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EG91 Hardware Design

LTE Standard Module Series

Rev. EG91_Hardware_Design_V1.7

Date: 2019-08-09

Status: Released

www.quectel.com

Summary of content (100 pages)

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EG91 Hardware Design LTE Standard Module Series Rev. EG91_Hardware_Design_V1.7 Date: 2019-08-09 Status: Released www.quectel.
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LTE Standard Module Series EG91 Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit: http://www.quectel.com/support/sales.
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LTE Standard Module Series EG91 Hardware Design About the Document History Revision 1.0 1.1 1.2 Date Author Description 2017-03-22 Felix YIN/ Yeoman CHEN/ Jackie WANG Initial Felix YIN/ Rex WANG 1. Added band B28A. 2. Updated the description of UMTS and GSM features in Table 2. 3. Updated the functional diagram in Figure 1. 4. Updated module operating frequencies in Table 21. 5. Updated current consumption in Table 26. 6. Updated RF output power in Table 27. 7.
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LTE Standard Module Series EG91 Hardware Design 8. Updated pin definition of RF antenna in Table 21. 9. Updated module operating frequencies in Table 22. 10. Added description of GNSS antenna interface in Chapter 5.2. 11. Updated antenna requirements in Table 25. 12. Updated RF output power in Table 32. 1.3 1.4 1.5 2019-02-03 2019-03-29 2019-05-24 Ward WANG/ Nathan LIU/ Rex WANG 1. Added new variants EG91-NS, EG91-V, EG91-EC and related contents. 2.
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LTE Standard Module Series EG91 Hardware Design and Figure 29). 1.7 2019-08-09 EG91_Hardware_Design Fanny CHEN/ Rex WANG 1. Added ThreadX variant EG91-NAX and updated related contents (Table 1 and 4, Chapter 2.2, 2.3, 3.2 and 5). 2. Added related notes of SPI interface not supported on ThreadX modules (Chapter 3.1, 3.3 and 3.13). 3. Added current consumption of EG91-NAX (Table 37). 4. Updated EG91-NA conducted RF receiving sensitivity (Table 41). 5.
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LTE Standard Module Series EG91 Hardware Design Contents About the Document ..................................................................................................................................... 2 Contents.......................................................................................................................................................... 5 Table Index ..........................................................................................................................
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LTE Standard Module Series EG91 Hardware Design 3.15. 3.16. 3.17. 3.18. STATUS ..................................................................................................................................... 51 ADC Interface ............................................................................................................................ 51 Behaviors of RI ..........................................................................................................................
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LTE Standard Module Series EG91 Hardware Design Table Index TABLE 1: FREQUENCY BANDS OF EG91 SERIES MODULE ...................................................................... 13 TABLE 2: KEY FEATURES OF EG91 MODULE ............................................................................................ 14 TABLE 3: IO PARAMETERS DEFINITION ..................................................................................................... 21 TABLE 4: PIN DESCRIPTION .................................
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LTE Standard Module Series EG91 Hardware Design TABLE 43: EG91-VX CONDUCTED RF RECEIVING SENSITIVITY .............................................................. 77 TABLE 44: EG91-EX CONDUCTED RF RECEIVING SENSITIVITY .............................................................. 78 TABLE 45: EG91-NAX CONDUCTED RF RECEIVING SENSITIVITY ........................................................... 78 TABLE 46: ELECTROSTATIC DISCHARGE CHARACTERISTICS (25ºC, 45% RELATIVE HUMIDITY) ........
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LTE Standard Module Series EG91 Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM............................................................................................................. 17 FIGURE 2: PIN ASSIGNMENT (TOP VIEW) .................................................................................................. 20 FIGURE 3: SLEEP MODE APPLICATION VIA UART .....................................................................................
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LTE Standard Module Series EG91 Hardware Design FIGURE 39: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) .................. 80 FIGURE 40: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BACKSIDE OF CUSTOMERS’ PCB) ............................................................................................................................................................... 80 FIGURE 41: MODULE TOP AND SIDE DIMENSIONS................................................................................
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LTE Standard Module Series EG91 Hardware Design 1 Introduction This document defines the EG91 module and describes its air interface and hardware interface which are connected with customers’ applications. This document can help customers quickly understand module interface specifications, electrical and mechanical details, as well as other related information of EG91 module. Associated with application note and user guide, customers can use EG91 module to design and set up mobile applications easily.
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LTE Standard Module Series EG91 Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating EG91 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product.
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LTE Standard Module Series EG91 Hardware Design 2 Product Concept 2.1. General Description EG91 module is an embedded 4G wireless communication module with receive diversity. It supports LTE-FDD/WCDMA/GSM wireless communication, and provides data connectivity on LTE-FDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks. It can also provide voice functionality 1) to meet customers’ specific application demands.
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LTE Standard Module Series EG91 Hardware Design NOTES 1. 2. 3. 1) EG91 contains Telematics version and Data-only version. Telematics version supports voice and data functions, while Data-only version only supports data function. 2) EG91-VX/-EX/-NAX are based on ThreadX OS. 3) GNSS function is optional. With a compact profile of 29.0mm × 25.0mm × 2.
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LTE Standard Module Series EG91 Hardware Design GSM Features R99: CSD: 9.6kbps GPRS: Support GPRS multi-slot class 33 (33 by default) Coding scheme: CS-1, CS-2, CS-3 and CS-4 Max 107Kbps (DL), Max 85.6Kbps (UL) EDGE: Support EDGE multi-slot class 33 (33 by default) Support GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: CS 1-4 and MCS 1-9 Uplink coding schemes: CS 1-4 and MCS 1-9 Max 296Kbps (DL)/Max 236.
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LTE Standard Module Series EG91 Hardware Design Support RTS and CTS hardware flow control Debug UART: Used for Linux console and log output 115200bps baud rate SPI Interface 2) Provides a duplex, synchronous and serial communication link with the peripheral devices. Dedicated to one-to-one connection, without chip selection. 1.8V operation voltage with clock rates up to 50MHz.
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LTE Standard Module Series EG91 Hardware Design 2.3. Functional Diagram The following figure shows a block diagram of EG91 and illustrates the major functional parts. ⚫ ⚫ ⚫ ⚫ ⚫ Power management Baseband DDR+NAND flash Radio frequency Peripheral interfaces ANT_GNSS 1) ANT_DIV ANT_MAIN PAM SAW Duplexer Switch LNA SAW VBAT_RF PA SAW PRx GPS DRx Tx NAND DDR2 SDRAM Transceiver IQ VBAT_BB PMIC Control Control PWRKEY Baseband RESET_N STATUS 19.
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LTE Standard Module Series EG91 Hardware Design 2.4. Evaluation Board Quectel provides a complete set of evaluation tools to facilitate the use and testing of EG91 module. The evaluation tool kit includes the evaluation board (UMTS<E EVB), USB data cable, earphone, antenna and other peripherals. For more details, please refer to document [7].
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LTE Standard Module Series EG91 Hardware Design 3 Application Interfaces 3.1. General Description EG91 is equipped with 62-pin 1.1mm pitch SMT pads and 44-pin ground/reserved pads that can be connected to customers’ cellular application platforms.
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LTE Standard Module Series EG91 Hardware Design 3.2. Pin Assignment GND NC VBAT_RF VBAT_RF GND GND ANT_DIV (EG91-NA/-NS/-VX/-EX/-NAX) RESERVED (Pin 56 on EG91-E) NC GND ANT_MAIN GND GND GND The following figure shows the pin assignment of EG91 module.
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LTE Standard Module Series EG91 Hardware Design NOTES 1. 2. 3. 4. 1) PWRKEY output voltage is 0.8V because of the diode drop in the Qualcomm chipset. Keep all RESERVED pins and unused pins unconnected. GND pads should be connected to ground in the design. Please note that the definition of pin 49 and 56 are different among EG91-NA/-NS/-VX/-EX/-NAX and EG91-E. For more details, please refer to Table 4. 3.3. Pin Description The following tables show the pin definition and description of EG91.
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LTE Standard Module Series EG91 Hardware Design VBAT_RF 52, 53 VDD_EXT 29 GND 3, 31, 48, 50, 54, 55, 58, 59, 61, 62, 67~74, 79~82, 89~91, 100~106 PI PO Power supply for module’s RF part Provide 1.8V for external circuit Vmax=4.3V Vmin=3.3V Vnorm=3.8V It must be provided with sufficient current up to 1.8A in a burst transmission. Vnorm=1.8V IOmax=50mA Power supply for external GPIO’s pull up circuits. If unused, keep it open. Ground Power-on/off Pin Name DC Characteristics Comment VH=0.
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LTE Standard Module Series EG91 Hardware Design Vnorm=5.0V open. Compliant with USB 2.0 standard specification. Require differential impedance of 90Ω. USB_DP 9 IO USB differential data bus (+) USB_DM 10 IO USB differential data bus (-) Compliant with USB 2.0 standard specification. Require differential impedance of 90Ω. I/O Description DC Characteristics Comment (U)SIM Interfaces Pin Name USIM_GND Pin No. Connect to ground of (U)SIM card connector.
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LTE Standard Module Series EG91 Hardware Design USIM1_RST USIM1_ PRESENCE 44 42 DO DI Reset signal of (U)SIM card (U)SIM card insertion detection For 1.8V (U)SIM: VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM: VOLmax=0.45V VOHmin=2.55V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V For 1.8V (U)SIM: Vmax=1.9V Vmin=1.
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LTE Standard Module Series EG91 Hardware Design USIM2_ PRESENCE 83 DI (U)SIM card insertion detection VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. I/O Description DC Characteristics Comment DO Ring indicator VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. DO Data carrier detection VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. Clear to send VOLmax=0.45V VOHmin=1.35V 1.8V power domain.
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LTE Standard Module Series EG91 Hardware Design VIHmin=1.2V VIHmax=2.0V open. Description DC Characteristics Comment PCM data input VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. PCM data output VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. PCM data frame synchronization signal VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. In master mode, it is an output signal.
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LTE Standard Module Series EG91 Hardware Design AI General purpose analog to digital converter Voltage range: 0.3V to VBAT_BB If unused, keep it open. I/O Description DC Characteristics Comment DO Clock signal of SPI interface VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. DO Master output slave input of SPI interface VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. 28 DI Master input slave output of SPI interface VILmin=-0.3V VILmax=0.
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LTE Standard Module Series EG91 Hardware Design VIHmax=2.0V USB_BOOT 75 DI Force the module to enter emergency download mode VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. It is recommended to reserve the test points. I/O Description DC Characteristics Comment RESERVED Pins Pin Name Pin No. 1,2, 11~14, 16, 51, 57, 63~66, 76~78, 88, 92~99 NC RESERVED 18, 25, 56 NC Keep these pins unconnected. Reserved Keep these pins unconnected. Pin 56 is only reserved on EG91-E.
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LTE Standard Module Series EG91 Hardware Design Mode this case, RF function will be invalid. Sleep Mode In this mode, the current consumption of the module will be reduced to the minimal level. During this mode, the module can still receive paging message, SMS, voice call and TCP/UDP data from the network normally. Power Down Mode In this mode, the power management unit shuts down the power supply. Software is not active. The serial interface is not accessible.
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LTE Standard Module Series EG91 Hardware Design ⚫ AP_READY will detect the sleep state of host (can be configured to high level or low level detection). Please refer to AT+QCFG="apready" for details. 3.5.1.2. USB Application with USB Remote Wakeup Function If the host supports USB suspend/resume and remote wakeup functions, the following three preconditions must be met to let the module enter sleep mode. ⚫ ⚫ ⚫ Execute AT+QSCLK=1 command to enable sleep mode.
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LTE Standard Module Series EG91 Hardware Design Module Host VDD USB_VBUS USB_DP USB_DP USB_DM USB_DM AP_READY GPIO RI EINT GND GND Figure 5: Sleep Mode Application with RI ⚫ ⚫ Sending data to EG91 through USB will wake up the module. When module has a URC to report, RI signal will wake up the host. 3.5.1.4.
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LTE Standard Module Series EG91 Hardware Design NOTE Please pay attention to the level match shown in dotted line between the module and the host. Please refer to document [1] for more details about EG91 power management application. 3.5.2. Airplane Mode When the module enters airplane mode, the RF function does not work, and all AT commands correlative with RF function will be inaccessible. This mode can be set via the following ways. Hardware: The W_DISABLE# pin is pulled up by default.
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LTE Standard Module Series EG91 Hardware Design Table 6: Pin Definition of VBAT and GND Pin Name Pin No. Description Min. Typ. Max. Unit VBAT_RF 52, 53 Power supply for module’s RF part. 3.3 3.8 4.3 V VBAT_BB 32, 33 Power supply for module’s baseband part. 3.3 3.8 4.3 V GND 3, 31, 48, 50, 54, 55, 58, 59, 61, 62, 67~74, 79~82, 89~91, 100~106 Ground - 0 - V 3.6.2. Decrease Voltage Drop The power supply range of the module is from 3.3V to 4.3V.
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LTE Standard Module Series EG91 Hardware Design VBAT VBAT_RF VBAT_BB + + D1 100nF WS4.5D3HV 100uF C4 C3 C2 C1 33pF 10pF C5 100uF C6 C7 C8 100nF 33pF 10pF Module Figure 8: Star Structure of Power Supply 3.6.3. Reference Design for Power Supply Power design for the module is very important, as the performance of the module largely depends on the power source. The power supply should be able to provide sufficient current up to 2A at least.
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LTE Standard Module Series EG91 Hardware Design 3.7. Power-on/off Scenarios 3.7.1. Turn on Module Using the PWRKEY The following table shows the pin definition of PWRKEY. Table 7: Pin Definition of PWRKEY Pin Name PWRKEY Pin No. 15 Description Turn on/off the module DC Characteristics Comment VH=0.8V The output voltage is 0.8V because of the diode drop in the Qualcomm chipset.
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LTE Standard Module Series EG91 Hardware Design S1 PWRKEY TVS Close to S1 Figure 11: Turn on the Module Using Button The power-on scenario is illustrated in the following figure. NOTE 1 VBAT ≥500ms V H =0.8V PWRKEY VIL≤0.5V About 100ms VDD_EXT ≥100ms. After this time, the BOOT_CONFIG pins can be set to high level by external circuit.
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LTE Standard Module Series EG91 Hardware Design NOTES 1. 2. Please make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is no less than 30ms. PWRKEY can be pulled down directly to GND with a recommended 10KΩ resistor if module needs to be powered on automatically and shutdown is not needed. 3.7.2. Turn off Module Either of the following methods can be used to turn off the module: ⚫ ⚫ Normal power-off procedure: Turn off the module using the PWRKEY pin.
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LTE Standard Module Series EG91 Hardware Design NOTES 1. 2. In order to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shut down by PWRKEY or AT command, the power supply can be cut off. When turning off module with AT command, please keep PWRKEY at high level after the execution of power-off command. Otherwise the module will be turned on again after successful turn-off. 3.8.
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LTE Standard Module Series EG91 Hardware Design S2 RESET_N TVS Close to S2 Figure 15: Reference Circuit of RESET_N by Using Button The reset scenario is illustrated in the following figure. VBAT ≤ 460ms ≥ 150ms VIH ≥ 1.3V RESET_N VIL ≤ 0.5V Module Status Running Resetting Restart Figure 16: Timing of Resetting Module NOTES 1. 2. Use RESET_N only when turning off the module by AT+QPOWD command and PWRKEY pin failed. Ensure that there is no large capacitance on PWRKEY and RESET_N pins. 3.9.
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LTE Standard Module Series EG91 Hardware Design Table 9: Pin Definition of (U)SIM Interfaces Pin Name Pin No. I/O Description Comment Either 1.8V or 3.0V is supported by the module automatically.
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LTE Standard Module Series EG91 Hardware Design VDD_EXT USIM_VDD 51K 15K 100nF USIM_GND Module USIM_VDD USIM_RST 0R USIM_CLK USIM_PRESENCE 0R USIM_DATA 0R (U)SIM Card Connector VCC RST GND VPP IO CLK 33pF GND 33pF 33pF GND GND Figure 17: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector If (U)SIM card detection function is not needed, please keep USIM_PRESENCE unconnected.
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LTE Standard Module Series EG91 Hardware Design ⚫ ⚫ ⚫ ⚫ Make sure the bypass capacitor between USIM_VDD and USIM_GND less than 1uF, and place it as close to (U)SIM card connector as possible. If the ground is complete on customers’ PCB, USIM_GND can be connected to PCB ground directly. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground.
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LTE Standard Module Series EG91 Hardware Design Test Points Minimize these stubs Module VDD R3 NM_0R R4 NM_0R MCU ESD Array USB_VBUS L1 USB_DM USB_DM USB_DP USB_DP Close to Module GND GND Figure 19: Reference Circuit of USB Interface A common mode choke L1 is recommended to be added in series between the module and customer’s MCU in order to suppress EMI spurious transmission.
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LTE Standard Module Series EG91 Hardware Design ⚫ The debug UART interface supports 115200bps baud rate. It is used for Linux console and log output. The following tables show the pin definition of the two UART interfaces. Table 11: Pin Definition of Main UART Interfaces Pin Name Pin No.
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LTE Standard Module Series EG91 Hardware Design The module provides 1.8V UART interfaces. A level translator should be used if customers’ application is equipped with a 3.3V UART interface. A level translator TXS0108EPWR provided by Texas Instruments is recommended. The following figure shows a reference design. 0.1uF 10K VDD_EXT VCCA VCCB 0.
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LTE Standard Module Series EG91 Hardware Design 4.7K VDD_EXT VDD_EXT 1nF MCU/ARM 10K Module RXD TXD RXD TXD 10K VCC_MCU RTS CTS GPIO EINT GPIO GND 1nF VDD_EXT 4.7K RTS CTS DTR RI DCD GND Figure 21: Reference Circuit with Transistor Circuit NOTE Transistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps. 3.12.
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LTE Standard Module Series EG91 Hardware Design 125us PCM_CLK 1 2 255 256 PCM_SYNC MSB LSB MSB MSB LSB MSB PCM_DOUT PCM_DIN Figure 22: Primary Mode Timing 125us PCM_CLK 1 2 31 32 PCM_SYNC MSB LSB MSB LSB PCM_DOUT PCM_DIN Figure 23: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design.
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LTE Standard Module Series EG91 Hardware Design Table 14: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Description Comment PCM_DIN 6 DI PCM data input 1.8V power domain PCM_DOUT 7 DO PCM data output 1.8V power domain PCM_SYNC 5 IO PCM data frame synchronization signal 1.8V power domain PCM_CLK 4 IO PCM data bit clock 1.8V power domain I2C_SCL 40 OD I2C serial clock Require an external pull-up to 1.
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LTE Standard Module Series EG91 Hardware Design 3.13. SPI Interface SPI interface of EG91 acts as the master only. It provides a duplex, synchronous and serial communication link with the peripheral devices. It is dedicated to one-to-one connection, without chip selection. Its operation voltage is 1.8V with clock rates up to 50MHz. The following table shows the pin definition of SPI interface. Table 15: Pin Definition of SPI Interface Pin Name Pin No.
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LTE Standard Module Series EG91 Hardware Design 3.14. Network Status Indication The module provides one network indication pin: NETLIGHT. The pin is used to drive a network status indication LED. The following tables describe the pin definition and logic level changes of NETLIGHT in different network status. Table 16: Pin Definition of Network Status Indicator Pin Name Pin No. I/O Description Comment NETLIGHT 21 DO Indicate the module’s network activity status 1.
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LTE Standard Module Series EG91 Hardware Design 3.15. STATUS The STATUS pin is set as the module’s operation status indicator. It will output high level when the module is powered on. The following table describes the pin definition of STATUS. Table 18: Pin Definition of STATUS Pin Name Pin No. I/O Description Comment STATUS 20 DO Indicate the module’s operation status 1.8V power domain. If unused, keep it open. The following figure shows the reference circuit of STATUS. VBAT Module 2.
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LTE Standard Module Series EG91 Hardware Design Table 19: Pin Definition of ADC Interface Pin Name Pin No. I/O Description Comment ADC0 24 AI Force the module to enter emergency download mode If unused, keep this pin open. The following table describes the characteristics of ADC interface. Table 20: Characteristics of ADC Interface Parameter Min. ADC0 Voltage Range 0.3 Typ. ADC Resolution Max. Unit VBAT_BB V 15 bits NOTES 1. 2.
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LTE Standard Module Series EG91 Hardware Design Table 21: Default Behaviors of RI State Response Idle RI keeps at high level URC RI outputs 120ms low pulse when a new URC returns 3.18. USB_BOOT Interface EG91 provides a USB_BOOT pin. Customers can pull up USB_BOOT to 1.8V before VDD_EXT is powered up, and the module will enter emergency download mode when it is powered on. In this mode, the module supports firmware upgrade over USB interface.
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LTE Standard Module Series EG91 Hardware Design NOTE 1 VBAT ≥500ms VH=0.8V PWRKEY VIL≤0.5V About 100ms VDD_EXT USB_BOOT can be pul led up to 1.8V before VDD_EXT Is powered up, and the module will enter emerge ncy download mode wh en i t is powered on. USB_BOOT RESET_N Figure 29: Timing Sequence for Entering Emergency Download Mode NOTES 1. 2. Please make sure that VBAT is stable before pulling down PWRKEY pin.
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LTE Standard Module Series EG91 Hardware Design 4 GNSS Receiver 4.1. General Description EG91 includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS). EG91 supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default. By default, EG91 GNSS engine is switched off. It has to be switched on via AT command.
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LTE Standard Module Series EG91 Hardware Design Hot start @open sky Accuracy (GNSS) CEP-50 Autonomous 1.8 s XTRA enabled 3.4 s Autonomous @open sky <2.5 m NOTES 1. 2. 3. Tracking sensitivity: the lowest GNSS signal value at the antenna port on which the module can keep on positioning for 3 minutes. Reacquisition sensitivity: the lowest GNSS signal value at the antenna port on which the module can fix position again within 3 minutes after loss of lock.
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LTE Standard Module Series EG91 Hardware Design 5 Antenna Interfaces EG91 antenna interfaces include a main antenna interface and an Rx-diversity antenna interface which is used to resist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna interface which is only supported on EG91-NA/-NS/-VX/-EX/-NAX. The impedance of the antenna port is 50Ω. 5.1. Main/Rx-diversity Antenna Interfaces 5.1.1.
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LTE Standard Module Series EG91 Hardware Design WCDMA B2 1850~1910 1930~1990 MHz WCDMA B4 1710~1755 2110~2155 MHz WCDMA B5 824~849 869~894 MHz WCDMA B8 880~915 925~960 MHz LTE-FDD B1 1920~1980 2110~2170 MHz LTE FDD B2 1850~1910 1930~1990 MHz LTE-FDD B3 1710~1785 1805~1880 MHz LTE FDD B4 1710~1755 2110~2155 MHz LTE FDD B5 824~849 869~894 MHz LTE-FDD B7 2500~2570 2620~2690 MHz LTE-FDD B8 880~915 925~960 MHz LTE FDD B12 699~716 729~746 MHz LTE FDD B13 777~787
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LTE Standard Module Series EG91 Hardware Design Main antenna Module R1 0R ANT_MAIN C1 C2 NM NM Diversity antenna R2 0R ANT_DIV C3 C4 NM NM Figure 30: Reference Circuit of RF Antenna Interface NOTES 1. 2. 3. Keep a proper distance between the main antenna and the Rx-diversity antenna to improve the receiving sensitivity. ANT_DIV function is enabled by default. AT+QCFG="diversity",0 command can be used to disable receive diversity.
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LTE Standard Module Series EG91 Hardware Design Figure 32: Coplanar Waveguide Design on a 2-layer PCB Figure 33: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 34: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design: EG91_Hardware_Design 60 / 96
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LTE Standard Module Series EG91 Hardware Design ⚫ ⚫ ⚫ ⚫ ⚫ Use impedance simulation tool to control the characteristic impedance of RF traces as 50Ω. The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible, and all the right angle traces should be changed to curved ones.
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LTE Standard Module Series EG91 Hardware Design A reference design of GNSS antenna is shown as below. VDD 0.1uF 10R Module GNSS Antenna 47nH 100pF 0R ANT_GNSS NM NM Figure 35: Reference Circuit of GNSS Antenna NOTES 1. 2. An external LDO can be selected to supply power according to the active antenna requirement. If the module is designed with a passive antenna, then the VDD circuit is not needed. 5.3. Antenna Installation 5.3.1.
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LTE Standard Module Series EG91 Hardware Design Input impedance: 50Ω Cable insertion loss: < 1dB (EGSM900, WCDMA B5/B8, LTE-FDD B5/B8/B12/B13/B20/B26/B28) Cable insertion loss: < 1.5dB (DCS1800, WCDMA B1/B2/B4, LTE-FDD B1/B2/B3/B4/B25) Cable insertion loss: < 2dB (LTE-FDD B7) NOTE 1) It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. 5.3.2.
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LTE Standard Module Series EG91 Hardware Design U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 37: Mechanicals of U.FL-LP Connectors The following figure describes the space factor of mated connector. Figure 38: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://www.hirose.com.
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LTE Standard Module Series EG91 Hardware Design 6 Electrical, Reliability and Radio Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 29: Absolute Maximum Ratings Parameter Min. Max. Unit VBAT_RF/VBAT_BB -0.3 4.7 V USB_VBUS -0.3 5.5 V Peak Current of VBAT_BB 0 0.8 A Peak Current of VBAT_RF 0 1.8 A Voltage at Digital Pins -0.3 2.
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LTE Standard Module Series EG91 Hardware Design Voltage drop during burst transmission Maximum power control level on EGSM900 IVBAT Peak supply current (during transmission slot) Maximum power control level on EGSM900 USB_VBUS USB connection detection 3.0 400 mV 1.8 2.0 A 5.0 5.25 V 6.3. Operation and Storage Temperatures The operation and storage temperatures are listed in the following table. Table 31: Operation and Storage Temperatures Parameter Min. Typ. Max.
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LTE Standard Module Series EG91 Hardware Design 6.4. Current Consumption The values of current consumption are shown below. Table 32: EG91-E Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 13 uA AT+CFUN=0 (USB disconnected) 1.1 mA GSM DRX=2 (USB disconnected) 2.0 mA GSM DRX=5 (USB suspended) 1.9 mA GSM DRX=9 (USB disconnected) 1.3 mA WCDMA PF=64 (USB disconnected) 1.7 mA WCDMA PF=64 (USB suspended) 2.1 mA WCDMA PF=512 (USB disconnected) 1.
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LTE Standard Module Series EG91 Hardware Design EDGE data transfer WCDMA data transfer EGSM900 1DL/4UL @29.26dBm 619 mA DCS1800 4DL/1UL @29.2dBm 165 mA DCS1800 3DL/2UL @29.13dBm 267 mA DCS1800 2DL/3UL @29.01dBm 406 mA DCS1800 1DL/4UL @28.86dBm 467 mA EGSM900 4DL/1UL PCL=8 @27.1dBm 163 mA EGSM900 3DL/2UL PCL=8 @27.16dBm 274 mA EGSM900 2DL/3UL PCL=8 @26.91dBm 383 mA EGSM900 1DL/4UL PCL=8 @26.12dBm 463 mA DCS1800 4DL/1UL PCL=2 @25.54dBm 136 mA DCS1800 3DL/2UL PCL=2 @25.
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LTE Standard Module Series EG91 Hardware Design WCDMA voice call WCDMA B1 CH10700 @23.06dBm 555 mA WCDMA B8 CH3012 @23.45dBm 535 mA Table 33: EG91-NA Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 13 uA AT+CFUN=0 (USB disconnected) 1.0 mA WCDMA PF=64 (USB disconnected) 2.2 mA WCDMA PF=64 (USB suspended) 2.5 mA WCDMA PF=512 (USB disconnected) 1.4 mA LTE-FDD PF=64 (USB disconnected) 2.6 mA LTE-FDD PF=64 (USB suspended) 2.
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LTE Standard Module Series EG91 Hardware Design WCDMA voice call LTE-FDD B5 CH2525 @23.39 dBm 601 mA LTE-FDD B12 CH5060 @23.16 dBm 650 mA LTE-FDD B13 CH5230 @23.36 dBm 602 mA WCDMA B2 CH9938 @23.34 dBm 627 mA WCDMA B4 CH1537 @23.47 dBm 591 mA WCDMA B5 CH4357 @ 23.37 dBm 536 mA Table 34: EG91-NS Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 8 uA AT+CFUN=0 (USB disconnected) 1.
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LTE Standard Module Series EG91 Hardware Design LTE data transfer WCDMA voice call WCDMA B5 HSDPA CH4407 @23.05 dBm 553 mA WCDMA B5 HSUPA CH4407 @ 22.91 dBm 556 mA LTE-FDD B2 CH1100 @23.26 dBm 724 mA LTE-FDD B4 CH2175 @23.52 dBm 693 mA LTE-FDD B5 CH2525 @23.51 dBm 613 mA LTE-FDD B12 CH5060 @23.39 dBm 634 mA LTE-FDD B13 CH5230 @23.54 dBm 576 mA LTE-FDD B25 CH8590@ 23.64 dBm 739 mA LTE-FDD B26 CH8765@ 23.34 dBm 647 mA WCDMA B2 CH9938 @23.39 dBm 571 mA WCDMA B4 CH1738 @23.
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LTE Standard Module Series EG91 Hardware Design Table 36: EG91-EX Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 15 uA AT+CFUN=0 (USB disconnected) 1.3 mA GSM DRX=2 (USB disconnected) 2.3 mA GSM DRX=5 (USB suspend) 2.0 mA GSM DRX=9 (USB disconnected) 1.6 mA WCDMA PF=64 (USB disconnected) 1.8 mA WCDMA PF=64 (USB suspend) 2.1 mA WCDMA PF=512 (USB disconnected) 1.3 mA LTE-FDD PF=64 (USB disconnected) 2.3 mA LTE-FDD PF=64 (USB suspend) 2.
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LTE Standard Module Series EG91 Hardware Design EDGE data transfer WCDMA data transfer LTE data transfer GSM voice call WCDMA voice call EG91_Hardware_Design DCS1800 2DL/3UL @29.21dBm 355.4 mA DCS1800 1DL/4UL @29.07dBm 455.7 mA EGSM900 4DL/1UL PCL=8 @27.29dBm 169.5 mA EGSM900 3DL/2UL PCL=8 @27.01dBm 305.06 mA EGSM900 2DL/3UL PCL=8 @26.86dBm 434 mA EGSM900 1DL/4UL PCL=8 @25.95dBm 548 mA DCS1800 4DL/1UL PCL=2 @26.11dBm 135 mA DCS1800 3DL/2UL PCL=2 @25.
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LTE Standard Module Series EG91 Hardware Design Table 37: EG91-NAX Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 9 uA AT+CFUN=0 (USB disconnected) 1.1 mA WCDMA PF=64 (USB disconnected) 2.1 mA WCDMA PF=64 (USB suspend) 2.2 mA WCDMA PF=512 (USB disconnected) 1.6 mA LTE-FDD PF=64 (USB disconnected) 2.6 mA LTE-FDD PF=64 (USB suspend) 2.7 mA LTE-FDD PF=256 (USB disconnected) 1.8 mA WCDMA PF=64 (USB disconnected) 16.
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LTE Standard Module Series EG91 Hardware Design WCDMA voice call LTE-FDD B25 @22.96dBm 689 mA LTE-FDD B26 @23.11dBm 636 mA WCDMA B2 @23.08dBm 581 mA WCDMA B4 @23.21dBm 557 mA WCDMA B5 @23.29dBm 534 mA Table 38: GNSS Current Consumption of EG91 Parameter IVBAT (GNSS) Description Conditions Typ.
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LTE Standard Module Series EG91 Hardware Design NOTE In GPRS 4 slots TX mode, the maximum output power is reduced by 3.0dB. The design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. 6.6. RF Receiving Sensitivity The following tables show the conducted RF receiving sensitivity of EG91 module. Table 40: EG91-E Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPP EGSM900 -108.6dBm NA NA -102dBm DCS1800 -109.
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LTE Standard Module Series EG91 Hardware Design LTE-FDD B2 (10MHz) -98dBm -99dBm -102.2dBm -94.3dBm LTE-FDD B4 (10MHz) -97.8dBm -99.5dBm -102.2dBm -96.3dBm LTE-FDD B5 (10MHz) -99.6dBm -100.3dBm -103dBm -94.3dBm LTE-FDD B12 (10MHz) -99.5dBm -100dBm -102.5dBm -93.3dBm LTE-FDD B13 (10MHz) -99.2dBm -100dBm -102.5dBm -93.3dBm Table 42: EG91-NS Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPP WCDMA B2 -110dBm -110dBm -112.5dBm -104.
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LTE Standard Module Series EG91 Hardware Design Table 44: EG91-EX Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPP EGSM900 -109.8dBm NA NA -102dBm DCS1800 -109.8 dBm NA NA -102dbm WCDMA B1 -110dBm -111dBm -112.5dBm -106.7dBm WCDMA B8 -110dBm -111dBm -112.5dBm -103.7dBm LTE-FDD B1 (10MHz) -98.7dBm -98.8dBm -102.4dBm -96.3dBm LTE-FDD B3 (10MHz) -98.3dBm -99.5dBm -102.5dBm -93.3dBm LTE-FDD B7 (10MHz) -97.5dBm -98.4dBm -100.3dBm -94.
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LTE Standard Module Series EG91 Hardware Design 6.7. Electrostatic Discharge The module is not protected against electrostatic discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates the module. The following table shows the module’s electrostatic discharge characteristics.
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LTE Standard Module Series EG91 Hardware Design EG91 Module Heatsink Heatsink Thermal Pad Application Board Shielding Cover Application Board Figure 39: Referenced Heatsink Design (Heatsink at the Top of the Module) Thermal Pad EG91 Module Thermal Pad Heatsink Heatsink Application Board Shielding Cover Application Board Figure 40: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB) NOTES 1. 2.
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LTE Standard Module Series EG91 Hardware Design 7 Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in mm, and the dimensional tolerances are ±0.05mm unless otherwise specified. 7.1. Mechanical Dimensions of the Module 25±0.15 2.30±0.2 29±0.
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LTE Standard Module Series EG91 Hardware Design Figure 42: Module Bottom Dimensions (Top View) EG91_Hardware_Design 82 / 96
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LTE Standard Module Series EG91 Hardware Design 7.2. Recommended Footprint Figure 43: Recommended Footprint (Top View) NOTE For easy maintenance of the module, please keep about 3mm between the module and other components in the host PCB.
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LTE Standard Module Series EG91 Hardware Design 7.3. Top and Bottom Views of the Module Figure 44: Top View of the Module Figure 45: Bottom View of the Module NOTE These are renderings of EG91. For authentic appearance, please refer to the module that you receive from Quectel.
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LTE Standard Module Series EG91 Hardware Design 8 Storage, Manufacturing and Packaging 8.1. Storage EG91 is stored in a vacuum-sealed bag. It is rated at MSL 3, and its storage restrictions are listed below. 1. Shelf life in vacuum-sealed bag: 12 months at <40ºC/90%RH. 2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other high temperature processes must be: ⚫ ⚫ Mounted within 168 hours at the factory environment of ≤30ºC/60%RH. Stored at <10%RH. 3.
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LTE Standard Module Series EG91 Hardware Design 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be 0.15mm~0.18mm. For more details, please refer to document [4].
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LTE Standard Module Series EG91 Hardware Design Max slope 2 ~ 3°C/sec Reflow time (D: over 220°C) 40 ~ 60 sec Max temperature 238 ~ 245°C Cooling down slope 1 ~ 4°C/sec Reflow Cycle Max reflow cycle 1 8.3. Packaging EG91 is packaged in a vacuum-sealed bag which is ESD protected. The bag should not be opened until the devices are ready to be soldered onto the application. The reel is 330mm in diameter and each reel contains 250pcs modules.
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LTE Standard Module Series EG91 Hardware Design 48.5 Cover tape 13 100 Direction of feed 44.5+0.20 -0.
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LTE Standard Module Series EG91 Hardware Design 9 Appendix A References Table 48: Related Documents SN Document Name Remark [1] Quectel_EC2x&EG9x_Power_Management_ Application_Note Power Management Application Note for EC25, EC21, EC20 R2.0, EC20 R2.
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LTE Standard Module Series EG91 Hardware Design DFOTA Delta Firmware Upgrade Over-The-Air DL Downlink DTR Data Terminal Ready DTX Discontinuous Transmission EFR Enhanced Full Rate ESD Electrostatic Discharge FDD Frequency Division Duplex FR Full Rate GMSK Gaussian Minimum Shift Keying GSM Global System for Mobile Communications HR Half Rate HSPA High Speed Packet Access HSDPA High Speed Downlink Packet Access HSUPA High Speed Uplink Packet Access I/O Input/Output Inorm Normal
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LTE Standard Module Series EG91 Hardware Design PCB Printed Circuit Board PDU Protocol Data Unit PPP Point-to-Point Protocol QAM Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying RF Radio Frequency RHCP Right Hand Circularly Polarized Rx Receive SMS Short Message Service TDD Time Division Duplexing TX Transmitting Direction UL Uplink UMTS Universal Mobile Telecommunications System URC Unsolicited Result Code (U)SIM (Universal) Subscriber Identity Module Vmax
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LTE Standard Module Series EG91 Hardware Design VOLmax Maximum Output Low Level Voltage Value VOLmin Minimum Output Low Level Voltage Value VSWR Voltage Standing Wave Ratio WCDMA Wideband Code Division Multiple Access EG91_Hardware_Design 92 / 96
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LTE Standard Module Series EG91 Hardware Design 10 Appendix B GPRS Coding Schemes Table 50: Description of Different Coding Schemes Scheme CS-1 CS-2 CS-3 CS-4 Code Rate 1/2 2/3 3/4 1 USF 3 3 3 3 Pre-coded USF 3 6 6 12 Radio Block excl.USF and BCS 181 268 312 428 BCS 40 16 16 16 Tail 4 4 4 - Coded Bits 456 588 676 456 Punctured Bits 0 132 220 - Data Rate Kb/s 9.05 13.4 15.6 21.
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LTE Standard Module Series EG91 Hardware Design 11 Appendix C GPRS Multi-slot Classes Thirty-three classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots.
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LTE Standard Module Series EG91 Hardware Design 15 5 5 NA 16 6 6 NA 17 7 7 NA 18 8 8 NA 19 6 2 NA 20 6 3 NA 21 6 4 NA 22 6 4 NA 23 6 6 NA 24 8 2 NA 25 8 3 NA 26 8 4 NA 27 8 4 NA 28 8 6 NA 29 8 8 NA 30 5 1 6 31 5 2 6 32 5 3 6 33 5 4 6 EG91_Hardware_Design 95 / 96
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LTE Standard Module Series EG91 Hardware Design 12 Appendix D EDGE Modulation and Coding Schemes Table 52: EDGE Modulation and Coding Schemes Coding Scheme Modulation Coding Family 1 Timeslot 2 Timeslot 4 Timeslot CS-1: GMSK / 9.05kbps 18.1kbps 36.2kbps CS-2: GMSK / 13.4kbps 26.8kbps 53.6kbps CS-3: GMSK / 15.6kbps 31.2kbps 62.4kbps CS-4: GMSK / 21.4kbps 42.8kbps 85.6kbps MCS-1 GMSK C 8.80kbps 17.60kbps 35.20kbps MCS-2 GMSK B 11.2kbps 22.4kbps 44.
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1.1. FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met: 1. This Modular Approval is limited to OEM installation for mobile and fixed applications only.
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5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.
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The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device.