Product Info

LTE Standard Module Series
EG95 Hardware Design
EG95_Hardware_Design 84 / 93
8.3. Packaging
EG95 is packaged in a vacuum-sealed bag which is ESD protected. The bag should not be opened until
the devices are ready to be soldered onto the application.
The reel is 330mm in diameter and each reel contains 250pcs modules. The following figures show the
packaging details, measured in mm.
Figure 47: Tape Dimensions
Max slope
2 ~ 3°C/sec
Reflow time (D: over 220°C)
40 ~ 60 sec
Max temperature
238 ~ 245°C
Cooling down slope
1 ~ 4°C/sec
Reflow Cycle
Max reflow cycle
1