decrease voltage drop, a bypass capacitor of about 100µF with low ESR (ESR=0.
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LTE Standard Module Series EC21 Hardware Design 3.6.3. Reference Design for Power Supply Power design for the module is very important, as the performance of the module largely depends on the power source. The power supply should be able to provide sufficient current up to 2.0A at least. If the voltage drop between the input and output is not too high, it is suggested that an LDO should be used to supply power for the module.
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LTE Standard Module Series EC21 Hardware Design 3.7. Power-on/off Scenarios 3.7.1. Turn on Module Using the PWRKEY The following table shows the pin definition of PWRKEY. Table 7: Pin Definition of PWRKEY Pin Name PWRKEY Pin No. 21 I/O Description Comment DI Turn on/off the module The output voltage is 0.8V because of the diode drop in the Qualcomm chipset. When EC21 is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to a low level for at least 500ms.
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LTE Standard Module Series EC21 Hardware Design Figure 11: Turn on the Module by Using Keystroke The power-on scenario is illustrated in the following figure. NOTE 1 VBA T ≥500ms VH=0.8V PWRKEY VIL≤0.5V Abo ut 100ms VDD_EXT ≥100ms. Afte r this time, the BOOT_CONFIG pins ca n b e set h igh level b y exter nal circuit. BOO T_CONFIG & USB_BOO T Pin s RESET_N ≥2.
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LTE Standard Module Series EC21 Hardware Design NOTES 1. Please make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the time between powering up VBAT and pulling down PWRKEY pin is no less than 30ms. 2. PWRKEY can be pulled down directly to GND with a recommended 10kΩ resistor if module needs to be powered on automatically and shutdown is not needed. 3.7.2.
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LTE Standard Module Series EC21 Hardware Design NOTE 1. 2. In order to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shut down by PWRKEY or AT command, then the power supply can be cut off. When turning off module with AT command, please keep PWRKEY at high level after the execution of power-off command. Otherwise the module will be turned on again after successfully turn-off. 3.8.
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LTE Standard Module Series EC21 Hardware Design Figure 15: Reference Circuit of RESET_N by Using Button The reset scenario is illustrated in the following figure. Figure 16: Timing of Resetting Module NOTES 1. 2. Use RESET_N only when failed to turn off the module by AT+QPOWD command and PWRKEY pin. Ensure that there is no large capacitance on PWRKEY and RESET_N pins. 3.9. (U)SIM Interface The (U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8V and 3.
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LTE Standard Module Series EC21 Hardware Design Table 9: Pin Definition of (U)SIM Interface Pin Name Pin No. I/O Description Comment Either 1.8V or 3.0V is supported by the module automatically. USIM_VDD 14 PO Power supply for (U)SIM card USIM_DATA 15 IO Data signal of (U)SIM card USIM_CLK 16 DO Clock signal of (U)SIM card USIM_RST 17 DO Reset signal of (U)SIM card USIM_ PRESENCE 13 DI (U)SIM card insertion detection USIM_GND 10 1.8V power domain. If unused, keep it open.
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LTE Standard Module Series EC21 Hardware Design Figure 18: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector In order to enhance the reliability and availability of the (U)SIM card in customers’ applications, please follow the criteria below in (U)SIM circuit design:       Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace length as less than 200mm as possible. Keep (U)SIM card signals away from RF and VBAT traces.
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LTE Standard Module Series EC21 Hardware Design Table 10: Pin Description of USB Interface Pin Name Pin No. I/O Description Comment USB_DP 69 IO USB differential data bus (+) Require differential impedance of 90Ω USB_DM 70 IO USB differential data bus (-) Require differential impedance of 90Ω USB_VBUS 71 PI USB power supply, used for USB detection Typical 5.0V GND 72 Ground For more details about the USB 2.0 specifications, please visit http://www.usb.org/home.
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LTE Standard Module Series EC21 Hardware Design    Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is important to route the USB differential traces in inner-layer with ground shielding on not only upper and lower layers but also right and left sides. Pay attention to the influence of junction capacitance of ESD protection components on USB data lines. Typically, the capacitance value should be less than 2.0pF.
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LTE Standard Module Series EC21 Hardware Design Table 12: Pin Definition of Debug UART Interface Pin Name Pin No. I/O Description DBG_TXD 12 DO Transmit data DBG_RXD 11 DI Receive data Comment 1.8V power domain The logic levels are described in the following table. Table 13: Logic Levels of Digital I/O Parameter Min. Max. Unit VIL -0.3 0.6 V VIH 1.2 2.0 V VOL 0 0.45 V VOH 1.35 1.8 V The module provides 1.8V UART interface.
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LTE Standard Module Series EC21 Hardware Design Another example with transistor translation circuit is shown as below. The circuit design of dotted line section can refer to the design of solid line section, in terms of both module input and output circuit designs, but please pay attention to the direction of connection. Figure 21: Reference Circuit with Transistor Circuit NOTE Transistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps. 3.12.
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LTE Standard Module Series EC21 Hardware Design EC21 supports 16-bit linear data format. The following figures show the primary mode’s timing relationship with 8KHz PCM_SYNC and 2048KHz PCM_CLK, as well as the auxiliary mode’s timing relationship with 8KHz PCM_SYNC and 256KHz PCM_CLK. Figure 22: Primary Mode Timing Figure 23: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design.
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LTE Standard Module Series EC21 Hardware Design Table 14: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Description Comment PCM_IN 24 DI PCM data input 1.8V power domain PCM_OUT 25 DO PCM data output 1.8V power domain PCM_SYNC 26 IO PCM data frame synchronization signal 1.8V power domain PCM_CLK 27 IO PCM data bit clock 1.8V power domain I2C_SCL 41 OD I2C serial clock Require external pull-up to 1.
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LTE Standard Module Series EC21 Hardware Design 3.13. SD Card Interface EC21 supports SDIO 3.0 interface for SD card. The following table shows the pin definition of SD card interface. Table 15: Pin Definition of SD Card Interface Pin Name Pin No.
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LTE Standard Module Series EC21 Hardware Design In SD card interface design, in order to ensure good communication performance with SD card, the following design principles should be complied with:          SD_INS_DET must be connected. The voltage range of SD card power supply VDD_3V is 2.7V~3.6V and a sufficient current up to 0.8A should be provided.
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LTE Standard Module Series EC21 Hardware Design Table 16: Pin Definition of Wireless Connectivity Interfaces Pin Name Pin No. I/O Description Comment SDC1_DATA3 129 IO WLAN SDIO data bus D3 1.8V power domain SDC1_DATA2 130 IO WLAN SDIO data bus D2 1.8V power domain SDC1_DATA1 131 IO WLAN SDIO data bus D1 1.8V power domain SDC1_DATA0 132 IO WLAN SDIO data bus D0 1.8V power domain SDC1_CLK 133 DO WLAN SDIO bus clock 1.8V power domain SDC1_CMD 134 IO WLAN SDIO bus command 1.
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LTE Standard Module Series EC21 Hardware Design PCM_IN1) 24 DI PCM data input 1.8V power domain PCM_OUT1) 25 DO PCM data output 1.8V power domain PCM_SYNC1) 26 IO PCM data frame synchronization signal 1.8V power domain PCM_CLK1) 27 IO PCM data bit clock 1.8V power domain BT_EN 139 DO BT function control via FC20 module. 1.8V power domain Active high. The following figure shows a reference design of wireless connectivity interfaces with Quectel FC20 module.
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LTE Standard Module Series EC21 Hardware Design 4. 5. module. Wireless connectivity interfaces are not supported on ThreadX module. For more information about wireless connectivity interfaces, please refer to document [5]. 3.14.1. WLAN Interface EC21 provides a low power SDIO 3.0 interface and control interface for WLAN design. SDIO interface supports the SDR mode (up to 50MHz). As SDIO signals are very high-speed, in order to ensure the SDIO interface design corresponds with the SDIO 3.
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LTE Standard Module Series EC21 Hardware Design In order to improve the accuracy of ADC, the trace of ADC should be surrounded by ground. Table 17: Pin Definition of ADC Interfaces Pin Name Pin No. Description ADC0 45 General purpose analog to digital converter ADC1 44 General purpose analog to digital converter The following table describes the characteristic of ADC function. Table 18: Characteristic of ADC Parameter Min. ADC0 Voltage Range ADC1 Voltage Range ADC Resolution Typ. Max.
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LTE Standard Module Series EC21 Hardware Design The following table shows the pin definition of SGMII interface. Table 19: Pin Definition of SGMII Interface Pin Name Pin No. I/O Description Comment EPHY_RST_N 119 DO Ethernet PHY reset 1.8V/2.85V power domain EPHY_INT_N 120 DI Ethernet PHY interrupt 1.8V power domain SGMII_MDATA 121 IO SGMII MDIO (Management Data Input/Output) data 1.8V/2.85V power domain SGMII_MCLK DO SGMII MDIO (Management Data Input/Output) clock 1.8V/2.
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LTE Standard Module Series EC21 Hardware Design The following figure shows a reference design of SGMII interface with PHY AR8033 application. Figure 28: Reference Circuit of SGMII Interface with PHY AR8033 Application In order to enhance the reliability and availability in customers’ applications, please follow the criteria below in the Ethernet PHY circuit design:     Keep SGMII data and control signals away from other sensitive circuits/signals such as RF circuits, analog signals, etc.
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LTE Standard Module Series EC21 Hardware Design 3.17. Network Status Indication The network indication pins can be used to drive network status indication LEDs. The module provides two pins which are NET_MODE and NET_STATUS. The following tables describe the pin definition and logic level changes in different network status. Table 20: Pin Definition of Network Connection Status/Activity Indicator Pin Name Pin No. I/O Description Comment 1.8V power domain. Cannot be pulled up before startup 1.
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LTE Standard Module Series EC21 Hardware Design Figure 29: Reference Circuit of the Network Indicator 3.18. STATUS The STATUS pin is an open drain output for indicating the module’s operation status. It can be connected to a GPIO of DTE with a pull-up resistor, or as LED indication circuit as below. When the module is turned on normally, the STATUS will present the low state. Otherwise, the STATUS will present high-impedance state. Table 22: Pin Definition of STATUS Pin Name STATUS Pin No.
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LTE Standard Module Series EC21 Hardware Design Figure 30: Reference Circuits of STATUS NOTES The status pin cannot be used as indication of module shutdown status when VBAT power supply is removed. 3.19. Behaviors of RI AT+QCFG="risignaltype","physical" command can be used to configure RI behavior. No matter on which port URC is presented, the URC will trigger the behaviors of RI pin. NOTE URC can be outputted from UART port, USB AT port and USB modem port through configuration via AT+QURCCFG command.
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LTE Standard Module Series EC21 Hardware Design The RI behavior can be changed by AT+QCFG="urc/ri/ring" command. Please refer to document [2] for details. 3.20. USB_BOOT Interface EC21 provides a USB_BOOT pin. Customers can pull up USB_BOOT to 1.8V before VDD_EXT is powered up, and the module will enter emergency download mode when it is powered on. In this mode, the module supports firmware upgrade over USB interface. Table 24: Pin Definition of USB_BOOT Interface Pin Name USB_BOOT Pin No.
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LTE Standard Module Series EC21 Hardware Design NOTE 1 VBAT ≥500ms VH=0.8V PWRKEY VIL≤0.5V About 100ms VDD_EXT USB_BOOT can be pul led up to 1.8V before VDD_EXT Is powered up, and the module will enter emerge ncy download mode wh en i t is powered on. USB_BOOT RESET_N Figure 32: Timing Sequence for Entering Emergency Download Mode NOTES 1. 2. Please make sure that VBAT is stable before pulling down PWRKEY pin.
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LTE Standard Module Series EC21 Hardware Design 4 GNSS Receiver 4.1. General Description EC21 includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS). EC21 supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default. By default, EC21 GNSS engine is switched off. It has to be switched on via AT command.
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LTE Standard Module Series EC21 Hardware Design Hot start @open sky Accuracy (GNSS) CEP-50 Autonomous 2.5 s XTRA enabled 1.8 s Autonomous @open sky <2.5 m NOTES 1. 2. 3. Tracking sensitivity: the lowest GNSS signal value at the antenna port on which the module can keep on positioning for 3 minutes. Reacquisition sensitivity: the lowest GNSS signal value at the antenna port on which the module can fix position again within 3 minutes after loss of lock.
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LTE Standard Module Series EC21 Hardware Design 5 Antenna Interfaces EC21 antenna interfaces include a main antenna interface, an Rx-diversity antenna interface which is used to resist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna interface. The antenna ports have an impedance of 50Ω. 5.1. Main/Rx-diversity Antenna Interfaces 5.1.1. Pin Definition The pin definition of main antenna and Rx-diversity antenna interfaces is shown below.
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LTE Standard Module Series EC21 Hardware Design WCDMA B2 1850~1910 1930~1990 MHz WCDMA B4 1710~1755 2110~2155 MHz WCDMA B5 824~849 869~894 MHz WCDMA B8 880~915 925~960 MHz LTE-FDD B1 1920~1980 2110~2170 MHz LTE-FDD B2 1850~1910 1930~1990 MHz LTE-FDD B3 1710~1785 1805~1880 MHz LTE-FDD B4 1710~1755 2110~2155 MHz LTE-FDD B5 824~849 869~894 MHz LTE-FDD B7 2500~2570 2620~2690 MHz LTE-FDD B8 880~915 925~960 MHz LTE-FDD B12 699~716 729~746 MHz LTE-FDD B13 777~787
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LTE Standard Module Series EC21 Hardware Design Figure 33: Reference Circuit of RF Antenna Interface NOTES 1. Keep a proper distance between the main antenna and the Rx-diversity antenna to improve the receiving sensitivity. 2. ANT_DIV function is enabled by default. AT+QCFG="diversity",0 command can be used to disable receive diversity. Please refer to document [2] for details. Place the π-type matching components (R1&C1&C2, R2&C3&C4) as close to the antenna as possible. 3. 5.1.4.
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LTE Standard Module Series EC21 Hardware Design .
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LTE Standard Module Series EC21 Hardware Design Figure 37: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design:      Please use an impedance simulation tool to control the characteristic impedance of RF traces as 50Ω. The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground.
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LTE Standard Module Series EC21 Hardware Design Table 29: GNSS Frequency Type Frequency Unit GPS 1575.42±1.023 MHz GLONASS 1597.5~1605.8 MHz Galileo 1575.42±2.046 MHz BeiDou 1561.098±2.046 MHz QZSS 1575.42 MHz A reference design of GNSS antenna is shown as below. Figure 38: Reference Circuit of GNSS Antenna NOTES 1. 2. An external LDO can be selected to supply power according to the active antenna requirement.
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LTE Standard Module Series EC21 Hardware Design 5.3. Antenna Installation 5.3.1. Antenna Requirement The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Table 30: Antenna Requirements Type Requirements GNSS1) Frequency range: 1559MHz~1609MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive antenna gain: > 0dBi Active antenna noise figure: <1.
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LTE Standard Module Series EC21 Hardware Design 5.3.2. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. Figure 39: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 40: Mechanicals of U.
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LTE Standard Module Series EC21 Hardware Design The following figure describes the space factor of mated connector. Figure 41: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://www.hirose.com.
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LTE Standard Module Series EC21 Hardware Design 6 Electrical, Reliability and Radio Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 31: Absolute Maximum Ratings Parameter Min. Max. Unit VBAT_RF/VBAT_BB -0.3 4.7 V USB_VBUS -0.3 5.5 V Peak Current of VBAT_BB 0 0.8 A Peak Current of VBAT_RF 0 1.8 A Voltage at Digital Pins -0.3 2.
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LTE Standard Module Series EC21 Hardware Design 6.2. Power Supply Ratings Table 32: Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT_BB and VBAT_RF The actual input voltages must be kept between the minimum and maximum values. 3.3 3.8 4.3 V Voltage drop during burst transmission Maximum power control level on EGSM900 400 mV IVBAT Peak supply current (during transmission slot) Maximum power control level on EGSM900 1.8 2.
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LTE Standard Module Series EC21 Hardware Design 3. and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to the normal operation temperature levels, the module will meet 3GPP specifications again. “*” means under development. 6.4. Current Consumption The values of current consumption are shown below. Table 34: EC21-E Current Consumption Parameter Description Conditions Typ.
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LTE Standard Module Series EC21 Hardware Design EDGE data transfer (GNSS OFF) WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) EC21_Hardware_Design EGSM900 2DL/3UL @30.3dBm 467 mA EGSM900 1DL/4UL @29.4dBm 555 mA DCS1800 4DL/1UL @29.6dBm 185 mA DCS1800 3DL/2UL @29.1dBm 305 mA DCS1800 2DL/3UL @28.8dBm 431 mA DCS1800 1DL/4UL @29.
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LTE Standard Module Series EC21 Hardware Design LTE-FDD B20 @23.57dBm 770 mA EGSM900 PCL=5 @33.08dBm 264.0 mA DCS1800 PCL=0 @29.75dBm 190.0 mA WCDMA B1 @23.69dBm 683 mA WCDMA B5 @23.61dBm 741 mA WCDMA B8 @23.35dBm 564 mA GSM voice call WCDMA voice call Table 35: EC21-A Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 10 uA AT+CFUN=0 (USB disconnected) 1.25 mA WCDMA PF=64 (USB disconnected) 2.03 mA WCDMA PF=128 (USB disconnected) 1.
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LTE Standard Module Series EC21 Hardware Design LTE data transfer (GNSS OFF) WCDMA voice call LTE-FDD B2 @23.11dBm 721.0 mA LTE-FDD B4 @23.16dBm 748.0 mA LTE-FDD B12 @23.25dBm 668.0 mA WCDMA B2 @22.97dBm 565.0 mA WCDMA B4 @22.91dBm 590.0 mA WCDMA B5 @23.06dBm 493.0 mA Table 36: EC21-V Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 10 uA AT+CFUN=0 (USB disconnected) 1.07 mA LTE-FDD PF=64 (USB disconnected) 2.
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LTE Standard Module Series EC21 Hardware Design Idle state (GNSS OFF) WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) WCDMA voice call LTE-FDD PF=128 (USB disconnected) 2.4 mA WCDMA PF=64 (USB disconnected) 22.0 mA WCDMA PF=64 (USB connected) 32.0 mA LTE-FDD PF=64 (USB disconnected) 23.6 mA LTE-FDD PF=64 (USB connected) 33.6 mA WCDMA B1 HSDPA @22.59dBm 589.0 mA WCDMA B1 HSUPA @22.29dBm 623.0 mA WCDMA B5 HSDPA @22.22dBm 511.0 mA WCDMA B5 HSUPA @21.64dBm 503.
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LTE Standard Module Series EC21 Hardware Design Idle state (GNSS OFF) WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) WCDMA voice call WCDMA PF=64 (USB disconnected) 22.0 mA WCDMA PF=64 (USB connected) 32.0 mA LTE-FDD PF=64 (USB disconnected) 23.5 mA LTE-FDD PF=64 (USB connected) 33.5 mA WCDMA B1 HSDPA @22.59dBm 623.0 mA WCDMA B1 HSUPA @22.47dBm 628.0 mA WCDMA B5 HSDPA @22.95dBm 605.0 mA WCDMA B5 HSUPA @22.87dBm 610.0 mA WCDMA B8 HSDPA @22.37dBm 549.
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LTE Standard Module Series EC21 Hardware Design Idle state (GNSS OFF) LTE data transfer (GNSS OFF) LTE-FDD PF=64 (USB disconnected) 23.5 mA LTE-FDD PF=64 (USB connected) 33.8 mA LTE-FDD B1 @23.35dBm 734.0 mA LTE-FDD B3 @22.95dBm 778.0 mA LTE-FDD B8 @22.81dBm 722.0 mA LTE-FDD B18 @23.15dBm 677.0 mA LTE-FDD B19 @23.17dBm 688.0 mA LTE-FDD B26 @23.37dBm 723.0 mA Table 40: EC21-KL Current Consumption Parameter Description Conditions Typ.
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LTE Standard Module Series EC21 Hardware Design Table 41: EC21-EU Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 12.8 uA AT+CFUN=0 (USB disconnected) 1.8 mA GSM DRX=2 (USB disconnected) 3.0 mA GSM DRX=9 (USB disconnected) 2.2 mA WCDMA PF=64 (USB disconnected) 3.1 mA WCDMA PF=128 (USB disconnected) 2.6 mA LTE-FDD PF=64 (USB disconnected) 3.3 mA LTE-FDD PF=128 (USB disconnected) 2.6 mA EGSM900 @DRX=5 (USB disconnected) 17.
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LTE Standard Module Series EC21 Hardware Design (GNSS OFF) WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) EGSM900 3DL/2UL @25.91dBm 240.0 mA EGSM900 2DL/3UL @23.83dBm 296.2 mA EGSM900 1DL/4UL @22.73dBm 357.1 mA DCS1800 4DL/1UL @26.65dBm 138.7 mA DCS1800 3DL/2UL @25.61dBm 227.4 mA DCS1800 2DL/3UL @23.46dBm 302.8 mA DCS1800 1DL/4UL @22.19dBm 381.7 mA WCDMA B1 HSDPA @23.26dBm 605.0 mA WCDMA B1 HSUPA @23.09dBm 615.3 mA WCDMA B8 HSDPA @23.27dBm 544.
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LTE Standard Module Series EC21 Hardware Design Table 42: EC21-EC Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 7 uA AT+CFUN=0 (USB disconnected) 0.9 mA GSM DRX=2 (USB disconnected) 2.0 mA GSM DRX=9 (USB disconnected) 1.3 mA WCDMA PF=64 (USB disconnected) 1.9 mA WCDMA PF=128 (USB disconnected) 1.6 mA LTE-FDD PF=64 (USB disconnected) 2.3 mA LTE-FDD PF=128 (USB disconnected) 1.6 mA GSM DRX=5 (USB disconnected) 16.
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LTE Standard Module Series EC21 Hardware Design transfer (GNSS OFF) WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) EGSM900 3DL/2UL PCL=8 @24.47dBm 277.6 mA EGSM900 2DL/3UL PCL=8 @24.99dBm 389.8 mA EGSM900 1DL/4UL PCL=8 @24.77dBm 504.2 mA DCS1800 4DL/1UL PCL=2 @25.91dBm 149.6 mA DCS1800 3DL/2UL PCL=2 @25.71dBm 243.4 mA DCS1800 2DL/3UL PCL=2 @25.97dBm 327.5 mA DCS1800 1DL/4UL PCL=2 @25.93dBm 423.4 mA WCDMA B1 HSDPA @22.72dBm 581.4 mA WCDMA B1 HSUPA @22.59dBm 601.
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LTE Standard Module Series EC21 Hardware Design Table 43: EC21-AUX Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 7 uA AT+CFUN=0 (USB disconnected) 1.00 mA GSM DRX=2 (USB disconnected) 1.91 mA GSM DRX=9 (USB disconnected) 1.31 mA WCDMA PF=64 (USB disconnected) 2.19 mA WCDMA PF=128 (USB disconnected) 1.91 mA LTE-FDD PF=64 (USB disconnected) 2.74 mA LTE-FDD PF=128 (USB disconnected) 2.12 mA LTE-TDD PF=64 (USB disconnected) 2.
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LTE Standard Module Series EC21 Hardware Design EDGE data transfer (GNSS OFF) EC21_Hardware_Design EGSM900 3DL/2UL @31.74dBm 398.0 mA EGSM900 2DL/3UL @29.32dBm 448.0 mA EGSM900 1DL/4UL @28.30dBm 532.0 mA DCS1800 4DL/1UL @29.20dBm 149.0 mA DCS1800 3DL/2UL @28.16dBm 225.0 mA DCS1800 2DL/3UL @26.05dBm 283.0 mA DCS1800 1DL/4UL @25.14dBm 357.0 mA PCS1900 4DL/1UL @29.39dBm 159.7 mA PCS1900 3DL/2UL @28.06dBm 234.6 mA PCS1900 2DL/3UL @26.01dBm 289.0 mA PCS1900 1DL/4UL @25.
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LTE Standard Module Series EC21 Hardware Design WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) GSM voice call EC21_Hardware_Design PCS1900 2DL/3UL PCL=2 @23.13dBm 307.2 mA PCS1900 1DL/4UL PCL=2 @21.82dBm 402.8 mA WCDMA B1 HSDPA @22.78dBm 530.0 mA WCDMA B1 HSUPA @22.12dBm 542.0 mA WCDMA B2 HSDPA @22.54dBm 556.3 mA WCDMA B2 HSUPA @22.17dBm 542.4 mA WCDMA B4 HSDPA @23.27dBm 491.0 mA WCDMA B4 HSUPA @23.19dBm 504.0 mA WCDMA B5 HSDPA @23.18dBm 480.
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LTE Standard Module Series EC21 Hardware Design WCDMA voice call PCS1900 PCL=0 @29.47dBm 154.5 mA WCDMA B1 @23.44dBm 568.0 mA WCDMA B2 @23.15dBm 614.0 mA WCDMA B4 @23.20dBm 497.0 mA WCDMA B5 @23.23dBm 492.0 mA WCDMA B8 @23.05dBm 553.0 mA Conditions Typ.
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LTE Standard Module Series EC21 Hardware Design LTE-FDD bands 23dBm±2dB < -39dBm LTE-TDD bands 23dBm±2dB < -39dBm NOTE In GPRS 4 slots TX mode, the maximum output power is reduced by 3.0dB. The design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. 6.6. RF Receiving Sensitivity The following tables show the conducted RF receiving sensitivity of EC21 series module.
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LTE Standard Module Series EC21 Hardware Design Table 46: EC21-A Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B2 -110.0dBm / / -104.7dBm WCDMA B4 -110.0dBm / / -106.7dBm WCDMA B5 -110.5dBm / / -104.7dBm LTE-FDD B2 (10MHz) -98.0dBm -98.0dBm -101.0dBm -94.3dBm LTE-FDD B4 (10MHz) -97.5dBm -99.0dBm -101.0dBm -96.3dBm LTE-FDD B12 (10MHz) -97.2dBm -98.0dBm -101.0dBm -93.
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LTE Standard Module Series EC21 Hardware Design Table 49: EC21-KL Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) LTE-FDD B1 (10MHz) -98.0dBm -99.5dBm -100.5dBm -96.3dBm LTE-FDD B3 (10MHz) -97.0dBm -97.5dBm -99.5dBm -93.3dBm LTE-FDD B5 (10MHz) -98.0dBm -99.5dBm -100.5dBm -94.3dBm LTE-FDD B7 (10MHz) -96.0dBm -96.0dBm -98.5dBm -94.3dBm LTE-FDD B8 (10MHz) -97.0dBm -99.0dBm -101.0dBm -93.
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LTE Standard Module Series EC21 Hardware Design LTE-FDD B8 (10MHz) -98.2dBm -98.2dBm -102.3dBm -93.3dBm LTE-FDD B28 (10MHz) -98.0dBm -98.7dBm -102.1dBm -94.8dBm Table 52: EC21-AU Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) GSM850 -109.0dBm / / -102.0dBm EGSM900 -109.0dBm / / -102.0dBm DCS1800 -109.0dBm / / -102.0dBm PCS1900 -109.0dBm / / -102.0dBm WCDMA B1 -110.0dBm / / -106.7dBm WCDMA B2 -110.0dBm / / -104.
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LTE Standard Module Series EC21 Hardware Design Table 53: EC21-EU Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) EGSM900 -109.0dBm / / -102.0dBm DCS1800 -109.0dBm / / -102.0dbm WCDMA B1 -110.5dBm / / -106.7dBm WCDMA B8 -110.5dBm / / -103.7dBm LTE-FDD B1 (10MHz) -98.2dBm -99dBm -101.7dBm -96.3dBm LTE-FDD B3 (10MHz) -98.7dBm -99.5dBm -101.2dBm -93.3dBm LTE-FDD B7 (10MHz) -96.8dBm -98.5dBm -100.7dBm -94.3dBm LTE-FDD B8 (10MHz) -98.
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LTE Standard Module Series EC21 Hardware Design Table 55: EC21-AUX Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) GSM850 -109.0dBm / / -102.0dBm EGSM900 -109.0dBm / / -102.0dBm DCS1800 -109.0dBm / / -102.0dBm PCS1900 -109.0dBm / / -102.0dBm WCDMA B1 -110.0dBm -109.5dBm -112dBm -106.7dBm WCDMA B2 -110.5dBm / / -104.7dBm WCDMA B4 -110.0dBm -110dBm -112dBm -104.7dBm WCDMA B5 -111.0dBm -112dBm -113dBm -104.7dBm WCDMA B8 -111.
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LTE Standard Module Series EC21 Hardware Design 6.7. Electrostatic Discharge The module is not protected against electrostatics discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates the module. The following table shows the module‘s’ electrostatics discharge characteristics.
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LTE Standard Module Series EC21 Hardware Design Figure 42: Referenced Heatsink Design (Heatsink at the Top of the Module) Figure 43: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB) NOTES 1. The module offers the best performance when the internal BB chip stays below 105°C. When the maximum temperature of the BB chip reaches or exceeds 105°C, the module works normal but provides reduced performance (such as RF output power, data rate, etc.).
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LTE Standard Module Series EC21 Hardware Design 2. always maintains below 105°C. Customers can execute AT+QTEMP command and get the maximum BB chip temperature from the first returned value. For more detailed guidelines on thermal design, please refer to document [7].
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LTE Standard Module Series EC21 Hardware Design 7 Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in mm, and the dimensional tolerances are ±0.05mm unless otherwise specified. 7.1. Mechanical Dimensions of the Module 32.0±0.15 2.4±0.2 29.0±0.15 Pin Pin 1 1 0.
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LTE Standard Module Series EC21 Hardware Design 32.0＋/-0.15 3.4 1.30 2.0 5.96 1.1 3.85 1.1 3.5 1.90 Pin 1 1.30 2.0 3.0 0.87 3.0 1.8 1.15 2.15 1.8 2.8 4.82 1.05 4.8 1.6 29.0＋/-0.15 2.0 6.8 1.7 2.49 1.9 2.4 3.2 3.4 3.2 3.4 0.8 3.2 3.5 4.37 1.5 3.
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LTE Standard Module Series EC21 Hardware Design 7.2. Recommended Footprint Figure 46: Recommended Footprint (Top View) NOTES 1. 2. The keepout area should not be designed. For easy maintenance of the module, please keep about 3mm between the module and other components in the host PCB.
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LTE Standard Module Series EC21 Hardware Design 7.3. Design Effect Drawings of the Module Figure 47: Top View of the Module Figure 48: Bottom View of the Module NOTE These are renderings of EC21 module. For authentic appearance, please refer to the module that you receive from Quectel.
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LTE Standard Module Series EC21 Hardware Design 8 Storage, Manufacturing and Packaging 8.1. Storage EC21 is stored in a vacuum-sealed bag. It is rated at MSL 3, and its storage restrictions are listed below. 1. Shelf life in vacuum-sealed bag: 12 months at <40ºC/90%RH. 2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other high temperature processes must be:   Mounted within 168 hours at the factory environment of ≤30ºC/60%RH. Stored at <10%RH. 3.
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LTE Standard Module Series EC21 Hardware Design 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be 0.18mm~0.20mm. For more details, please refer to document [4].
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LTE Standard Module Series EC21 Hardware Design Max slope 2~3°C/sec Reflow time (D: over 220°C) 40~60sec Max temperature 238~245°C Cooling down slope 1~4°C/sec Reflow Cycle Max reflow cycle 1 8.3. Packaging .1 ±0 50 . 1 30.3± 0.15 29.3± 0.15 0.35± 0.05 30.3± 0.15 44.00± 0.1 2.00± 0.1 4.00± 0.1 44.00± 0.3 20.20± 0.15 1.75± 0.1 EC21 is packaged in tap and reel carriers. Each reel is 11.88m long and contains 250pcs modules. The figure below shows the package details, measured in mm. 4.
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LTE Standard Module Series EC21 Hardware Design e p a t r e v o C 48.5 13 100 d e e f f o n o i t c e r i D 44.5+0.20 -0.
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LTE Standard Module Series EC21 Hardware Design 9 Appendix A References Table 58: Related Documents SN Document Name Remark [1] Quectel_EC2x&EGxx_Power_Management_ Application_Note Power management application note for EC25, EC21, EC20 R2.0, EC20 R2.1, EG95, EG91 and EG25-G modules [2] Quectel_EC2x&EG9x&EM05_AT_Commands_ Manual AT commands manual for EC25, EC21, EC20 R2.0, EC20 R2.
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LTE Standard Module Series EC21 Hardware Design CTS Clear To Send DC-HSPA+ Dual-carrier High Speed Packet Access DFOTA Delta Firmware Upgrade Over The Air DL Downlink DTR Data Terminal Ready DTX Discontinuous Transmission EFR Enhanced Full Rate ESD Electrostatic Discharge FDD Frequency Division Duplex FR Full Rate GLONASS GLObalnaya NAvigatsionnaya Sputnikovaya Sistema, the Russian Global Navigation Satellite System GMSK Gaussian Minimum Shift Keying GNSS Global Navigation Satellit
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LTE Standard Module Series EC21 Hardware Design MO Mobile Originated MS Mobile Station (GSM engine) MT Mobile Terminated PAP Password Authentication Protocol PCB Printed Circuit Board PDU Protocol Data Unit PPP Point-to-Point Protocol QAM Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying RF Radio Frequency RHCP Right Hand Circularly Polarized Rx Receive SGMII Serial Gigabit Media Independent Interface SIM Subscriber Identification Module SIMO Single Input Multi
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LTE Standard Module Series EC21 Hardware Design Vnorm Normal Voltage Value Vmin Minimum Voltage Value VIHmax Maximum Input High Level Voltage Value VIHmin Minimum Input High Level Voltage Value VILmax Maximum Input Low Level Voltage Value VILmin Minimum Input Low Level Voltage Value VImax Absolute Maximum Input Voltage Value VImin Absolute Minimum Input Voltage Value VOHmax Maximum Output High Level Voltage Value VOHmin Minimum Output High Level Voltage Value VOLmax Maximum Output Low
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LTE Standard Module Series EC21 Hardware Design 10 Appendix B GPRS Coding Schemes Table 60: Description of Different Coding Schemes Scheme CS-1 CS-2 CS-3 CS-4 Code Rate 1/2 2/3 3/4 1 USF 3 3 3 3 Pre-coded USF 3 6 6 12 Radio Block excl. USF and BCS 181 268 312 428 BCS 40 16 16 16 Tail 4 4 4 - Coded Bits 456 588 676 456 Punctured Bits 0 132 220 - Data Rate Kb/s 9.05 13.4 15.6 21.
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LTE Standard Module Series EC21 Hardware Design 11 Appendix C GPRS Multi-slot Classes Thirty-three classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots.
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LTE Standard Module Series EC21 Hardware Design 15 5 5 NA 16 6 6 NA 17 7 7 NA 18 8 8 NA 19 6 2 NA 20 6 3 NA 21 6 4 NA 22 6 4 NA 23 6 6 NA 24 8 2 NA 25 8 3 NA 26 8 4 NA 27 8 4 NA 28 8 6 NA 29 8 8 NA 30 5 1 6 31 5 2 6 32 5 3 6 33 5 4 6 EC21_Hardware_Design 122 / 120
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LTE Standard Module Sires EC21 Hardware Design 12 Appendix D EDGE Modulation and Coding Schemes Table 62: EDGE Modulation and Coding Schemes Coding Scheme Modulation Coding Family 1 Timeslot 2 Timeslot 4 Timeslot CS-1: GMSK / 9.05kbps 18.1kbps 36.2kbps CS-2: GMSK / 13.4kbps 26.8kbps 53.6kbps CS-3: GMSK / 15.6kbps 31.2kbps 62.4kbps CS-4: GMSK / 21.4kbps 42.8kbps 85.6kbps MCS-1 GMSK C 8.80kbps 17.60kbps 35.20kbps MCS-2 GMSK B 11.2kbps 22.4kbps 44.