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Module : EC25-AUX

EC25 Hardware Design

LTE Standard Module Series

Rev. EC25_Hardware_Design_V2.2

Date: 2019-08-19

Status: Released

www.quectel.com

Summary of content (135 pages)

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Module : EC25-AUX EC25 Hardware Design LTE Standard Module Series Rev. EC25_Hardware_Design_V2.2 Date: 2019-08-19 Status: Released www.quectel.
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LTE Standard Module Series EC25 Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit: http://www.quectel.com/support/sales.
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LTE Standard Module Series EC25 Hardware Design About the Document History Revision Date Author Description 1.0 2016-04-01 Woody WU Initial 1. 2. 1.1 2016-09-22 Lyndon LIU/ Frank WANG Updated EC25 series frequency bands in Table 1. Updated transmitting power, supported maximum baud rate of main UART/internal protocols/USB drivers of USB interface, firmware upgrade and temperature range in Table 2. 3. Updated timing of turning on module in Figure 12. 4.
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LTE Standard Module Series EC25 Hardware Design 3. 4. 5. 6. 7. 8. 1. 2. 3. 4. 5. 6. 7. 8. 9. 1.4 2018-03-05 AnniceZHANG/ Lyndon LIU/ Frank WANG 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 1. 2. 3. 1.5 2018-04-20 Kinsey ZHANG 4. 5. EC25_Hardware_Design Added BT interface in Chapter 3.18.2. Updated GNSS performance in Table 24. Updated reference circuit of wireless connectivity interfaces with FC20 module in Figure 29. Updated current consumption of EC25-E module in Table 33.
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LTE Standard Module Series EC25 Hardware Design Table 50. 2.0 2.1 2019-04-30 Nathan LIU/ Frank WANG/ Ward WANG/ Ethan SHAN 1. Added new variants EC25-EU/-EC/-EUX/-MX and related information. 2. Updated functional diagram in Figure 1. 3. Updated star structure of the power supply in Figure 8. 4. Updated power-on scenario of module in Figure 12. 5. Updated reference circuit with translator chip in Figure 20. 6.
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LTE Standard Module Series EC25 Hardware Design 3. 4. 5. 6. 7. 8. 2.2 2019-08-19 EC25_Hardware_Design Ward WANG/ Owen WEI/ Frank WANG modules. Updated supported protocols and USB serial drivers in Table 2. Updated reference circuit of wireless connectivity interfaces with FC20 module in Figure 26. Added EC25-AFX current consumption in Table 41. Added EC25-AFX conducted RF receiving sensitivity in Table 56. Updated mechanical dimensions of the module in Figure 45.
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LTE Standard Module Series EC25 Hardware Design Contents About the Document ................................................................................................................................ 2 Contents .................................................................................................................................................... 6 Table Index ....................................................................................................................................
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LTE Standard Module Series EC25 Hardware Design 3.13. SD Card Interface ................................................................................................................. 56 3.14. Wireless Connectivity Interfaces ........................................................................................... 58 3.14.1. WLAN Interface ........................................................................................................... 61 3.14.2. BT Interface* ................................
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LTE Standard Module Series EC25 Hardware Design 9 Appendix A References ................................................................................................................ 124 10 Appendix B GPRS Coding Schemes ........................................................................................... 128 11 Appendix C GPRS Multi-slot Classes .......................................................................................... 129 12 Appendix D EDGE Modulation and Coding Schemes ........
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LTE Standard Module Series EC25 Hardware Design Table Index TABLE 1: FREQUENCY BANDS OF EC25 SERIES MODULE ....................................................................... 16 TABLE 2: KEY FEATURES OF EC25 MODULE .............................................................................................. 17 TABLE 3: I/O PARAMETERS DEFINITION ...................................................................................................... 24 TABLE 4: PIN DESCRIPTION ............................
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LTE Standard Module Series EC25 Hardware Design TABLE 42: EC25-EU CURRENT CONSUMPTION .......................................................................................... 94 TABLE 43: EC25-EC CURRENT CONSUMPTION .......................................................................................... 96 TABLE 44: EC25-EUX CURRENT CONSUMPTION ........................................................................................ 98 TABLE 45: EC25-MX CURRENT CONSUMPTION ..............................
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LTE Standard Module Series EC25 Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 21 FIGURE 2: PIN ASSIGNMENT (TOP VIEW) .................................................................................................... 23 FIGURE 3: SLEEP MODE APPLICATION VIA UART ......................................................................................
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LTE Standard Module Series EC25 Hardware Design FIGURE 38: REFERENCE CIRCUIT OF GNSS ANTENNA............................................................................. 76 FIGURE 39: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ............................................... 78 FIGURE 40: MECHANICALS OF U.FL-LP CONNECTORS ............................................................................. 78 FIGURE 41: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ..............................................
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LTE Standard Module Series EC25 Hardware Design 1 Introduction This document defines EC25 module and describes its air interface and hardware interfaces which are connected with customers’ applications. This document can help customers quickly understand module interface specifications, electrical and mechanical details, as well as other related information of EC25 module. To facilitate its application in different fields, relevant reference design is also provided for customers’ reference.
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LTE Standard Module Series EC25 Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating EC25 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product.
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LTE Standard Module Series EC25 Hardware Design In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc.
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LTE Standard Module Series EC25 Hardware Design 2 Product Concept 2.1. General Description EC25 is a series of LTE-FDD/LTE-TDD/WCDMA/GSM wireless communication module with receive diversity. It provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks. It also provides GNSS1) and voice functionality2) for customers’ specific applications.
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LTE Standard Module Series EC25 Hardware Design EC25-AFX4) FDD: B2/B4//B5/B12/B13/ B14/B66/B71 B2/B4/B5 N Y EC25-EU FDD: B1/B3/B7/B8/B20/ B28A TDD: B38/B40/B41 B1/B8 900/1800MHz Y FDD: B1/B3/B7/B8/B20/ B28A TDD: B38/B40/B41 B1/B8 900/1800MHz Y EC25-AUTL FDD: B3/B7/B28 N N Y N EC25-EC FDD: B1/B3/B7/B8/B20/ B28A B1/B8 900/1800MHz Y N EC25-MX4) FDD: B2/B4//B5/B7/B28/ B66 B2/B4/B5 N Y N EC25-EUX 4) NOTES 1. 1) 2. 2) 3. 4. 5. GNSS function is optional.
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LTE Standard Module Series EC25 Hardware Design Transmitting Power Class 4 (33dBm±2dB) for GSM850 Class 4 (33dBm±2dB) for EGSM900 Class 1 (30dBm±2dB) for DCS1800 Class 1 (30dBm±2dB) for PCS1900 Class E2 (27dBm±3dB) for GSM850 8-PSK Class E2 (27dBm±3dB) for EGSM900 8-PSK Class E2 (26dBm±3dB) for DCS1800 8-PSK Class E2 (26dBm±3dB) for PCS1900 8-PSK Class 3 (24dBm+1/-3dB) for WCDMA bands Class 3 (23dBm±2dB) for LTE-FDD bands Class 3 (23dBm±2dB) for LTE-TDD bands LTE Features Support up to non-CA Cat 4 FDD
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LTE Standard Module Series EC25 Hardware Design Audio Features Support one digital audio interface: PCM interface GSM: HR/FR/EFR/AMR/AMR-WB WCDMA: AMR/AMR-WB LTE: AMR/AMR-WB Support echo cancellation and noise suppression PCM Interface Used for audio function with external codec Support 16-bit linear data format Support long frame synchronization and short frame synchronization Support master and slave modes, but must be the master in long frame synchronization USB Interface UART Interfaces Compliant
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LTE Standard Module Series EC25 Hardware Design Firmware Upgrade USB interface or DFOTA* RoHS All hardware components are fully compliant with EU RoHS directive NOTES 1. 2. 3. 1) SD card, wireless connectivity and SGMII interfaces are not supported on ThreadX modules. Within operation temperature range, the module is 3GPP compliant.
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LTE Standard Module Series EC25 Hardware Design SAW ANT_MAIN ANT_GNSS ANT_DIV PAM SAW Switch Duplex LNA SAW VBAT_RF APT PA PRx DRx Tx NAND DDR2 SDRAM Transceiver IQ VBAT_BB PMIC Control Control PWRKEY Baseband RESET_N ADCs 19.2M XO STATUS VDD_EXT USB (U)SIM PCM I2C UARTs SGMII WLAN BT GPIOs SD Figure 1: Functional Diagram 2.4.
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LTE Standard Module Series EC25 Hardware Design 3 Application Interfaces 3.1. General Description EC25 is equipped with 80 LCC pads plus 64 LGA pads that can be connected to cellular application platform. The subsequent chapters will provide detailed descriptions of the following functions/pins/ interfaces.
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LTE Standard Module Series EC25 Hardware Design 3.2. Pin Assignment The following figure shows the pin assignment of EC25 module.
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LTE Standard Module Series EC25 Hardware Design 5. 6. 7. 8. 9. Pins 119~126 and 128 are used for SGMII interface. Pins 24~27 for PCM function are multiplexing pins used for audio design on EC25 module and BT function on FC20 module. SD card, wireless connectivity and SGMII interfaces (pins 37~40, 118, 127, 129~139, 119~126, 128, 23, 28~34) are not supported on ThreadX modules. Keep all RESERVED pins and unused pins unconnected. GND pins 85~112 should be connected to ground in the design.
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LTE Standard Module Series EC25 Hardware Design VBAT_RF 57, 58 VDD_EXT 7 GND 8, 9, 19, 22, 36, 46, 48, 50~54, 56, 72, 85~112 PI PO Power supply for module’s RF part Provide 1.8V for external circuit Vmax=4.3V Vmin=3.3V Vnorm=3.8V It must be provided with sufficient current up to 1.8A in a burst transmission. Vnorm=1.8V IOmax=50mA Power supply for external GPIO’s pull-up circuits. If unused, keep it open. Ground Power-on/off Pin Name PWRKEY RESET_N Pin No.
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LTE Standard Module Series EC25 Hardware Design USB_VBUS USB_DP USB_DM 71 69 70 USB power supply, used for USB detection Vmax=5.25V Vmin=3.0V Vnorm=5.0V Typical: 5.0V If unused, keep it open. USB differential data bus (+) Compliant with USB 2.0 standard specification. Require differential impedance of 90Ω. If unused, keep it open. IO USB differential data bus (-) Compliant with USB 2.0 standard specification. Require differential impedance of 90Ω. If unused, keep it open.
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LTE Standard Module Series EC25 Hardware Design For 3.0V (U)SIM: VOLmax=0.45V VOHmin=2.55V USIM_RST 17 DO Reset signal of (U)SIM card For 1.8V (U)SIM: VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM: VOLmax=0.45V VOHmin=2.55V Main UART Interface Pin Name RI DCD CTS RTS DTR TXD RXD Pin No. 62 63 64 65 66 67 68 I/O Description DC Characteristics Comment DO Ring indicator VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. DO Data carrier detection VOLmax=0.
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LTE Standard Module Series EC25 Hardware Design DBG_TXD DBG_RXD 12 11 Transmit data VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. DI Receive data VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. I/O Description DC Characteristics Comment AI General purpose analog to digital converter Voltage range: 0.3V to VBAT_BB If unused, keep it open. AI General purpose analog to digital converter Voltage range: 0.
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LTE Standard Module Series EC25 Hardware Design Pin Name I2C_SCL I2C_SDA Pin No. 41 42 I/O Description DC Characteristics Comment I2C serial clock. Used for external codec. An external pull-up resistor is required. 1.8V only. If unused, keep it open. OD I2C serial data. Used for external codec. An external pull-up resistor is required. 1.8V only. If unused, keep it open. I/O Description OD SD Card Interface Pin Name SDC2_ DATA3 SDC2_ DATA2 Pin No.
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LTE Standard Module Series EC25 Hardware Design VIHmax=3.34V SDC2_ DATA1 SDC2_ DATA0 SDC2_CLK SDC2_CMD 30 31 32 33 EC25_Hardware_Design IO IO DO IO SD card SDIO bus DATA1 SD card SDIO bus DATA0 SD card SDIO bus clock SD card SDIO bus command 1.8V signaling: VOLmax=0.45V VOHmin=1.4V VILmin=-0.3V VILmax=0.58V VIHmin=1.27V VIHmax=2.0V 3.0V signaling: VOLmax=0.38V VOHmin=2.01V VILmin=-0.3V VILmax=0.76V VIHmin=1.72V VIHmax=3.34V 1.8V signaling: VOLmax=0.45V VOHmin=1.4V VILmin=-0.3V VILmax=0.
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LTE Standard Module Series EC25 Hardware Design VILmax=0.58V VIHmin=1.27V VIHmax=2.0V SD 3.0 protocol for more details. If unused, keep it open. 3.0V signaling: VOLmax=0.38V VOHmin=2.01V VILmin=-0.3V VILmax=0.76V VIHmin=1.72V VIHmax=3.34V SD_INS_ DET VDD_SDIO 23 34 DI SD card insertion detect VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. PO SD card SDIO bus pull-up power IOmax=50mA 1.8V/2.85V configurable. Cannot be used for SD card power.
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LTE Standard Module Series EC25 Hardware Design VOHmin=2.14V VILmax=0.71V VIHmin=1.78V SGMII_ MCLK USIM2_VDD 122 128 SGMII_TX_M 123 SGMII_TX_P 124 SGMII_RX_P 125 SGMII_RX_M 126 DO PO AO AO AI AI SGMII MDIO (Management Data Input/Output) clock For 1.8V: VOLmax=0.45V VOHmin=1.4V For 2.85V: VOLmax=0.35V VOHmin=2.14V 1.8V/2.85V power domain. If unused, keep it open. SGMII MDIO pull-up power source Configurable power source. 1.8V/2.85V power domain. External pull-up for SGMII MDIO pins.
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LTE Standard Module Series EC25 Hardware Design SDC1_ DATA3 SDC1_ DATA2 SDC1_ DATA1 SDC1_ DATA0 SDC1_CLK SDC1_CMD 129 130 131 132 133 134 PM_ENABLE 127 WAKE_ON_ WIRELESS WLAN_EN 135 136 EC25_Hardware_Design WLAN SDIO data bus D3 VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. WLAN SDIO data bus D2 VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open.
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LTE Standard Module Series EC25 Hardware Design COEX_UART 137 _RX DI LTE/WLAN&BT coexistence signal COEX_UART 138 _TX DO LTE/WLAN&BT coexistence signal WLAN_SLP_ 118 CLK DO WLAN sleep clock BT_RTS BT_TXD BT_RXD BT_CTS BT_EN 37 38 39 VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. Cannot be pulled up before startup. If unused, keep it open. VOLmax=0.45V VOHmin=1.35V 1.8V power domain. Cannot be pulled up before startup. If unused, keep it open.
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LTE Standard Module Series EC25 Hardware Design Other Interface Pins Pin Name WAKEUP_IN W_DISABLE# AP_READY Pin No. 1 4 2 I/O DI Description Sleep mode control DC Characteristics Comment VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. Cannot be pulled up before startup. Low level wakes up the module. If unused, keep it open. 1.8V power domain. Pull-up by default. At low voltage level, module can enter airplane mode. If unused, keep it open.
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LTE Standard Module Series EC25 Hardware Design NOTES 1. 1) PCM interface pins are multiplexing pins used for audio design on EC25 module and BT function on FC20 module. 2. SD card, wireless connectivity and SGMII interfaces pins are not supported on ThreadX modules. 3. BT function is under development. 3.4. Operating Modes The table below briefly summarizes the various operating modes referred in the following chapters.
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LTE Standard Module Series EC25 Hardware Design 3.5.1.1. UART Application If the host communicates with module via UART interface, the following preconditions can let the module enter sleep mode.   Execute AT+QSCLK=1 command to enable sleep mode. Drive DTR to high level. The following figure shows the connection between the module and the host. Figure 3: Sleep Mode Application via UART    Driving the host DTR to low level will wake up the module.
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LTE Standard Module Series EC25 Hardware Design Figure 4: Sleep Mode Application with USB Remote Wakeup Sending data to EC25 via USB will wake up the module.  When EC25 has a URC to report, the module will send remote wake-up signals via USB bus so as to wake up the host. 3.5.1.3. USB Application with USB Suspend/Resume and RI Function If the host supports USB suspend and resume, but does not support remote wake-up function, the RI signal is needed to wake up the host.
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LTE Standard Module Series EC25 Hardware Design   Sending data to EC25 via USB will wake up the module. When EC25 has a URC to report, RI signal will wake up the host. 3.5.1.4. USB Application without USB Suspend Function If the host does not support USB suspend function, USB_VBUS should be disconnected via an additional control circuit to let the module enter sleep mode.    Execute AT+QSCLK=1 command to enable sleep mode. Ensure the DTR is held at high level or keep it open. Disconnect USB_VBUS.
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LTE Standard Module Series EC25 Hardware Design Hardware: The W_DISABLE# pin is pulled up by default. Driving it to low level will let the module enter airplane mode. Software: AT+CFUN command provides the choice of the functionality level through setting into 0, 1 or 4.  AT+CFUN=0: Minimum functionality mode. Both (U)SIM and RF functions are disabled.  AT+CFUN=1: Full functionality mode (by default).  AT+CFUN=4: Airplane mode. RF function is disabled. NOTES 1.
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LTE Standard Module Series EC25 Hardware Design 3.6.2. Decrease Voltage Drop The power supply range of the module is from 3.3V to 4.3V. Please make sure that the input voltage will never drop below 3.3V. The following figure shows the voltage drop during burst transmission in 2G network. The voltage drop will be less in 3G and 4G networks. Figure 7: Power Supply Limits during Burst Transmission To decrease voltage drop, a bypass capacitor of about 100µF with low ESR (ESR=0.
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LTE Standard Module Series EC25 Hardware Design 3.6.3. Reference Design for Power Supply Power design for the module is very important, as the performance of the module largely depends on the power source. The power supply should be able to provide sufficient current up to 2.0A at least. If the voltage drop between the input and output is not too high, it is suggested that an LDO should be used to supply power for the module.
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LTE Standard Module Series EC25 Hardware Design 3.7. Power-on/off Scenarios 3.7.1. Turn on Module Using the PWRKEY The following table shows the pin definition of PWRKEY. Table 7: Pin Definition of PWRKEY Pin Name PWRKEY Pin No. 21 I/O Description Comment DI Turn on/off the module The output voltage is 0.8V because of the diode drop in the Qualcomm chipset. When EC25 is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to a low level for at least 500ms.
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LTE Standard Module Series EC25 Hardware Design Figure 11: Turn on the Module by Using Keystroke The power-on scenario is illustrated in the following figure. NOTE 1 VBA T ≥500ms VH=0.8V PWRKEY VIL≤0.5V Abo ut 100ms VDD_EXT ≥100ms. Afte r this time, the BOOT_CONFIG pins ca n b e set to high level by external circuit. BOO T_CONFIG & USB_BOO T Pin s RESET_N ≥2.
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LTE Standard Module Series EC25 Hardware Design NOTES 1. Please make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the time between powering up VBAT and pulling down PWRKEY pin is no less than 30ms. 2. PWRKEY can be pulled down directly to GND with a recommended 10KΩ resistor if module needs to be powered on automatically and shutdown is not needed. 3.7.2.
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LTE Standard Module Series EC25 Hardware Design NOTES 1. In order to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shut down by PWRKEY or AT command, then the power supply can be cut off. 2. When turning off module with AT command, please keep PWRKEY at high level after the execution of power-off command. Otherwise the module will be turned on again after successfully turn-off. 3.8.
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LTE Standard Module Series EC25 Hardware Design Figure 15: Reference Circuit of RESET_N by Using Button The reset scenario is illustrated in the following figure. Figure 16: Timing of Resetting Module NOTES 1. 2. Use RESET_N only when failed to turn off the module by AT+QPOWD command and PWRKEY pin. Ensure that there is no large capacitance on PWRKEY and RESET_N pins. 3.9. (U)SIM Interface The (U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8V and 3.
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LTE Standard Module Series EC25 Hardware Design Table 9: Pin Definition of (U)SIM Interface Pin Name Pin No. I/O Description Comment USIM_VDD 14 PO Power supply for (U)SIM card Either 1.8V or 3.0V is supported by the module automatically. USIM_DATA 15 IO Data signal of (U)SIM card USIM_CLK 16 DO Clock signal of (U)SIM card USIM_RST 17 DO Reset signal of (U)SIM card USIM_ PRESENCE 13 DI (U)SIM card insertion detection USIM_GND 10 1.8V power domain. If unused, keep it open.
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LTE Standard Module Series EC25 Hardware Design Figure 18: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector In order to enhance the reliability and availability of the (U)SIM card in customers’ applications, please follow the criteria below in (U)SIM circuit design:       Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace length as less than 200mm as possible. Keep (U)SIM card signals away from RF and VBAT traces.
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LTE Standard Module Series EC25 Hardware Design 3.10. USB Interface EC25 contains one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports high-speed (480Mbps) and full-speed (12Mbps) modes. The USB interface can only serves as a slave device and is used for AT command communication, data transmission, GNSS NMEA sentences output, software debugging, firmware upgrade and voice over USB. The following table shows the pin definition of USB interface.
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LTE Standard Module Series EC25 Hardware Design A common mode choke L1 is recommended to be added in series between the module and customer’s MCU in order to suppress EMI spurious transmission. Meanwhile, the 0Ω resistors (R3 and R4) should be added in series between the module and the test points so as to facilitate debugging, and the resistors are not mounted by default.
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LTE Standard Module Series EC25 Hardware Design RTS 65 DI Request to send DTR 66 DI Data terminal ready, sleep mode control TXD 67 DO Transmit data RXD 68 DI Receive data Table 12: Pin Definition of Debug UART Interface Pin Name Pin No. I/O Description DBG_TXD 12 DO Transmit data DBG_RXD 11 DI Receive data Comment 1.8V power domain The logic levels are described in the following table. Table 13: Logic Levels of Digital I/O Parameter Min. Max. Unit VIL -0.3 0.
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LTE Standard Module Series EC25 Hardware Design VDD_EXT VCCA 120K VCCB 10K 0.1uF 0.1uF VDD_MCU OE GND RI A1 B1 RI_MCU DCD A2 B2 DCD_MCU B3 CTS_MCU Translator CTS A3 RTS A4 B4 RTS_MCU DTR A5 B5 DTR_MCU TXD A6 B6 TXD_MCU RXD A7 B7 A8 B8 51K 51K RXD_MCU Figure 20: Reference Circuit with Translator Chip Please visit http://www.ti.com for more information. Another example with transistor translation circuit is shown as below.
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LTE Standard Module Series EC25 Hardware Design 3.12. PCM and I2C Interfaces EC25 provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the following modes and one I2C interface:   Primary mode (short frame synchronization, works as both master and slave) Auxiliary mode (long frame synchronization, works as master only) In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge.
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LTE Standard Module Series EC25 Hardware Design Figure 23: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design. Table 14: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Description Comment PCM_IN 24 DI PCM data input 1.8V power domain PCM_OUT 25 DO PCM data output 1.8V power domain PCM_SYNC 26 IO PCM data frame synchronization signal 1.
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LTE Standard Module Series EC25 Hardware Design Figure 24: Reference Circuit of PCM Application with Audio Codec NOTES 1. 2. It is recommended to reserve an RC (R=22Ω, C=22pF) circuits on the PCM lines, especially for PCM_CLK. EC25 works as a master device pertaining to I2C interface. 3.13. SD Card Interface EC25 supports SDIO 3.0 interface for SD card. The following table shows the pin definition of SD card interface. Table 15: Pin Definition of SD Card Interface Pin Name Pin No.
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LTE Standard Module Series EC25 Hardware Design SDC2_CMD 33 IO SD card SDIO bus command VDD_SDIO 34 PO SD card SDIO bus pull up power 1.8V/2.85V configurable. Cannot be used for SD card power. If unused, keep it open. SD_INS_DET 23 DI SD card insertion detection 1.8V power domain. If unused, keep it open. The following figure shows a reference design of SD card.
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LTE Standard Module Series EC25 Hardware Design    It is important to route the SDIO signal traces with total grounding. The impedance of SDIO data trace is 50Ω (±10%). Make sure the adjacent trace spacing is two times of the trace width and the load capacitance of SDIO bus should be less than 15pF. It is recommended to keep the trace length difference between CLK and DATA/CMD less than 1mm and the total routing length less than 50mm.
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LTE Standard Module Series EC25 Hardware Design PM_ENABLE 127 DO WLAN power control 1.8V power domain Active high. WAKE_ON_ WIRELESS 135 DI Wake up the host (EC25 module) by FC20 module 1.8V power domain LTE/WLAN&BT coexistence signal 1.8V power domain. Cannot be pulled up before startup. 1.8V power domain. Cannot be pulled up before startup.
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LTE Standard Module Series EC25 Hardware Design Module FC20 Module PM_ENABL E DCDC/LDO VDD_3V3 POWER VDD_EXT SDC1_DATA3 SDIO_D3 SDC1_DATA2 SDIO_D2 SDC1_DATA1 SDIO_D1 SDC1_DATA0 WLAN SDIO_CLK SDC1_CMD SDIO_CMD WLAN_EN WLAN_EN WLAN_SLP_CLK 32KHZ_IN WAKE_ON_WIREL ESS COEX_UART_RX LTE_UART_TXD COEX_UART_TX LTE_UART_RXD BT_EN BT_RTS Bluetooth SDIO_D0 SDC1_CLK WAKE_ON_WIREL ESS COEX VIO BT_EN BT_UART_RTS BT_CTS BT_UART_CTS BT_TXD BT_UART_RXD BT_RXD BT_UART_TXD PCM_IN PCM_OU
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LTE Standard Module Series EC25 Hardware Design 3.14.1. WLAN Interface EC25 provides a low-power SDIO 3.0 interface and control interface for WLAN design. SDIO interface supports SDR mode (up to 50MHz). As SDIO signals are very high-speed, in order to ensure the SDIO interface design corresponds with the SDIO 3.0 specification, please comply with the following principles:      It is important to route the SDIO signal traces with total grounding. The impedance of SDIO signal trace is 50Ω±10%.
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LTE Standard Module Series EC25 Hardware Design Table 17: Pin Definition of ADC Interfaces Pin Name Pin No. Description ADC0 45 General purpose analog to digital converter ADC1 44 General purpose analog to digital converter The following table describes the characteristic of ADC function. Table 18: Characteristic of ADC Parameter Min. ADC0 Voltage Range ADC1 Voltage Range ADC Resolution Typ. Max. Unit 0.3 VBAT_BB V 0.3 VBAT_BB V 15 bits NOTES 1. 2. 3.
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LTE Standard Module Series EC25 Hardware Design Table 19: Pin Definition of SGMII Interface Pin Name Pin No. I/O Description Comment EPHY_RST_N 119 DO Ethernet PHY reset 1.8V/2.85V power domain EPHY_INT_N 120 DI Ethernet PHY interrupt 1.8V power domain SGMII_MDATA 121 IO SGMII MDIO (Management Data Input/Output) data 1.8V/2.85V power domain SGMII_MCLK DO SGMII MDIO (Management Data Input/Output) clock 1.8V/2.
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LTE Standard Module Series EC25 Hardware Design Figure 28: Reference Circuit of SGMII Interface with PHY AR8033 Application In order to enhance the reliability and availability in customers’ applications, please follow the criteria below in the Ethernet PHY circuit design:     Keep SGMII data and control signals away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DC-DC signals, etc.
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LTE Standard Module Series EC25 Hardware Design Table 20: Pin Definition of Network Connection Status/Activity Indicator Pin Name Pin No. I/O Description Comment 1.8V power domain Cannot be pulled up before startup 1.
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LTE Standard Module Series EC25 Hardware Design 3.18. STATUS The STATUS pin is an open drain output for indicating the module’s operation status. It can be connected to a GPIO of DTE with a pull-up resistor, or as LED indication circuit as below. When the module is turned on normally, the STATUS will present the low state. Otherwise, the STATUS will present high-impedance state. Table 22: Pin Definition of STATUS Pin Name STATUS Pin No.
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LTE Standard Module Series EC25 Hardware Design NOTE URC can be outputted from UART port, USB AT port and USB modem port through configuration via AT+QURCCFG command. The default port is USB AT port. In addition, RI behavior can be configured flexibly. The default behaviors of the RI is shown as below. Table 23: Behaviors of RI State Response Idle RI keeps at high level URC RI outputs 120ms low pulse when a new URC returns The RI behavior can be changed by AT+QCFG="urc/ri/ring" command.
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LTE Standard Module Series EC25 Hardware Design Module VDD_EXT Test point USB_BOOT 4.7K Close to test point TVS Figure 31: Reference Circuit of USB_BOOT Interface NOTE 1 VBAT ≥500ms VH=0.8V PWRKEY VIL≤0.5V About 100ms VDD_EXT USB_BOOT can be pul led up to 1.8V before VDD_EXT Is powered up, and the module will enter emerge ncy download mode wh en i t is powered on. USB_BOOT RESET_N Figure 32: Timing Sequence for Entering Emergency Download Mode NOTES 1. 2.
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LTE Standard Module Series EC25 Hardware Design 4 GNSS Receiver 4.1. General Description EC25 includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS). EC25 supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default. By default, EC25 GNSS engine is switched off. It has to be switched on via AT command.
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LTE Standard Module Series EC25 Hardware Design Hot start @open sky Accuracy (GNSS) CEP-50 Autonomous 2.5 s XTRA enabled 1.8 s Autonomous @open sky <2.5 m NOTES 1. 2. 3. Tracking sensitivity: the lowest GNSS signal value at the antenna port on which the module can keep on positioning for 3 minutes. Reacquisition sensitivity: the lowest GNSS signal value at the antenna port on which the module can fix position again within 3 minutes after loss of lock.
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LTE Standard Module Series EC25 Hardware Design 5 Antenna Interfaces EC25 antenna interfaces include a main antenna interface, an Rx-diversity antenna interface which is used to resist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna interface. The antenna ports have an impedance of 50Ω. 5.1. Main/Rx-diversity Antenna Interfaces 5.1.1. Pin Definition The pin definition of main antenna and Rx-diversity antenna interfaces is shown below.
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LTE Standard Module Series EC25 Hardware Design WCDMA B2 1850~1910 1930~1990 MHz WCDMA B4 1710~1755 2110~2155 MHz WCDMA B5 824~849 869~894 MHz WCDMA B6 830~840 875~885 MHz WCDMA B8 880~915 925~960 MHz WCDMA B19 830~845 875~890 MHz LTE-FDD B1 1920~1980 2110~2170 MHz LTE-FDD B2 1850~1910 1930~1990 MHz LTE-FDD B3 1710~1785 1805~1880 MHz LTE-FDD B4 1710~1755 2110~2155 MHz LTE-FDD B5 824~849 869~894 MHz LTE-FDD B7 2500~2570 2620~2690 MHz LTE-FDD B8 880~915 925~9
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LTE Standard Module Series EC25 Hardware Design LTE-FDD B71 663~698 617~652 MHz 5.1.3. Reference Design of RF Antenna Interface A reference design of ANT_MAIN and ANT_DIV antenna pads is shown as below. A π-type matching circuit should be reserved for better RF performance. The capacitors are not mounted by default. Figure 33: Reference Circuit of RF Antenna Interface NOTES 1. Keep a proper distance between the main antenna and the Rx-diversity antenna to improve the receiving sensitivity. 2.
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LTE Standard Module Series EC25 Hardware Design .
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LTE Standard Module Series EC25 Hardware Design Figure 37: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design:      Please use an impedance simulation tool to control the characteristic impedance of RF traces as 50Ω. The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground.
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LTE Standard Module Series EC25 Hardware Design Table 29: GNSS Frequency Type Frequency Unit GPS 1575.42±1.023 MHz GLONASS 1597.5~1605.8 MHz Galileo 1575.42±2.046 MHz BeiDou 1561.098±2.046 MHz QZSS 1575.42 MHz A reference design of GNSS antenna is shown as below. Figure 38: Reference Circuit of GNSS Antenna NOTES 1. 2. An external LDO can be selected to supply power according to the active antenna requirement.
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LTE Standard Module Series EC25 Hardware Design 5.3. Antenna Installation 5.3.1. Antenna Requirement The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Table 30: Antenna Requirements Type Requirements GNSS1) Frequency range: 1559MHz~1609MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive antenna gain: > 0dBi Active antenna noise figure: < 1.
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LTE Standard Module Series EC25 Hardware Design 5.3.2. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. Figure 39: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 40: Mechanicals of U.
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LTE Standard Module Series EC25 Hardware Design The following figure describes the space factor of mated connector. Figure 41: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://www.hirose.com.
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LTE Standard Module Series EC25 Hardware Design 6 Electrical, Reliability and Radio Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 31: Absolute Maximum Ratings Parameter Min. Max. Unit VBAT_RF/VBAT_BB -0.3 4.7 V USB_VBUS -0.3 5.5 V Peak Current of VBAT_BB 0 0.8 A Peak Current of VBAT_RF 0 1.8 A Voltage at Digital Pins -0.3 2.
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LTE Standard Module Series EC25 Hardware Design 6.2. Power Supply Ratings Table 32: Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT_BB and VBAT_RF The actual input voltages must be kept between the minimum and maximum values. 3.3 3.8 4.3 V Voltage drop during burst transmission Maximum power control level on EGSM900. 400 mV IVBAT Peak supply current (during transmission slot) Maximum power control level on EGSM900. 1.8 2.
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LTE Standard Module Series EC25 Hardware Design 3. and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to the normal operation temperature levels, the module will meet 3GPP specifications again. “*” means under development. 6.4. Current Consumption The values of current consumption are shown below. Table 34: EC25-E Current Consumption Parameter Description Conditions Typ.
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LTE Standard Module Series EC25 Hardware Design GPRS data transfer (GNSS OFF) EDGE data transfer (GNSS OFF) WCDMA data transfer (GNSS OFF) LTE data EC25_Hardware_Design LTE-TDD PF=64 (USB disconnected) 20.8 mA LTE-TDD PF=64 (USB connected) 32.0 mA EGSM900 4DL/1UL @33.22dBm 271.0 mA EGSM900 3DL/2UL @33.0dBm 464.0 mA EGSM900 2DL/3UL @30.86dBm 524.0 mA EGSM900 1DL/4UL @29.58dBm 600.0 mA DCS1800 4DL/1UL @29.92dBm 192.0 mA DCS1800 3DL/2UL @29.84dBm 311.0 mA DCS1800 2DL/3UL @29.
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LTE Standard Module Series EC25 Hardware Design transfer (GNSS OFF) GSM voice call WCDMA voice call LTE-FDD B3 @23.54dBm 774.0 mA LTE-FDD B5 @22.83dBm 762.0 mA LTE-FDD B7 @23.37dBm 842.0 mA LTE-FDD B8 @23.48dBm 720.0 mA LTE-FDD B20 @22.75dBm 714.0 mA LTE-TDD B38 @23.05dBm 481.0 mA LTE-TDD B40 @23.17dBm 431.8 mA LTE-TDD B41 @23.02dBm 480.0 mA EGSM900 PCL=5 @33.08dBm 264.0 mA DCS1800 PCL=0 @29.75dBm 190.0 mA WCDMA B1 @23.22dBm 680.0 mA WCDMA B5 @23.18dBm 677.
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LTE Standard Module Series EC25 Hardware Design WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) WCDMA voice call LTE-FDD PF=64 (USB connected) 31.0 mA WCDMA B2 HSDPA @21.9dBm 591.0 mA WCDMA B2 HSUPA @21.62dBm 606.0 mA WCDMA B4 HSDPA @22.02dBm 524.0 mA WCDMA B4 HSUPA @21.67dBm 540.0 mA WCDMA B5 HSDPA @22.71dBm 490.0 mA WCDMA B5 HSUPA @22.58dBm 520.0 mA LTE-FDD B2 @22.93dBm 715.0 mA LTE-FDD B4 @22.96dBm 738.0 mA LTE-FDD B12 @23.35dBm 663.0 mA WCDMA B2 @22.
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LTE Standard Module Series EC25 Hardware Design Table 37: EC25-J Current Consumption Parameter Description Sleep state Conditions Typ. Unit AT+CFUN=0 (USB disconnected) 2.9 mA WCDMA PF=64 (USB disconnected) 4.0 mA WCDMA PF=128 (USB disconnected) 3.5 mA LTE-FDD PF=64 (USB disconnected) 4.8 mA LTE-FDD PF=128 (USB disconnected) 4.0 mA LTE-TDD PF=64 (USB disconnected) 4.9 mA LTE-TDD PF=128 (USB disconnected) 4.1 mA WCDMA PF=64 (USB disconnected) 29.
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LTE Standard Module Series EC25 Hardware Design WCDMA voice call LTE-FDD B8 @23.32dBm 882.3 mA LTE-FDD B18 @23.61dBm 867.0 mA LTE-FDD B19 @23.67dBm 911.4 mA LTE-FDD B26 @22.86dBm 909.6 mA LTE-TDD B41 @22.40dBm 563.4 mA WCDMA B1 @23.23dBm 964.8 mA WCDMA B6 @23.02dBm 667.9 mA WCDMA B8 @23.12dBm 735.4 mA WCDMA B19 @22.99dBm 664.8 mA Table 38: EC25-AU Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 11 uA AT+CFUN=0 1.
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LTE Standard Module Series EC25 Hardware Design EGSM900 DRX=5 (USB disconnected) 22.0 mA EGSM900 DRX=5 (USB connected) 34.0 mA WCDMA PF=64 (USB disconnected) 22.0 mA WCDMA PF=64 (USB connected) 33.0 mA LTE-FDD PF=64 (USB disconnected) 24.0 mA LTE-FDD PF=64 (USB connected) 35.0 mA GSM850 1UL/4DL @32.53dBm 232.0 mA GSM850 2UL/3DL @32.34dBm 384.0 mA GSM850 3UL/2DL @30.28dBm 441.0 mA GSM850 4UL/1DL @29.09dBm 511.0 mA EGSM900 1UL/4DL @32.34dBm 241.0 mA EGSM900 2UL/3DL @32.
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LTE Standard Module Series EC25 Hardware Design WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) EC25_Hardware_Design GSM850 4UL/1DL @26.53dBm 416.0 mA EGSM900 1UL/4DL @26.64dBm 157.0 mA EGSM900 2UL/3DL @26.95dBm 251.0 mA EGSM900 3UL/2DL @26.57dBm 340.0 mA EGSM900 4UL/1DL @26.39dBm 431.0 mA DCS1800 1UL/4DL @26.03dBm 152.0 mA DCS1800 2UL/3DL @25.62dBm 240.0 mA DCS1800 3UL/2DL @25.42dBm 325.0 mA DCS1800 4UL/1DL @25.21dBm 415.0 mA PCS1900 1UL/4DL @25.65dBm 148.
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LTE Standard Module Series EC25 Hardware Design GSM voice call WCDMA voice call LTE-FDD B5 @23.45dBm 687.0 mA LTE-FDD B7 @22.84dBm 843.0 mA LTE-FDD B8 @22.92dBm 689.0 mA LTE-FDD B28 @23.23dBm 804.0 mA LTE-TDD B40 @23.3dBm 429.0 mA GSM850 PCL5 @32.66dBm 228.0 mA EGSM900 PCL5 @32.59dBm 235.0 mA DCS1800 PCL0 @29.72dBm 178.0 mA PCS1900 PCL0 @29.82dBm 170.0 mA WCDMA B1 @23.27dBm 687.0 mA WCDMA B2 @23.38dBm 668.0 mA WCDMA B5 @23.38dBm 592.0 mA WCDMA B8 @23.32dBm 595.
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LTE Standard Module Series EC25 Hardware Design WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) WCDMA voice call WCDMA B1 HSDPA @22.24dBm 500.0 mA WCDMA B1 HSUPA @22.05dBm 499.0 mA WCDMA B5 HSDPA @22.39dBm 418.0 mA WCDMA B5 HSUPA @22dBm 486.0 mA LTE-FDD B1 @23.28dBm 707.0 mA LTE-FDD B3 @23.36dBm 782.0 mA LTE-FDD B5 @23.32dBm 588.0 mA LTE-FDD B7 @23.08dBm 692.0 mA LTE-FDD B28A @23.37dBm 752.0 mA LTE-FDD B28B @23.48dBm 770.0 mA WCDMA B1 @23.22dBm 546.
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LTE Standard Module Series EC25 Hardware Design WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) WCDMA voice call WCDMA B2 HSDPA @22.63dBm 560.0 mA WCDMA B2 HSUPA @22.49dBm 564.0 mA WCDMA B4 HSDPA @22.45dBm 601.0 mA WCDMA B4 HSUPA @22.57dBm 610.0 mA WCDMA B5 HSDPA @22.49dBm 603.0 mA WCDMA B5 HSUPA @22.43dBm 617.0 mA LTE-FDD B2 @22.92dBm 698.0 mA LTE-FDD B4 @23.12dBm 710.0 mA LTE-FDD B5 @22.98dBm 650.0 mA LTE-FDD B12 @23.42dBm 648.0 mA LTE-FDD B13 @22.92dBm 690.
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LTE Standard Module Series EC25 Hardware Design WCDMA PF=512 (USB disconnected) 1.00 mA LTE-FDD PF=32 (USB disconnected) 2.97 mA LTE-FDD PF=64 (USB disconnected) 1.93 mA LTE-FDD PF=128 (USB disconnected) 1.43 mA LTE-FDD PF=256 (USB disconnected) 1.17 mA WCDMA PF=64 (USB disconnected) 14.9 mA WCDMA PF=64 (USB connected) 34.2 mA LTE-FDD PF=64 (USB disconnected) 15.2 mA LTE-FDD PF=64 (USB connected) 34.8 mA WCDMA B2 HSDPA @22.1dBm 548.0 mA WCDMA B2 HSUPA @22.28dBm 545.
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LTE Standard Module Series EC25 Hardware Design WCDMA B5 @22.6dBm 561.0 mA Table 42: EC25-EU Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 11 uA AT+CFUN=0 (USB disconnected) 1.16 mA GSM DRX=2 (USB disconnected) 2.74 mA GSM DRX=9 (USB disconnected) 2.0 mA WCDMA PF=64 (USB disconnected) 2.15 mA WCDMA PF=128 (USB disconnected) 1.67 mA LTE-FDD PF=64 (USB disconnected) 2.60 mA LTE-FDD PF=128 (USB disconnected) 1.
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LTE Standard Module Series EC25 Hardware Design EDGE data transfer (GNSS OFF) WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) EC25_Hardware_Design EGSM900 1DL/4UL @28.5dBm 522 mA DCS1800 4DL/1UL @30.49dBm 172.0 mA DCS1800 3DL/2UL @29.24dBm 274.0 mA DCS1800 2DL/3UL @27.15dBm 337.0 mA DCS1800 1DL/4UL @25.88dBm 406.0 mA EGSM900 4DL/1UL PCL=8 @26.60dBm 142.0 mA EGSM900 3DL/2UL PCL=8 @25.43dBm 229.0 mA EGSM900 2DL/3UL PCL=8 @23.4dBm 286.0 mA EGSM900 1DL/4UL PCL=8 @22.
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LTE Standard Module Series EC25 Hardware Design GSM voice call WCDMA voice call LTE-TDD B41 @23.46dBm 451.0 mA EGSM900 PCL=5 @33.25dBm 258.0 mA DCS1800 PCL=0 @30.23dBm 178.0 mA WCDMA B1 @23.88dBm 548.0 mA WCDMA B8 @23.8dBm 615.0 mA Table 43: EC25-EC Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 9 uA AT+CFUN=0 (USB disconnected) 1.0 mA GSM DRX=2 (USB disconnected) 2.0 mA GSM DRX=9 (USB disconnected) 1.
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LTE Standard Module Series EC25 Hardware Design EDGE data transfer (GNSS OFF) WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) EGSM900 1DL/4UL @28.84dBm 586.0 mA DCS1800 4DL/1UL @29.46dBm 156.0 mA DCS1800 3DL/2UL @29.41dBm 250.0 mA DCS1800 2DL/3UL @29.37dBm 344.0 mA DCS1800 1DL/4UL @29.28dBm 443.0 mA EGSM900 4DL/1UL PCL=8 @25.21dBm 175.0 mA EGSM900 3DL/2UL PCL=8 @24.80dBm 295.0 mA EGSM900 2DL/3UL PCL=8 @24.74dBm 397.0 mA EGSM900 1DL/4UL PCL=8 @24.38dBm 509.
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LTE Standard Module Series EC25 Hardware Design call WCDMA B8 @23.33dBm 517.0 mA Table 44: EC25-EUX Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 9 uA AT+CFUN=0 (USB disconnected) 0.9 mA GSM DRX=2 (USB disconnected) 1.8 mA GSM DRX=9 (USB disconnected) 1.3 mA WCDMA PF=64 (USB disconnected) 1.6 mA WCDMA PF=128 (USB disconnected) 1.3 mA LTE-FDD PF=64 (USB disconnected) 2.2 mA LTE-FDD PF=128 (USB disconnected) 1.
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LTE Standard Module Series EC25 Hardware Design EDGE data transfer (GNSS OFF) WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) EC25_Hardware_Design EGSM900 1DL/4UL @29.50dBm 629.3 mA DCS1800 4DL/1UL @29.63dBm 157.4 mA DCS1800 3DL/2UL @28.96dBm 246.3 mA DCS1800 2DL/3UL @27.49dBm 310.6 mA DCS1800 1DL/4UL @26.44dBm 377.7 mA EGSM900 4DL/1UL PCL=8 @27.27dBm 175.4 mA EGSM900 3DL/2UL PCL=8 @26.13dBm 292.1 mA EGSM900 2DL/3UL PCL=8 @24.03dBm 386.8 mA EGSM900 1DL/4UL PCL=8 @23.
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LTE Standard Module Series EC25 Hardware Design GSM voice call WCDMA voice call LTE-TDD B41 @23.17dBm 483.2 mA EGSM900 PCL=5 @32.81dBm 262.2 mA DCS1800 PCL=0 @29.62dBm 151.2 mA WCDMA B1 @23.09dBm 594.2 mA WCDMA B8 @23.18dBm 504.3 mA Table 45: EC25-MX Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 19 uA AT+CFUN=0 (USB disconnected) 1.0 mA WCDMA PF=64 (USB disconnected) 2.3 mA WCDMA PF=128 (USB disconnected) 1.
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LTE Standard Module Series EC25 Hardware Design transfer (GNSS OFF) WCDMA voice call LTE-FDD B4 @23.4dBm 744.0 mA LTE-FDD B5 @23.2dBm 578.0 mA LTE-FDD B7 @24.3dBm 868.0 mA LTE-FDD B28 @23.45dBm 631.0 mA LTE-FDD B66 @22.68dBm 781.0 mA WCDMA B2 @23.47dBm 643.0 mA WCDMA B4 @23.5dBm 633.0 mA WCDMA B5 @23.5dBm 551.0 mA Table 46: EC25-AUX Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 9 uA AT+CFUN=0 (USB disconnected) 0.
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LTE Standard Module Series EC25 Hardware Design transfer (GNSS OFF) EDGE data transfer (GNSS OFF) EC25_Hardware_Design GSM850 3DL/2UL @31.59dBm 384.8 mA GSM850 2DL/3UL @29.51dBm 452.1 mA GSM850 1DL/4UL @28.41dBm 542.1 mA EGSM900 4DL/1UL @33.27dBm 272.7 mA EGSM900 3DL/2UL @31.99dBm 406.9 mA EGSM900 2DL/3UL @29.67dBm 470.2 mA EGSM900 1DL/4UL @28.44dBm 547.1 mA DCS1800 4DL/1UL @29.44dBm 164.5 mA DCS1800 3DL/2UL @28.47dBm 235.7 mA DCS1800 2DL/3UL @26.29dBm 292.
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LTE Standard Module Series EC25 Hardware Design WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) EC25_Hardware_Design DCS1800 2DL/3UL @23.04dBm 316.3 mA DCS1800 1DL/4UL @22.11dBm 411.0 mA PCS1900 4DL/1UL @26.24dBm 143.3 mA PCS1900 3DL/2UL @25.46dBm 231.4 mA PCS1900 2DL/3UL @23.45dBm 316.1 mA PCS1900 1DL/4UL @22.38dBm 411.0 mA WCDMA B1 HSDPA @22.60dBm 534.6 mA WCDMA B1 HSUPA @22.48dBm 541.3 mA WCDMA B2 HSDPA @21.60dBm 572.9 mA WCDMA B2 HSUPA @22.06dBm 560.
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LTE Standard Module Series EC25 Hardware Design GSM voice call WCDMA voice call GSM850 PCL5 @32.36dBm 240.3 mA EGSM900 PCL5 @33.15dBm 260.9 mA DCS1800 PCL0 @29.38dBm 153.0 mA PCS1900 PCL0 @29.47dBm 160.3 mA WCDMA B1 @23.13dBm 568.9 mA WCDMA B2 @22.99dBm 628.4 mA WCDMA B4 @22.90dBm 506.3 mA WCDMA B5 @23.10dBm 507.5 mA WCDMA B8 @22.90dBm 581.
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LTE Standard Module Series EC25 Hardware Design DCS1800/PCS1900 30dBm±2dB 0dBm±5dB GSM850/EGSM900 (8-PSK) 27dBm±3dB 5dBm±5dB DCS1800/PCS1900 (8-PSK) 26dBm±3dB 0dBm±5dB WCDMA bands 24dBm+1/-3dB < -49dBm LTE-FDD bands 23dBm±2dB < -39dBm LTE-TDD bands 23dBm±2dB < -39dBm NOTE In GPRS 4 slots TX mode, the maximum output power is reduced by 3.0dB. The design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. 6.6.
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LTE Standard Module Series EC25 Hardware Design LTE-FDD B8 (10MHz) -97.0dBm -97.0dBm -101.0dBm -93.3dBm LTE-FDD B20 (10MHz) -97.5dBm -99.0dBm -102.5dBm -93.3dBm LTE-TDD B38 (10MHz) -95dBm -97.0dBm -98.9dBm -96.3dBm LTE-TDD B40 (10MHz) -96.3dBm -98.0dBm -101.0dBm -96.3dBm LTE-TDD B41 (10MHz) -94.5dBm -97.0dBm -98.5dBm -94.3dBm Table 50: EC25-A Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B2 -110.0dBm / / -104.7dBm WCDMA B4 -110.
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LTE Standard Module Series EC25 Hardware Design WCDMA B19 -110.5dBm / / -106.7dBm LTE-FDD B1 (10MHz) -97.5dBm -98.7dBm -100.2dBm -96.3dBm LTE-FDD B3 (10MHz) -96.5dBm -97.1dBm -100.5dBm -93.3dBm LTE-FDD B8 (10MHz) -98.4dBm -99.0dBm -101.2dBm -93.3dBm LTE-FDD B18 (10MHz) -99.5dBm -99.0dBm -101.7dBm -96.3dBm LTE-FDD B19 (10MHz) -99.2dBm -99.0dBm -101.4dBm -96.3dBm LTE-FDD B26 (10MHz) -99.5dBm -99.0dBm -101.5dBm -93.8dBm LTE-TDD B41 (10MHz) -95.0dBm -95.7dBm -99.0dBm -94.
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LTE Standard Module Series EC25 Hardware Design LTE-FDD B8 (10MHz) -99.2dBm -98.2dBm -102.2dBm -93.3dBm LTE-FDD B28 (10MHz) -98.6dBm -98.7dBm -102.0dBm -94.8dBm LTE-TDD B40 (10MHz) -97.2dBm -98.4dBm -101.2dBm -96.3dBm Table 54: EC25-AUT Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B1 -110.0dBm / / -106.7dBm WCDMA B5 -110.5dBm / / -104.7dBm LTE-FDD B1 (10MHz) -98.5dBm -98.0dBm -101.0dBm -96.3dBm LTE-FDD B3 (10MHz) -98.0dBm -97.
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LTE Standard Module Series EC25 Hardware Design LTE-FDD B2 (10MHz) -98.0dBm -98.5dBm -100.5dBm -94.3dBm LTE-FDD B4 (10MHz) -97.5dBm -98.2dBm -99.5dBm -96.3dBm LTE-FDD B5 (10MHz) -98.0dBm -98.5dBm -100.5dBm -94.3dBm LTE-FDD B12 (10MHz) -99.0dBm -99.5dBm -100.5dBm -93.3dBm LTE-FDD B13 (10MHz) -98.5dBm -99.5dBm -100.7dBm -93.3dBm LTE-FDD B14 (10MHz) -99.4dBm -99.5dBm -100.9dBm -93.3dBm LTE-FDD B66 (10MHz) -97.5dBm -98.5dBm -99.6dBm -95.8dBm LTE-FDD B71 (10MHz) -98.
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LTE Standard Module Series EC25 Hardware Design Table 58: EC25-EU Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) EGSM900 -108.5dBm / / -102.0dBm DCS1800 -108.5dBm / / -102.0dbm WCDMA B1 -109.5dBm -109.5dBm / -106.7dBm WCDMA B8 -110.0dBm -111.5 dBm / -103.7dBm LTE-FDD B1 (10MHz) -98.5dBm -99.0dBm -101.7dBm -96.3dBm LTE-FDD B3 (10MHz) -98.2dBm -99.8dBm -102dBm -93.3dBm LTE-FDD B7 (10MHz) -96.7dBm -98.5dBm -100.7dBm -94.
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LTE Standard Module Series EC25 Hardware Design LTE-FDD B8 (10MHz) -97.0dBm -97.0dBm -101.0dBm -93.3dBm LTE-FDD B20 (10MHz) -97.5dBm -99.0dBm -101.0dBm -93.3dBm LTE-FDD B28 (10MHz) -98.6dBm -98.7dBm -101.5dBm -94.8dBm Table 60: EC25-EUX Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) EGSM900 -109.0dBm / / -102.0dBm DCS1800 -109.0dBm / / -102.0dbm WCDMA B1 -110.5dBm / / -106.7dBm WCDMA B8 -110.5dBm / / -103.
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LTE Standard Module Series EC25 Hardware Design LTE-FDD B2 (10MHz) -98dBm -99.1dBm -101.5dBm -94.3dBm LTE-FDD B4 (10MHz) -98.5dBm -98.2dBm -101.5dBm -96.3dBm LTE-FDD B5 (10MHz) -99dBm -99.2dBm -102.5dBm -94.3dBm LTE-FDD B7 (10MHz) -97dBm -98.5dBm -101.5dBm -94.3dBm LTE-FDD B28(10MHz) -98dBm -99.3dBm -102dBm -94.8dBm LTE-FDD B66 (10MHz) -98dBm -98.4dBm -101.5dBm -95.
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LTE Standard Module Series EC25 Hardware Design LTE-FDD B28 (10MHz) -98.0dBm -98.7dBm -101.5dBm -94.8dBm LTE-TDD B40 (10MHz) -97.5dBm -98.2dBm -101.2dBm -96.3dBm NOTE 1) SIMO is a smart antenna technology that uses a single antenna at the transmitter side and two antennas at the receiver side, which can improve RX performance. 6.7. Electrostatic Discharge The module is not protected against electrostatics discharge (ESD) in general.
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LTE Standard Module Series EC25 Hardware Design      Do not apply solder mask on the opposite side of the PCB area where the module is mounted, so as to ensure better heat dissipation performance. The reference ground of the area where the module is mounted should be complete, and add ground vias as many as possible for better heat dissipation. Make sure the ground pads of the module and PCB are fully connected.
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LTE Standard Module Series EC25 Hardware Design NOTES 1. 2. The module offers the best performance when the internal BB chip stays below 105°C. When the maximum temperature of the BB chip reaches or exceeds 105°C, the module works normal but provides reduced performance (such as RF output power, data rate, etc.).
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LTE Standard Module Series EC25 Hardware Design 7 Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in mm, and the dimensional tolerances are ±0.05mm unless otherwise specified. 7.1. Mechanical Dimensions of the Module 2.4±0.2 29.0±0.15 32.0±0.15 0.
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LTE Standard Module Series EC25 Hardware Design 32.0＋/-0.15 3.4 1.30 2.0 5.96 1.1 3.85 1.1 3.5 1.90 Pin 1 1.30 2.0 3.0 0.87 3.0 1.8 1.15 2.15 1.8 2.8 4.82 1.05 4.8 1.6 29.0＋/-0.15 2.0 6.8 1.7 2.49 1.9 2.4 3.2 3.4 3.2 3.4 0.8 3.2 3.5 4.37 1.5 3.
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LTE Standard Module Series EC25 Hardware Design 7.2. Recommended Footprint Figure 46: Recommended Footprint (Top View) NOTES 1. 2. The keepout area should not be designed. For easy maintenance of the module, please keep about 3mm between the module and other components in the host PCB.
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LTE Standard Module Series EC25 Hardware Design 7.3. Design Effect Drawings of the Module Figure 47: Top View of the Module Figure 48: Bottom View of the Module NOTE These are renderings of EC25 module. For authentic appearance, please refer to the module that you receive from Quectel.
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LTE Standard Module Series EC25 Hardware Design 8 Storage, Manufacturing and Packaging 8.1. Storage EC25 is stored in a vacuum-sealed bag. It is rated at MSL 3, and its storage restrictions are listed below. 1. Shelf life in vacuum-sealed bag: 12 months at <40ºC/90%RH. 2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other high temperature processes must be:   Mounted within 168 hours at the factory environment of ≤30ºC/60%RH. Stored at <10%RH. 3.
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LTE Standard Module Series EC25 Hardware Design 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be 0.18mm~0.20mm. For more details, please refer to document [4].
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LTE Standard Module Series EC25 Hardware Design Max slope 2~3°C/sec Reflow time (D: over 220°C) 40~60sec Max temperature 238~245°C Cooling down slope 1~4°C/sec Reflow Cycle Max reflow cycle 1 8.3. Packaging .1 ±0 0 5 1. 30.3± 0.15 0.35± 0.05 29.3± 0.15 44.00± 0.3 20.20± 0.15 44.00± 0.1 2.00± 0.1 4.00± 0.1 30.3± 0.15 1.75± 0.1 EC25 is packaged in tap and reel carriers. Each reel is 11.88m long and contains 250pcs modules. The figure below shows the package details, measured in mm. 4.
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LTE Standard Module Series EC25 Hardware Design e p a t r e v o C 48.5 13 100 d e e f f o n o i t c e r i D 44.5+0.20 -0.
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LTE Standard Module Series EC25 Hardware Design 9 Appendix A References Table 65: Related Documents SN Document Name Remark [1] Quectel_EC2x&EGxx_Power_Management_ Application_Note Power management application note for EC25, EC21, EC20 R2.0, EC20 R2.1, EG95, EG91 and EG25-G modules [2] Quectel_EC2x&EG9x&EM05_AT_Commands_ Manual AT commands manual for EC25, EC21, EC20 R2.0, EC20 R2.
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LTE Standard Module Series EC25 Hardware Design CSD Circuit Switched Data CTS Clear To Send DC-HSPA+ Dual-carrier High Speed Packet Access DFOTA Delta Firmware Upgrade Over-The-Air DL Downlink DTR Data Terminal Ready DTX Discontinuous Transmission EFR Enhanced Full Rate ESD Electrostatic Discharge FDD Frequency Division Duplex FR Full Rate GLONASS GLObalnaya NAvigatsionnaya Sputnikovaya Sistema, the Russian Global Navigation Satellite System GMSK Gaussian Minimum Shift Keying GNSS
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LTE Standard Module Series EC25 Hardware Design MIMO Multiple Input Multiple Output MO Mobile Originated MS Mobile Station (GSM engine) MT Mobile Terminated PAP Password Authentication Protocol PCB Printed Circuit Board PDU Protocol Data Unit PPP Point-to-Point Protocol QAM Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying RF Radio Frequency RHCP Right Hand Circularly Polarized Rx Receive SGMII Serial Gigabit Media Independent Interface SIM Subscriber Identific
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LTE Standard Module Series EC25 Hardware Design Vmax Maximum Voltage Value Vnorm Normal Voltage Value Vmin Minimum Voltage Value VIHmax Maximum Input High Level Voltage Value VIHmin Minimum Input High Level Voltage Value VILmax Maximum Input Low Level Voltage Value VILmin Minimum Input Low Level Voltage Value VImax Absolute Maximum Input Voltage Value VImin Absolute Minimum Input Voltage Value VOHmax Maximum Output High Level Voltage Value VOHmin Minimum Output High Level Voltage Value
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LTE Standard Module Series EC25 Hardware Design 10 Appendix B GPRS Coding Schemes Table 67: Description of Different Coding Schemes Scheme CS-1 CS-2 CS-3 CS-4 Code Rate 1/2 2/3 3/4 1 USF 3 3 3 3 Pre-coded USF 3 6 6 12 Radio Block excl.USF and BCS 181 268 312 428 BCS 40 16 16 16 Tail 4 4 4 - Coded Bits 456 588 676 456 Punctured Bits 0 132 220 - Data Rate Kb/s 9.05 13.4 15.6 21.
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LTE Standard Module Series EC25 Hardware Design 11 Appendix C GPRS Multi-slot Classes Thirty-three classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots.
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LTE Standard Module Series EC25 Hardware Design 15 5 5 NA 16 6 6 NA 17 7 7 NA 18 8 8 NA 19 6 2 NA 20 6 3 NA 21 6 4 NA 22 6 4 NA 23 6 6 NA 24 8 2 NA 25 8 3 NA 26 8 4 NA 27 8 4 NA 28 8 6 NA 29 8 8 NA 30 5 1 6 31 5 2 6 32 5 3 6 33 5 4 6 EC25_Hardware_Design 130 / 130
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LTE Standard Module Sires EC25 Hardware Design 12 Appendix D EDGE Modulation and Coding Schemes Table 69: EDGE Modulation and Coding Schemes Coding Scheme Modulation Coding Family 1 Timeslot 2 Timeslot 4 Timeslot CS-1: GMSK / 9.05kbps 18.1kbps 36.2kbps CS-2: GMSK / 13.4kbps 26.8kbps 53.6kbps CS-3: GMSK / 15.6kbps 31.2kbps 62.4kbps CS-4: GMSK / 21.4kbps 42.8kbps 85.6kbps MCS-1 GMSK C 8.80kbps 17.60kbps 35.20kbps MCS-2 GMSK B 11.2kbps 22.4kbps 44.
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1.1. FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met: 1. This Modular Approval is limited to OEM installation for mobile and fixed applications only.
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For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products.
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this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.